Irvine, CA, United States
Irvine, CA, United States

WiSpry, Inc. is a fabless RF semiconductor company based in Irvine, California.Using RF MEMS technology, WiSpry develops and markets RF Silicon integrated circuits, components and modules to manufacturers of wireless communication products.Founded in 2002, WiSpry was initially funded by the angel investor network, Tech Coast Angels.WiSpry is now one of Orange County's more highly funded startups with almost $50M invested to date by Acadia Woods Partners, American River Ventures, Arkian, Blueprint Ventures, Chart Venture Partners, DoCoMo Capital, Hotung Capital Management, Inc., In-Q-Tel,L Capital Partners, MuRata Manufacturing Co., Ltd., Paladin Capital Group, Shepherd Ventures and Tech Coast Angels.In January 2012, a Samsung smartphone teardown revealed the existence of a WiSpry RF MEMs antenna tuning chip: this is believed to be the first known use of an RF MEMs device in a volume shipping product. Wikipedia.


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The present subject matter relates to systems and methods for arranging and controlling programmable combinations of tuning elements in which more than one form of switching technology is combined in a single array. Specifically, such an array can include one or more first switchable elements including a first switching technology (e.g., one or more solid-state-controlled devices) and one or more second switchable elements including a second switching technology that is different than the first switching technology (e.g., one or more micro-electro-mechanical capacitors). The one or more first switchable elements and the one or more second switchable elements can be configured, however, to deliver a combined variable reactance.


Systems, devices, and methods for micro-electro-mechanical system (MEMS) tunable capacitors can include a fixed actuation electrode attached to a substrate, a fixed capacitive electrode attached to the substrate, and a movable component positioned above the substrate and movable with respect to the fixed actuation electrode and the fixed capacitive electrode. The movable component can include a movable actuation electrode positioned above the fixed actuation electrode and a movable capacitive electrode positioned above the fixed capacitive electrode. At least a portion of the movable capacitive electrode can be spaced apart from the fixed capacitive electrode by a first gap, and the movable actuation electrode can be spaced apart from the fixed actuation electrode by a second gap that is larger than the first gap.


The present subject matter relates to systems, devices, and methods for reducing surface dielectric charging in a RF MEMS actuator element. In particular, a micro-electro-mechanical systems (MEMS) can comprise a fixed electrode positioned on a substrate, a moveable electrode positioned substantially above the fixed electrode and separated from the fixed electrode by a gap, and at least one standoff bump positioned between the fixed electrode and the moveable electrode, wherein the at least one standoff bump extends into the gap. In this configuration, one or both of the fixed electrode or the moveable electrode can be patterned to define one or more hole that is substantially aligned with the one or more of the at least one standoff bump. The bump and the hole can both help to reduce the rate of surface dielectric charging and the total amount of charge generated.


Patent
WiSpry | Date: 2017-01-25

The present subject matter relates to tunable antenna systems and methods in which a tunable band-stop circuit is provided in communication between a signal node and an electrically small antenna having a largest dimension that is substantially equal to or less than one-tenth of a length of a wavelength corresponding to a frequency within a communications operating frequency band. The tunable band-stop circuit can be tunable to adjust a band-stop frequency, and an inductor in communication with the tunable band-stop circuit and the signal node can have an inductance selected to achieve a system resonance for the tunable band-stop circuit and the electrically small antenna at a desired low frequency band within the communications operating frequency band below the band-stop frequency.


Patent
WiSpry | Date: 2015-10-13

The present subject matter relates to systems and methods for sealing one or more MEMS devices within an encapsulated cavity. A first material layer can be positioned on a substrate, the first material layer comprising a first cavity and a second cavity that each have one or more openings out of the first material layer. At least the first cavity can be exposed to a first atmosphere and sealed while it is exposed to the first atmosphere while not sealing the second cavity. The second cavity can then be exposed to a second atmosphere that is different than the first atmosphere, and the second cavity can be sealed while it is exposed to the second atmosphere.


Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming at least one Micro-Electro-Mechanical System (MEMS) cavity. The method for forming the cavity further includes forming at least one first vent hole of a first dimension which is sized to avoid or minimize material deposition on a beam structure during sealing processes. The method for forming the cavity further includes forming at least one second vent hole of a second dimension, larger than the first dimension.


The present subject matter relates to systems, devices, and methods for reducing surface dielectric charging in a RF MEMS actuator element. In particular, a micro-electro-mechanical systems (MEMS) can comprise a fixed electrode positioned on a substrate, a moveable electrode positioned substantially above the fixed electrode and separated from the fixed electrode by a gap, and at least one standoff bump positioned between the fixed electrode and the moveable electrode, wherein the at least one standoff bump extends into the gap. In this configuration, one or both of the fixed electrode or the moveable electrode can be patterned to define one or more hole that is substantially aligned with the one or more of the at least one standoff bump. The bump and the hole can both help to reduce the rate of surface dielectric charging and the total amount of charge generated.


The present subject matter relates to antenna systems, devices, and methods that provide efficient coverage of low frequency bands (e.g., 700 MHz-bands and 600 MHz-bands) for the new generations of mobile communication. For example, a dual-resonant radiating system can include a ground plane, a radiating coupler spaced apart from but in communication with the ground plane, and a ground plane extension in communication with the ground plane. In this arrangement, one or both of the radiating coupler and the ground plane extension are tunable to tune a dual-resonance frequency response.


Patent
WiSpry | Date: 2015-03-20

The present subject matter relates to tunable antenna systems and methods in which a tunable band-stop circuit is provided in communication between a signal node and an electrically small antenna having a largest dimension that is substantially equal to or less than one-tenth of a length of a wavelength corresponding to a frequency within a communications operating frequency band. The tunable band-stop circuit can be tunable to adjust a band-stop frequency.


The present subject matter relates to devices, systems, and methods that provide a programmable filter response in a wireless frequency division duplex system. In particular, in some embodiments, a tunable diplex filter for such a system includes a first tunable filter in communication between an input node and a first output node, the first tunable filter being tunable to define a first tunable pass band configured to have a minimum pass band insertion loss at frequencies that are higher than a first reject band, and a second tunable filter in communication between the input node and a second output node, the second tunable filter being tunable to define a second tunable pass band configured to have a minimum pass band insertion loss at frequencies that are lower than the first reject band.

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