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The present invention applies to the technical field of photoelectric detectors and provides a high-frequency photoelectric detector encapsulation base can-packaged by using a multi-layer ceramic, comprising a laminated multi-layer ceramic substrate, wherein the multi-layer ceramic substrate is welded with pins at a bottom and provided with a metal ring at a top; an upper surface and a lower surface of each layer of the ceramic substrate are both plated with a conductive metal layer; circuit connection holes are distributed in each layer of the ceramic substrate; the upper surface of the multi-layer ceramic substrate is provided with two power contacts and two differential signal contacts; and the power contacts and the differential signal contacts penetrate through each layer of the ceramic substrate to be connected to the corresponding pins. The photoelectric detector encapsulation base is a tank-type base of a multi-layer ceramic structure, the upper and lower surfaces of each layer of the ceramic substrate are electroplated with a conductive metal layer to constitute a co-plane waveguide structure; and a differential signal transmission design being adopted in a high-speed signal line can solve the transmission problem of a signal of higher than 20 GHz in bandwidth, with a small transmission loss.


The present invention applies to the technical field of photoelectric detectors and provides a high-frequency photoelectric detector encapsulation base can-packaged by using a multi-layer ceramic, comprising a laminated multi-layer ceramic substrate, wherein the multi-layer ceramic substrate is welded with pins at a bottom and provided with a metal ring at a top; an upper surface and a lower surface of each layer of the ceramic substrate are both plated with a conductive metal layer; circuit connection holes are distributed in each layer of the ceramic substrate; the upper surface of the multi-layer ceramic substrate is provided with two power contacts and two differential signal contacts; and the power contacts and the differential signal contacts penetrate through each layer of the ceramic substrate to be connected to the corresponding pins. The photoelectric detector encapsulation base is a tank-type base of a multi-layer ceramic structure, the upper and lower surfaces of each layer of the ceramic substrate are electroplated with a conductive metal layer to constitute a co-plane waveguide structure; and a differential signal transmission design being adopted in a high-speed signal line can solve the transmission problem of a signal of higher than 20 GHz in bandwidth, with a small transmission loss.


Patent
Wuhan Telecommunication Devices Co. | Date: 2013-02-20

An electric-port SFP photoelectric module, comprising a base (4), an outer cover (2), a PCB board (1) and an RJ45 connector (3). The base (4) is a rectangular parallelepiped provided with an inner cavity. The PCB board (1) and the RJ45 connector (3) are connected in a combined manner, and the combined structure of the PCB board (1) and the RJ45 connector (3) is arranged in the inner cavity of the base (4). The upper part of the base (4) is fastened with the outer cover (2). The photoelectric module not only meets the size requirement, but also solves the problems of tight internal space of a tube housing, complicated mounting procedures of the tube housing and the like, and is convenient for assembly and can be flexibly detached.


Patent
Wuhan Telecommunication Devices Co. | Date: 2013-12-26

Provided are a silica-on-silicon-based hybrid integrated optoelectronic chip and a manufacturing method therefor. The hybrid integrated optoelectronic chip comprises a silicon substrate (1), wherein the surface of the silicon substrate (1) is provided with a platform (8), lug bosses (6,7) and a groove (10); a silica waveguide element (2) is arranged in the groove (10), the lug bosses (6,7) are protruded from the surface of the platform (8), and the surface of the platform (8) is provided with a discontinuous metal electrode layer (3); and the surface of the metal electrode layer (3) is provided with solder bumps (4), and an active optoelectronic chip (5) is arranged above the solder bumps (4) and the lug bosses (6, 7). In the manufacturing method, multi-step processes including material growth, hot oxygen bonding, flip-chip bonding, lithography alignment and the like are adopted, thereby guaranteeing the high-efficiency light coupling among waveguide devices of different materials, and reducing the light reflection between waveguide end faces. A high-frequency electrode composed of alternating current electrode areas (26) is manufactured between the alignment lug bosses (6, 7). Due to the fact that flip-chip bonding technology is beneficial to the transmission of high-frequency signals, integration level between devices is improved. Meanwhile, the process design not only can achieve the chip-level probe test, but also can be used for the subsequent gold ball bonding or wedge bonding process, thereby facilitating the achievement of encapsulation and mass production of hybrid integrated chips.


Patent
Wuhan Telecommunication Devices Co. | Date: 2015-02-11

An electric-port SFP photoelectric module, comprising a base (4), an outer cover (2), a PCB board (1) and an RJ45 connector (3). The base (4) is a rectangular parallelepiped provided with an inner cavity. The PCB board (1) and the RJ45 connector (3) are connected in a combined manner, and the combined structure of the PCB board (1) and the RJ45 connector (3) is arranged in the inner cavity of the base (4). The upper part of the base (4) is fastened with the outer cover (2). The photoelectric module not only meets the size requirement, but also solves the problems of tight internal space of a tube housing, complicated mounting procedures of the tube housing and the like, and is convenient for assembly and can be flexibly detached.


