Yik Shing Tat Industrial Company Ltd

Shenzhen, China

Yik Shing Tat Industrial Company Ltd

Shenzhen, China

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Yang M.,Harbin Institute of Technology | Ma X.,Yik Shing Tat Industrial Co. | Li M.-Y.,Harbin Institute of Technology
Advanced Materials Research | Year: 2014

The coarsening behavior of Cu6Sn5 grains formed at the Sn37Pb/Polycrystalline Cu interface is investigated in terms of their orientation evolution during solid-state aging. The results show that the coarsening behavior of the interfacial Cu6Sn5 grains during solid-state aging are quite different from that during liquid-state soldering. The occurrence of the coarsening in the solid-sate reaction is caused by the different surface energies between two adjacent grains. In addition, the texture morphologies of the interfacial grains affect their coarsening rates. In particular, the interfacial Cu6Sn5 grains formed at 200 °C exhibit a texture with the [0001] direction normal to the interface after 16 days of aging at 150 °C, and the formation of this texture accelerates the coarsening process of the interfacial Cu6Sn5 grains. © (2014) Trans Tech Publications, Switzerland.


He P.,Harbin Institute of Technology | Lu X.-C.,Harbin Institute of Technology | Zhang B.-B.,ZTE Corporation | Ma X.,Yik Shing Tat Industrial Co. | Qian Y.-Y.,Harbin Institute of Technology
Cailiao Gongcheng/Journal of Materials Engineering | Year: 2010

The effect of Ag, Ge, Cu, Sb, Zn, Ce, P and Ni inclusions on melting temperature, wettability, impact toughness and microstructure of 43Sn-57Bi lead-free solders were investigated. The result showed that those inclusions had little influence on melting temperature of the solders. Addition of P, Ni resulted in the appearance of Bi, which decreased the performance of solders. Ag3Sn and zinc rich phase could increase the performance when the shape was appropriate. Add Ag, Ge, Zn, Cu solely could improve the solder's ductility, while Sb, Ce, P, Ni could decrease the ductility. Yield strength of the solders and shear strength of the joint could improve with the addition of Ag, Ge. The improvement effort of 43Sn-Bi-1Ge-1Ag was the best in the solders with several inclusions.


Lu X.-C.,Harbin Institute of Technology | He P.,Harbin Institute of Technology | Zhang B.-B.,ZTE Corporation | Ma X.,Yik Shing Tat Industrial Co. | Qian Y.-Y.,Harbin Institute of Technology
Cailiao Gongcheng/Journal of Materials Engineering | Year: 2010

Effects of different solidification modes, including of furnace cooling, air cooling, water cooling and liquid nitrogen cooling, and magnetic fields on the impact toughness and microstructure of Sn-Bi solders are studied. The results show that fast cooling and rotating magnetic fields were applied for refining the structure of the Sn-Bi solder. Although these technologies can refine the grain size, meanwhile they reduced the plasticity of the solder. For Sn-57Bi alloy fast cooling caused the segregation of Bi, and the rotating magnetic field lead to the structural heterogeneity. Both methods destroyed the strengthening mechanism of adding Ge and lead the Ag3Sn phase to become coarse. Further more, the centrifugal force of the rotating magnetic of the 43Sn-Bi-3.5Ag caused the increase of segregation. With the cooling rate increases, the toughness of Sn-57Bi eutectic solder increase firstly and then decrease due to the joint actions of structure refinement and segregation.


Yang M.,Harbin Institute of Technology | Yang M.,Korea Institute of Industrial Technology | Yang S.,Shanghai Aerospace Equipments Manufacturer | Ji H.,Harbin Institute of Technology | And 4 more authors.
Journal of Materials Processing Technology | Year: 2016

The formation process and mechanism of the Sn3.5Ag/Cu solder bump during induction heating were investigated to elucidate the basic characteristics of the induction heating soldering process. During induction heating, solder balls quickly melted from the surface to the center, which could be utilized to prepare solder bumps of controlled height. Cu6Sn5 grains with a round scallop shape were generated at the interface as soon as the solder ball was wetted on the Cu substrate. With prolonged heating time, the uniform morphology of the interfacial Cu6Sn5 grains was transformed to a special morphology in which scallop-shaped grains occupy the central area of the interface, surrounded by prismatic grains. Numerous bulk Cu6Sn5 grains were precipitated and regularly distributed in the solder matrix, which affected the hardness and shear strength of the solder bumps. © 2016 Elsevier B.V.


He P.,Harbin Institute of Technology | Lu X.-C.,Harbin Institute of Technology | Lin T.-S.,Harbin Institute of Technology | Li H.-X.,Harbin Institute of Technology | And 6 more authors.
Transactions of Nonferrous Metals Society of China (English Edition) | Year: 2012

Carbon nanotubes (CNTs) reinforced Sn-58Bi composites were successfully fabricated through ball-milling method and low temperature melting process. The influence of multi-walled carbon nanotubes (MWCNTs) on the mechanical strength and ductility of Sn-58Bi lead-free alloy was studied. The mechanical test results show that the bending strength of Sn-58Bi-0.03CNTs (mass fraction, %) composite is increased by 10.5% than that of the Sn-58Bi alloy, which can be attributed to the reduction of Sn-rich segregation and the grain refinement. The toughness of Sn-58Bi-0.03CNTs composite is increased by 48.9% than that of the matrix materials. It is indicated that the influence of CNTs on the strength of Sn-58Bi-xCNTs composite is insignificant. In addition, the fracture mechanism of CNTs reinforced Sn-Bi composite was analyzed. The corresponding fracture surface comparison between the Sn-58Bi-0.03CNTs composite and the monolithic Sn-58Bi alloy was made to identify the influence of CNTs on the fracture behavior and the reinforcing effect of CNTs. © 2012 The Nonferrous Metals Society of China.


