Zalman Tech Co. is a South Korean company that develops and provides aftermarket desktop computer products with primary focus on cooling enhancement.Zalman has done considerable product development since its 1999 founding, and now holds several patents focusing on both cooling and fan noise-reduction. Personal computer systems can generate significant heat and noise, the management of which is important for those modifying or assembling computer systems. Zalman's product range includes specialized heat sink and fan solutions for CPUs, as well as quiet power supplies, computer water cooling systems, motherboard chipset coolers, graphics card heat sink and fan combos, laptop coolers, cases, and hard disk cases that lower temperature and reduce noise.Zalman's primary competitors include: Vantec, Thermaltake, Spire, Cooler Master and Arctic.Zalman also developed a completely fanless case. It used a fin based design to dissipate heat with heat generating components like the graphics card and motherboard transferring heat to the case body via a system of heat pipes and radiators.Zalman introduced the CNPS9500AM2, a heatsink was meant specifically for socket AM2 compatibility on May 23, 2006. The company also broke into the headphone market with its 5.1 headphone system, ZM-RS6F/M. Wikipedia.
Zalman Tech and Samsung | Date: 2012-02-14
Disclosed herein is a capacitor module including at least one capacitor, a cooling case accommodating the capacitor, and a cooling unit disposed in the cooling case and cooling a side surface of the capacitor. According to the present invention, cooling efficiency of the capacitor is maximized and fixing force of the capacitor in the cooling case is superior so that product reliability of the capacitor module can be improved.
Zalman Tech | Date: 2013-08-09
A pump for a water cooler is positioned inside or outside an electronic device having heating parts in order to cool heat generated by the heating parts via a circulating refrigerant.
Zalman Tech | Date: 2013-12-11
A water cooling apparatus is disposed outside an electronic apparatus equipped with a heat generating part to cool heat generated from the heat generating part by using a coolant. The water cooling apparatus includes a plurality of hollow tubes through which the coolant receiving the heat of the heat generating part flows to be cooled. Each hollow tube is formed in a shape of a quadratic curve. The water cooling apparatus further includes at least one radiator that includes a plurality of heat dissipation fins coupled to the plurality of hollow tubes and is arranged to be separated from each other along the plurality of hollow tubes.
Zalman Tech | Date: 2014-01-27
A portable accessory for preventing death grip of a hand-held apparatus and improving radio wave transmission and reception of the hand-held apparatus. The portable accessory includes an inductive signal amplifying circuit including: a radio transmission/radio unit that transmits or receives radio waves; a capacitive coupled unit that is capacitively coupled with an antenna mounted in the hand-held apparatus; and an impedance matching unit that connects the radio wave transmission/reception unit and the capacitive coupled unit and transmits radio waves.
Choi J.,Zalman Tech |
Choi J.,Rensselaer Polytechnic Institute |
Sung B.,Zalman Tech |
Kim C.,Sungkyunkwan University |
Borca-Tasciuc D.-A.,Rensselaer Polytechnic Institute
Applied Thermal Engineering | Year: 2013
While miniature loop heat pipes (mLHP) have significant potential for electronic cooling, they are only used in a narrow niche of applications, such as space or military. Complicated fabrication and system integration leading to high cost devices are the main culprit. To this end, this paper explores a low-cost sintering method for fabricating evaporators for mLHP that have increased heat transfer performance. Through this method, the porous wick of the evaporator is fabricated to partially fill the vapor collection channels embedded in the base plate of the evaporator. The sintering method employs an organic material used to define the vapor collection channels, which is sublimated at the end of the sintering process. Interpenetrating these two, otherwise distinctive, parts of the evaporator results in an increased contact area and thermal conductance. The heat transfer performance of an mLHP employing the new evaporator is compared to that of a system using a standard evaporator configuration, where the porous wick is rested against a flat base plate. It is found that the thermal contact conductance increases about 25%, depending on the applied heat load, while the total thermal resistance of the mLHP with the new evaporator decreases approximately by a factor of two. © 2013 Elsevier Ltd. All rights reserved. Source