Patent
Wuhan Telecommunication Devices Co. | Date: 2012-12-17

An in-application upgrade method is used for optical module firmware not breaking a service. A storage area for internal programs of an optical module is divided into two areas which are respectively used for storing upgrade and application programs, and is divided into an area for backing up an interrupt vector table of a Boot program. An upper computer is in communication with the optical module. The interrupt vector table is switched, and the jump between the Boot program and the application program is achieved. The method includes extracting the contents of firmware, entering a download mode and updating the firmware. The original firmware is erased, and new firmware is written. An application mode is entered, the upper computer sending an exit command from the download mode. The upgrade program exits and a new application program is executed. The optical module operates normally without interruption.


Patent
Wuhan Telecommunication Devices Co. | Date: 2013-05-22

Provided is a working point controlling device and method for applying MZ modulator, which includes: a light modulator; a transimpedance amplifier, transmits current outputted by PD of the modulator into voltage signal; a low-noise amplifier, detects low-frequency signal and amplifies the signal, in order to improve the signal/noise ratio; a high Q band-pass filter, detects error signal and amplifies the signal, in order to improve the signal/noise ratio; a first power level conditioning, performs power level condition on error signal of phase, in order that signal output meets A/D input rang; a micro processor, generates low-frequency signal and finishes software synchronization detection wave and ratio integration PI adjusting algorithm; a second power level conditioning, finishes D/A output voltage condition, in order that D/A output is able to meet direct current offset whole controlling range power voltage range of the light modulator. Applying present invention, the problems, that the hardware controlling circuit of current MZ modulator offset point is complex and controlling accuracy is not high, can be resolved.


Patent
Wuhan Telecommunication Devices Co. | Date: 2012-07-16

Disclosed is a portable downloader comprising a pen-shaped housing and a circuit board provided inside of the pen-shaped housing. Provided at one end of the circuit board is a micro-universal serial bus (MUSB) port. Connected to the circuit board are a ground wire and two data wires. Each data wire is connected to a probe at the other end. Provided at the end of the pen-shaped housing corresponding to the MUSB port is a socket. Provided at the other end are two position-fixing holes. The two probes penetrate the position-fixing holes. The MUSB port connects to a computer universal serial bus (USB) port through a USB-MUSB computer extension wire. The portable downloader uses USB power supply with no need for an external power supply, and supports hot plug. The downloader uses the two probes as the C2 port, and is convenient to transmit data to C2 slave devices. The downloader is of a pen-shaped packaging, and is therefore easy to carry.


Patent
Wuhan Telecommunication Devices Co. | Date: 2014-11-05

Disclosed is a mounting and fixing structure for an optical fiber of a photoelectron device. The photoelectron device comprises a tube shell (120), with a tail tube (140) extending outwards being arranged on the tube shell (120). One end of an optical fiber is provided with a coupling structure (340), and the optical fiber comprises a fiber core (201) and an envelope (202) which is made of the same material as the fiber core (201) and covers the fiber core. One end of the optical fiber close to the coupling structure (340) forms a bare optical fiber (230) which consists of a fiber core (201) and an envelope (202), and the other end forms a basic optical fiber (200) which consists of a fiber core (201), an envelope (202) and a coating (203); and the optical fiber penetrates into the tail tube (140). The bare optical fiber (230) of the optical fiber is welded and fixed to the tail tube (140) through glass solder (160). The mounting and fixing structure for an optical fiber has the advantages of a simple structure and process, lower time consumption and a low cost, and provides high usage reliability while meeting the requirement of gas tightness.


Patent
Wuhan Telecommunication Devices Co. | Date: 2015-11-04

Provided are a silica-on-silicon-based hybrid integrated optoelectronic chip and a manufacturing method therefor. The hybrid integrated optoelectronic chip comprises a silicon substrate (1), wherein the surface of the silicon substrate (1) is provided with a platform (8), lug bosses (6,7) and a groove (10); a silica waveguide element (2) is arranged in the groove (10), the lug bosses (6,7) are protruded from the surface of the platform (8), and the surface of the platform (8) is provided with a discontinuous metal electrode layer (3); and the surface of the metal electrode layer (3) is provided with solder bumps (4), and an active optoelectronic chip (5) is arranged above the solder bumps (4) and the lug bosses (6, 7). In the manufacturing method, multi-step processes including material growth, hot oxygen bonding, flip-chip bonding, lithography alignment and the like are adopted, thereby guaranteeing the high-efficiency light coupling among waveguide devices of different materials, and reducing the light reflection between waveguide end faces. A high-frequency electrode composed of alternating current electrode areas (26) is manufactured between the alignment lug bosses (6, 7). Due to the fact that flip-chip bonding technology is beneficial to the transmission of high-frequency signals, integration level between devices is improved. Meanwhile, the process design not only can achieve the chip-level probe test, but also can be used for the subsequent gold ball bonding or wedge bonding process, thereby facilitating the achievement of encapsulation and mass production of hybrid integrated chips.

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