Wurth Elektronik GmbH and Co. KG

Niedernhall, Germany

Wurth Elektronik GmbH and Co. KG

Niedernhall, Germany

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Wolf J.,Wurth Elektronik GmbH and Co. KG | Alshahed M.S.,Institute For Mikroelektronik Stuttgart | Burghartz J.N.,Institute For Mikroelektronik Stuttgart | Gneiting T.,AdMOS GmbH | And 4 more authors.
20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015 | Year: 2015

With the growing demand for mechanically flexible electrical systems and the increasing level of integration of electrical assemblies, hybrid build-ups combining polymer substrates and ultra-Thin flexible silicon chips (system-in-foil) are getting more and more important. These systems need thin chips which maintain their functionality even in bent condition as well as reliable handling and assembly processes. Based on these, several ways to build up flexible systems with integrated thin chips have been realized and will be presented. This work was carried out by a consortium consisting of companies and research institutes within the framework of a cluster called MicroTEC Südwest in southern Germany. © 2015 IMAPS Europe.


Wolf J.,Wurth Elektronik GmbH and Co. KG | Kostelnik J.,Wurth Elektronik GmbH and Co. KG | Harendt C.,Institute For Mikroelektronik Stuttgart | Rempp H.,Institute For Mikroelektronik Stuttgart | Kugler A.,Robert Bosch GmbH
Galvanotechnik | Year: 2012

Active and passive electronic components are increasingly integrated within the printed circuit board itself. We are now on the threshold of a further development in which the PCB becomes more than a mere support for components. The printed circuit board is evolving to become ever more the central supporting element in solving construction problems in electronics. Thanks to new assembly and mounting processes, new interconnection techniques (AVT)-related, new components and materials, these developments are now being seen in the realm of flexible circuits. This article presents a range of scenarios for the realisation offlexible printed circuit boards where the aim is development of intelligentflexible substratesfor cost-effective manufacturing.


Kurzmanowski D.,Wurth Elektronik GmbH and Co. KG | Wilde J.,Albert Ludwigs University of Freiburg
Proceedings of the 2014 37th International Spring Seminar on Electronics Technology, ISSE 2014 | Year: 2014

Today's non-mass-production PCB-manufacturers have to be able to deliver a wide spectrum of PCB-layouts with a vast amount of different and sometimes contradicting requirements. Therefore both, the equipment and production processes have to be very flexible and well controlled. Nevertheless experience in PCB-production affirms that the outcome of some processes can be significantly influenced by the PCB-layout. Design of Experiments (DoE) is widely used for optimizing manufacturing processes and identifying influencing variables. Hence DoE should be useful for tagging crucial workpiece variables and evaluating their influence on particular manufacturing processes and machines. Using the example of copper deposition in mechanically-drilled areas of PCBs, a possible realization of DoE and its effectiveness is shown. The importance of focusing on the characteristics of the product to improve knowledge and quality of its manufacturing processes is also illustrated. © 2014 IEEE.


Hassan M.-U.,Institute for Microelectronics Stuttgart IMS CHIPS | Keck J.,Hahn Schickard | Klauk H.,Max Planck Institute For Festkorper Forschung | Kostelnik J.,Wurth Elektronik GmbH and Co. KG | And 5 more authors.
20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015 | Year: 2015

Hybrid System in Foil (HySiF) technology has the potential to combine compact high-performance circuit integration on thin, flexible silicon chips with thin-film large-Area components jointly on a polymer foil substrate. In this manuscript, such a HySiF technology demonstrator known as "Smart Skin" is presented. It contains bending stress sensors along with other modular technology components, such as display, wireless communication and thin-film battery, implemented in a thin foil substrate mounted onto a bionic adaptive robot gripper. For demonstration purposes, we have opted for two distinctly different smart-skin systems, i.e. one connected by wires and the second working autonomously. Here, we have presented the fabrication details and test results of the first mentioned fully functional smart-skin demonstrator. For the second generation of smart skin, the feasibility of combining a matrix of thin-film strain gauges and organic thin-film transistors (OTFTs) along with embedding a silicon chip inside the foil is evaluated. © 2015 IMAPS Europe.


More efficiency, higher output - for these goals companies today are investing huge sums into new workflow concepts and high tech machines. With these measures, the daily delays, bottlenecks and breakdowns in the operation often remain largely unnoticed. One reason for this is that in general, reliable data for this purpose are lacking, how often, where and above all why breakdowns occur.


Harendt C.,Institute For Mikroelektronik Stuttgart Ims Chips | Yu Z.,Institute For Mikroelektronik Stuttgart Ims Chips | Burghartz J.N.,Institute For Mikroelektronik Stuttgart Ims Chips | Kostelnik J.,Wurth Elektronik GmbH and Co. KG | And 2 more authors.
European Solid-State Device Research Conference | Year: 2014

Electronics embedded in foil is an enabling technology for flexible electronics and for special form factors of electronic components. In contrast to strictly printed electronics, Hybrid Systems-in-Foil (HySiF), comprising thin flexible, embedded chips and large-area thin-film electronic elements, feature a versatile and reliable technological solution for industrial applications of flexible electronics. This paper provides a comprehensive overview of HySiF technology, including aspects of thin-chip fabrication, reliability and assembly. Also presented is an industrial demonstrator utilizing such a HySiF component. © 2014 IEEE.


Harendt C.,Institute For Mikroelektronik Stuttgart Ims Chips | Kostelnik J.,Wurth Elektronik GmbH and Co. KG | Kugler A.,Robert Bosch GmbH | Lorenz E.,Robert Bosch GmbH | And 4 more authors.
Solid-State Electronics | Year: 2015

Abstract Electronics embedded in foil is an enabling technology for flexible electronics and for special form factors of electronic components. In contrast to strictly printed electronics, Hybrid Systems-in-Foil (HySiF), comprising thin flexible, embedded chips and large-area thin-film electronic elements, feature a versatile and reliable technological solution for industrial applications of flexible electronics. This paper provides a comprehensive overview of HySiF technology, including aspects of thin-chip fabrication, reliability and assembly. Also presented is an industrial demonstrator utilizing such a HySiF component. © 2015 Elsevier Ltd.

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