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Stephan Thamban P.L.,University of Texas at Dallas | Stephan Thamban P.L.,Verity Instruments Inc. | Yun S.,University of Texas at Dallas | Yun S.,Verity Instruments Inc. | And 5 more authors.
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films | Year: 2012

Traditionally process plasmas are often studied and monitored by optical emission spectroscopy. Here, the authors compare experimental measurements from a secondary electron beam excitation and direct process plasma excitation to discuss and illustrate its distinctiveness in the study of process plasmas. They present results that show excitations of etch process effluents in a SF 6 discharge and endpoint detection capabilities in dark plasma process conditions. In SF6 discharges, a band around 300 nm, not visible in process emission, is observed and it can serve as a good indicator of etch product emission during polysilicon etches. Based on prior work reported in literature the authors believe this band is due to SiF4 gas phase species. © 2012 American Vacuum Society.

Stephan Thamban P.L.,University of Texas at Dallas | Padron-Wells G.,University of Texas at Dallas | Yun S.,University of Texas at Dallas | Hosch J.W.,Verity Instruments Inc. | Goeckner M.J.,University of Texas at Dallas
Journal of Vacuum Science and Technology B:Nanotechnology and Microelectronics | Year: 2012

In process optical emission spectroscopy (OES) measurements, excitation mechanisms as dictated by the process plasma can be complex to analyze optical signals quantitatively. Applications of a new electron beam excitation method demonstrate distinct merits for plasma process diagnostics and process control. The electron energy control attribute of the method provides the means to optimize and monitor specific species optical emission in process chemistries to achieve process control such as endpoint. The authors present gas phase results from photoresist ash and SiO2 etch using O2 and CF 4/Ar discharges, respectively. The effluent density variations as measured with the e-beam method during process stages demonstrate process endpoint detection. Simultaneous measurements with FTIR spectroscopy and direct plasma OES is also presented for comparison. © 2012 American Vacuum Society.

Abuta E.,Verity Instruments Inc. | Tian J.,Southern Methodist University | Tian J.,Northwestern Polytechnical University
Proceedings - 1st International Workshop on Complex Faults and Failures in Large Software Systems, COUFLESS 2015 | Year: 2015

Demonstrating software reliability across multiple software revisions has become essential to end users of an end point detection system used in the semiconductor industry. This would enable them to make informed decisions of upgrading software versions without making significant impact to their current established processes. We show how one can use standard defect data normally collected in any software development organization to demonstrate reliability trends. We provide evidence of reliability maintained across the different versions and that continuous defect fixes increased software reliability over time. © 2015 IEEE.

A method for monitoring at least one process parameter of a plasma process being performed on a semiconductor wafer, surface or surface and determine arc events occurring within the plasma tool chamber. The method comprises the steps of detecting the modulated light being generated from the plasma sheath during the plasma process; sampling RF voltage and current signals from the RF transmission line; processing the detected modulated light and the RF signals to produce at least one monitor statistic for the plasma process, and process the monitor signal to determine the occurrence of arcing events during the wafer processing.

Verity Instruments Inc. | Date: 2016-02-17

A digital flashlamp controller, a flashlamp control system and a method of controlling a flashlamp bulb employing digital control electronics are provided herein. In one embodiment, the digital flashlamp controller includes: (1) a trigger interface configured to provide firing signals to control a trigger element for a flashlamp bulb and (2) digital electronics configured to generate the firing signals and control multiple pulsing of the flashlamp bulb.

Verity Instruments Inc. | Date: 2014-10-07

Emitted light from a pulsed plasma system is detected, amplified and digitized over a plurality of pulse modulation cycles to produce a digitized signal over the plurality of RF modulation periods, each of which contains an amount of random intensity variations. The individual signal periods are then mathematically combined to produce a stable local reference waveform signal that has decreased random intensity variations. One mechanism for creating a stable local reference waveform signal is by subdividing each of the individual signal periods into a plurality of subunits and the mathematically averaging the respective subunits within the modulation period to produce the stable local reference waveform signal for the modulation period. The stable local reference waveform signal can then be compared to other instantaneous waveform signals from the pulsed plasma system, or waveform parameters can be derived using various signal processing techniques such as Fourier analysis.

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