SEARCH FILTERS
Time filter
Source Type

Patent
Industrial Technology Research Institute of Taiwan and Walsin Lihwa | Date: 2014-02-17

A light emitting diode (LED) including a first-type doped GaN substrate, a first-type doped semiconductor layer, an active layer, a second-type semiconductor layer, a first electrode, and a second electrode is provided. The first-type doped GaN substrate has a first doped element. The first-type semiconductor layer is disposed on the first-type doped GaN substrate. The first-type semiconductor layer has a second doped element different from the first doped element, and the doped concentration of the second doped elementmay have a peak from 3E^(18)/cm^(3 )to 1E^(20)/cm^(3 )at an interface between the first-type doped GaN substrate and the first-type semiconductor layer. The active layer is disposed on the first-type semiconductor layer, and the second-type semiconductor layer is disposed on the active layer. The first electrode and the second electrode are respectively disposed on the first-type doped GaN substrate and the second-type semiconductor layer. Other LEDs are also provided.


A method of manufacturing light emitting diode packaging lens and packages made by using the method are disclosed in the present invention. By using electrophoretic deposition, one or more layers of phosphors are coated onto one surface of a cup which has a curved portion. The cup is used for the packaging lens. Thickness of phosphor layer can be controlled and distribution of phosphor particles is uniform. Therefore, light emitting diode packages with the lens can be a uniform light source.


Patent
Walsin Lihwa | Date: 2013-01-25

A light emitting diode (LED) and a manufacturing method thereof are provided. The LED comprises a semiconductor composite layer and an electrode. The semiconductor composite layer provides holes and electrons and allows the holes and the electrons to be combined to emit light. The electrode is formed on the semiconductor composite layer, wherein the electrode contains 30%98% of aluminum.


A light source module comprising a substrate and a light-emitting diode (LED) array is provided. The LED array comprises a first LED sub-array, a second LED sub-array, and a third LED sub-array disposed on the substrate along a horizontal axis. The first LED sub-array is configured to emit a first light beam. The second LED sub-array is configured to emit a second light beam. The third LED sub-array disposed between the first and second LED sub-arrays is configured to emit a third light beam. The first, second, and third light beams jointly forms a light area. Luminance of the third light beam is less than luminance of the first light beam or luminance of the second light beam.


Patent
Walsin Lihwa | Date: 2015-03-20

An illumination device comprising a reflector and a light source module is provided. The light source module comprises a column, a first light-emitting diode (LED) light source, and a second LED light source. The column has a front end and a side. The first LED light source fixed to the front end of the column is configured to emit a first light beam for forming a first illumination area on a projection plane. The second LED light source fixed to the side of the column is configured to emit a second light beam for forming a second illumination area partly overlapping the first illumination area on the projection plane.


Patent
Walsin Lihwa | Date: 2013-01-22

A laser lighting device, including a laser light source and a light pipe, is disclosed. The laser light source can produce a laser beam with a diffusion angle not larger than 30 degrees. The light pipe is disposed in a light path of the laser beam, and has a light incident surface, a light exiting surface and several cut planes. The light incident surface is opposite to the laser light source, and the cut planes are located between the light incident and light exiting surfaces. Each of the cut planes is normal to the longitudinal direction of the light pipe, and has an area smaller than that of the light exiting surface but larger than that of the light incident surface. The areas of the cut planes increase sequentially along the longitudinal direction. The laser beam will be effectively collimated by the light pipe after passing through the light pipe.


Patent
Walsin Lihwa | Date: 2013-12-16

A light emitting diode device is provided. The light emitting diode device comprises a light emitting diode element, an encapsulation layer, and a plurality of pillars. The encapsulation layer is disposed on the light emitting diode element, and the pillars are disposed on the encapsulation layer. The pillars are formed by a light transmissible material.


A method for enhancing electrical injection efficiency and light extraction efficiency of a light-emitting device is disclosed. The method includes the steps of: providing a site layer on the light-emitting device; placing a protection layer on the site layer; forming a cavity through the protection layer and the site layer; and growing a window layer in the cavity. The shape of the window layer can be well controlled by adjusting reactive temperature, reactive time, and N_(2)/H_(2 )concentration ratio of atmosphere such that light escape angle of the window layer can be changed.


A method for enhancing light extraction of a light emitting device is disclosed. The method includes the steps of: providing a site layer on the light emitting device; placing a protection layer on the site layer; forming an array of pores through the protection layer and the site layer; and growing on the site layer an oxide layer, having a plurality of rods, each of which is formed in one of the pores. The shapes of the rods can be well controlled by adjusting reactive temperature, time and N_(2)/H_(2 )concentration ratio of atmosphere such that the shape and light escape angle of the rods can be changed.


Patent
Walsin Lihwa | Date: 2013-05-02

A light emitting diode unit comprising a light emitting diode chip, a reflecting unit, and a light condenser is provided in this invention. The light emitting diode chip is disposed on a substrate for providing a plurality of first light beams. The reflecting unit is installed on the substrate, surrounding the light emitting diode chip for reflecting the first light beams emitted from the light emitting diode chip, and sufficiently directing the first light beams upward. The light condenser is provided above the light emitting diode chip, having a light-incident pattern and a light-emitting flat plane, wherein the light-incident pattern faces to the light emitting diode chip for sufficiently receiving and guiding the first light beams upward via the light-emitting flat plane.

Loading Walsin Lihwa collaborators
Loading Walsin Lihwa collaborators