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Hanau am Main, Germany

Breach C.D.,Promat Consultants | Wulff F.W.,W. C. Heraeus Gmbh
Microelectronics Reliability | Year: 2010

Thermosonic ball bonding is a metallurgical process that until recently was rarely the subject of metallurgical analysis. However, in recent years greater focus has been given to the materials science of thermosonic ball-wedge bonding in an attempt to better control and advance its application as an interconnect technology in advanced packaging. As with most materials processes, establishing a scientific understanding of the process requires knowledge from various sub-disciplines of physical science. This article briefly reviews selected aspects of the materials science of ball bonding, focussing on 1st and 2nd bond formation and intermetallic growth. © 2009 Elsevier Ltd. All rights reserved. Source


In processes for removing ruthenium by distilling RuO The processes can be carried out in reactor modules with


Patent
W. C. Heraeus Gmbh | Date: 2013-01-31

A method of forming a wire includes providing a first wire segment and a second wire segment. The first and second wire segments are inserted into opposite ends of a coupling segment. The coupling segment is laser welded such that the laser creates an indent in the coupling segment that penetrates into at least one of the first and second wire segments.


One aspect is a method for the production of a three-dimensional structure of successive layers producing a multitude of successive layers wherein, with the exception of a first layer, each of the successive layers is arranged on a preceding layer. Each of the successive layers includes at least two materials wherein one material is a sacrificial material and one material is a structure material. Each of the successive layers defines a successive cross-section through the three-dimensional structure. Producing each of the layers includes depositing the sacrificial material by means of an electrochemical process and depositing the structure material by means of physical gas phase deposition. After a multitude of successive layers has been produced, the three-dimensional structure is uncovered by removing at least a part of the sacrificial material. The sacrificial material is at least one of a group consisting of nickel, silver, palladium, and gold.


Patent
W. C. Heraeus Gmbh | Date: 2010-10-07

A medical lead includes a first wire coil having an outer diameter and a marker coil having an inner diameter. The marker coil is assembled over the first wire coil. The outer diameter first wire coil is smaller than the inner diameter of the marker coil thereby defining a gap. A second wire coil substantially fills the gap between the first wire coil and the marker coil. A ball weld is formed at an end of the medical lead adjacent each of the first and second wire coils and adjacent the marker coil.

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