Fremont H.,University Of Bordeaux Umr 5218 |
Kludt J.,Leibniz University of Hanover |
Wade M.,University Of Bordeaux Umr 5218 |
Weide-Zaage K.,Leibniz University of Hanover |
And 2 more authors.
Microelectronics Reliability | Year: 2014
Embedding passives in PCB permits to gain in integration density while enhancing electromagnetic compatibility performances. The choice of the dielectric film is fundamental for large frequency band stability of embedded capacitances. However, these materials are prone to water absorption, which can lead to functional parameter degradations and additional stresses at the interfaces. This paper presents experimental capacitors embedded in FR-4, and finite element simulations of moisture absorption in various dielectric materials. Technological choices, as well as the qualification procedure, can be improved thanks to the simulation results. © 2014 Elsevier Ltd. All rights reserved.
Barnat S.,University of Tunis |
Guedon-Gracia A.,University Of Bordeaux Umr 5218 |
Fremont H.,University Of Bordeaux Umr 5218
Microelectronics Reliability | Year: 2015
The main purpose of the paper is to present a methodological approach combining experiments and simulations for virtual prototyping in a Design-for-Reliability approach. Two examples illustrate the methodology and the importance of a wise choice of the adequate failure criterion for numerical modelling. In the first example, the stress induced in silicon is axial whereas it is radial in the second case. Strength data recorded from three-point-bend tests have been regarded in the first case, whereas in the second case, ball-on-ring test results have been considered. © 2015 Elsevier Ltd.