Yang M.,Harbin Institute of Technology | Cao Y.,Harbin Institute of Technology | Joo S.,Harbin Institute of Technology | Joo S.,Korea Advanced Institute of Science and Technology | And 3 more authors.
Journal of Alloys and Compounds | Year: 2014

A study was performed on the precipitation behavior of Cu 6Sn5 during the solidification of Sn-based solders/ Cu joints and its effect on the growth of interfacial intermetallic compounds (IMCs). During cooling, Cu in molten solder precipitates in the form of Cu 6Sn5 both within the solder matrix and at the interface. The precipitation at the interface can greatly affect the interfacial IMC morphology and thickness but cannot change the interfacial IMC orientation. In general, additional Cu6Sn5 will precipitate at the solder/Cu interface when the Cu content is increased in the molten solder during soldering and when the cooling rate decreases during solder solidification. If the Cu content in the molten solder is sufficiently high, during cooling, the precipitated Cu6Sn5 will develop a prismatic morphology with the exposed surface indexed as (10-10) along the [0001] direction of the existing Cu6Sn5 grains at the interface. © 2013 Elsevier B.V. All rights reserved.


Yang M.,Harbin Institute of Technology | Li M.,Harbin Institute of Technology | Ma X.,Yik Shing Tat Industrial Co.
Proceedings - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013 | Year: 2013

Epitaxial growth of intermetallic compounds formed at eutectic Sn37Pb/ polycrystalline Cu interface during solid-state aging. The results show that the interfacial Cu6Sn5 grains exhibit textured growth under solid-state condition and their preferred orientations are affected by the as-soldered joints. Cu6Sn5 grains with [0001] direction normal to the interface are stable in solid and molten Sn37Pb solder at 200 °C, but will be rapidly consumed at 280 °C, which leads to the formation of different textures in Cu6Sn5 layer during the solid-state aging treatment to the joints formed at 200 °C and 280 °C. Also, the effects of the texture evolution on the growth of interfacial IMCs are evaluated. The results show that Cu diffusion along [0001] direction of Cu 6Sn5 is faster and therefore more interfacial IMCs are generated in the joints formed at 200 °C than those formed at 280 °C under the same solid-state reaction conditions. © 2013 IEEE.


Yang M.,Harbin Institute of Technology | Li M.,Harbin Institute of Technology | Wu J.,Yik Shing Tat Industrial Co. | Xu J.,Yik Shing Tat Industrial Co.
Proceedings of the Electronic Packaging Technology Conference, EPTC | Year: 2014

Intermetallic compounds (IMCs) that form at eutectic Sn3.5Ag/Cu and pure Sn/Cu interfaces during solid-state aging are comparatively studied in terms of their respective morphological formations. During solid-state aging, all the interfacial Cu6Sn5 grains evolve into a layer-type morphology, except for select grains that experience abnormal growth. This abnormal growth is caused by the preferential growth of the Cu6Sn5 at the grain boundary in solder matrix. Additionally, the effects of solder composition on the interfacial IMC growth are evaluated. The results indicate that the Ag addition retards IMC growth upon aging by inhibiting the diffusion of Cu. © 2014 IEEE.


Chen H.,Harbin Institute of Technology | Yan B.,Jiamusi University | Yang M.,Yik Shing Tat Industrial Co. | Ma X.,Yik Shing Tat Industrial Co. | Li M.,Harbin Institute of Technology
Materials Characterization | Year: 2013

The thermomechanical response of Sn-based solder interconnects with differently oriented grains was investigated by electron backscattered diffraction technique under thermal cycling and thermal shock testing in this study. The results showed that deformation and cracking of solder interconnects have a close relationship with the unique characteristics of grain orientation and boundaries in each solder interconnect, and deformation was frequently confined within the high-angle grain boundaries. The micro Vickers hardness testing results showed that the hardness varied significantly depending on the grain orientation and structure, and deformation twins can be induced around the indents by the indentation testing. © 2013 Elsevier Inc. All rights reserved.


He P.,Harbin Institute of Technology | An J.,Harbin Institute of Technology | Ma X.,Yik Shing Tat Industrial Co. | Chen S.,Yik Shing Tat Industrial Co. | And 2 more authors.
Hanjie Xuebao/Transactions of the China Welding Institution | Year: 2011

Varying weight fraction of multi-walled carbon nanotubes were incorporated into Sn-58Bi soler alloy by ball-milling and low temperature melting methods, the morphologies of carbon nanotubes in solder alloy and the influences of carbon nanotubes on the pull-off strength were investigated by SEM, EDS, and DSC. The experimental results indicate that part of carbon nanotubes are incorporated into Sn-58Bi soler alloy after ball-milling and low temperature melting; 0.03% CNTs can improve the wettability; the melting point of Sn-58Bi-CNTs solder does not change much; the dispersive distribution of carbon nanotubes could refine the microstructure of Sn-58Bi-CNTs joints and the reliability of solder joints also is improved by the influences of CNTs on the fracture mechanism of solder joints.

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