Cork, Ireland
Cork, Ireland

University College Cork – National University of Ireland, Cork is a constituent university of the National University of Ireland. The university is located in Cork.The university was founded in 1845 as one of three Queen’s Colleges located in Belfast, Cork, and Galway. It became University College, Cork, under the Irish Universities Act of 1908. The Universities Act 1997 renamed the university as National University of Ireland, Cork, and a Ministerial Order of 1998 renamed the university as University College Cork – National University of Ireland, Cork, though it continues to be almost universally known as University College Cork.The university was named Irish University of the Year by the Sunday Times in 2003, 2005, and 2011. The 2011 QS World University Rankings assigned a 5-star rating to UCC, and ranked the university amongst the top 2% of universities worldwide. Also in 2011, University College Cork became the first university worldwide to achieve the ISO 50001 standard in energy management. UCC ranks 4th worldwide in terms of food research, and in 2013 the medical school was ranked among the top 200 in the world.Dr. Michael B. Murphy has been president of the university since February 2007. Wikipedia.


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Patent
Trinity College Dublin and University College Cork | Date: 2017-04-12

A poly(methyl methacrylate) (PMMA) membrane having a highly porous, reticulated, 3-D structure suitable for lateral flow diagnostic applications is described. Also described is a method for producing a poly(methyl methacrylate) (PMMA) membrane that comprises the steps of mixing a suitable amount of PMMA, a solvent and a optionally one of either a co-solvent or a non-solvent to produce a solution, casting a thin film of the solution onto a support, and removal of the solvent from the solution to produce the PMMA membrane. A lateral flow diagnostic device comprising a highly porous PMMA membrane as a reaction membrane is also described


Patent
University College Cork | Date: 2016-10-12

Provided herein are alloy systems with enhanced Seebeck coefficient and processes for making the same. An alloy system and process for improving the Seebeck coefficient of such an alloy system is disclosed. The process relates to an innovative methodology to preserve Te stoichiometry in electroplated thin films under annealing at high temperatures.


Patent
University College Cork and Catholic University of Leuven | Date: 2017-03-29

The present invention relates to a compound of formula (I), or a pharmaceutically acceptable salt or prodrug thereof, and their use in medicine particular as anti-viral agents; wherein: Base is a natural or non-natural nucleobase, and the other substituents are as defined in the claims.


Patent
University College Cork | Date: 2017-03-15

The present invention relates to a method for the treatment of cancer in a subject which comprises the steps of: (i) administering electroporation to a tumour in the subject; and (ii) administering a T or B -cell activating agent to the subject, wherein step (i) and (ii) may be performed in either order.


Patent
University College Cork | Date: 2017-05-17

The present invention discloses a method and system of providing a real time audification of neonatal EEG signals. The method comprises the steps of: receiving preprocessed neonatal EEG signals; changing a characteristic of the preprocessed signals in a phase vocoder; resampling the output signals from the vocoder to a predetermined audio frequency range; converting the resampled signals into stereo signals; and selecting a plurality of channels from the stereo signals as the output audio signals.


Liang K.L.,University College Cork
Blood | Year: 2013

There is growing research interest in the mammalian Tribbles (Trib) family of serine/threonine pseudokinases and their oncogenic association with acute leukemias. This review is to understand the role of Trib genes in hematopoietic malignancies and their potential as targets for novel therapeutic strategies in acute myeloid leukemia and acute lymphoblastic leukemia. We discuss the role of Tribs as central signaling mediators in different subtypes of acute leukemia and propose that inhibition of dysregulated Trib signaling may be therapeutically beneficial.


Grant
Agency: European Commission | Branch: H2020 | Program: RIA | Phase: ICT-03-2016 | Award Amount: 4.57M | Year: 2017

The objective of INSPEX is to make obstacle detection capabilities that are currently only feasible on autonomous vehicles available as a personal portable/wearable multi-sensor, miniaturised, low power spatial exploration system. The INSPEX System will be used for real-time 3D detection, location and warning of obstacles under all environmental conditions in indoor and outdoor environments with static and mobile obstacles. Applications include navigation for the visually/mobility impaired, safer human navigation in reduced visibility conditions and small robot/drone obstacle avoidance. The partners bring state-of-the-art range sensors (LiDAR, UWB radar and MEMS ultrasound) to the project. INSPEX will miniaturise and reduce the power consumption of these sensors to facilitate systems integration. These will then be integrated with an IMU, environmental sensing, signal and data processing, wireless communications, power efficient data fusion and user interface, all in a miniature, low power system designed to operate within wider smart/IoT environments. The main INSPEX Demonstrator will embed the INSPEX System in a white cane for the visually impaired and provide 3D spatial audio feedback on obstacle location. INSPEX directly addresses: - ICT-3 Challenge to develop and manufacture smart objects and systems that closely integrate sensors, actuators, innovative MEMS, processing power, embedded memory and communication capabilities, all optimising the use of supply power that can easily be made interoperable within systems of systems - RIA aims to make technological breakthroughs and their validation in laboratory environments of the next generations of miniaturised smart integrated systems and industrial-relevant technological developments, modelling and validation that will enable solutions in particular for health and well-being safety and security manufacturing. INSPEX is taking reliability and ethical issues strongly into consideration.


Grant
Agency: European Commission | Branch: H2020 | Program: IA | Phase: LCE-03-2015 | Award Amount: 13.71M | Year: 2016

The FloTEC project will demonstrate the potential for floating tidal stream turbines to provide low-cost, high-value energy to the European grid mix. The FloTEC project has 5 core objectives: 1. Demonstrate a full-scale prototype floating tidal energy generation system for optimised energy extraction in locally varying tidal resources; 2. Reduce the Levelised Cost of Energy of floating tidal energy from current estimated 250/MWh to 200/MWh, through both CAPEX and OPEX cost reductions in Scotrenewables Tidal Technology; 3. Develop potential of tidal energy generation towards flexible, baseload generation, through the integration of energy storage; 4. Demonstrate the potential for centralised MV power conversion to provide a generic, optimised low-cost solution for tidal arrays; 5. Progress tidal energy towards maturity and standard project financing by reducing cost and risk, improving reliability, and developing an advanced financing plan for first arrays. This will be realised through the construction of a M2-SR2000 2MW turbine - which will incorporate the following innovations: 50% greater energy capture through enlarged rotors with a lower rated speed; Automated steel fabrication; Centralised MV power conversion Integrated Energy Storage Mooring load dampers Composite Blade Manufacturing The SR2000-M2 will be deployed alongside the existing SR2000-M1 at EMEC to form a 4MW floating tidal array, serving as a demonstration platform for commercially viable tidal stream energy as a baseload supply.


Grant
Agency: European Commission | Branch: H2020 | Program: RIA | Phase: NMBP-02-2016 | Award Amount: 7.43M | Year: 2017

Power electronics is the key technology to control the flow of electrical energy between source and load for a wide variety of applications from the GWs in energy transmission lines, the MWs in datacenters that power the internet to the mWs in mobile phones. Wide band gap semiconductors such as GaN use their capability to operate at higher voltages, temperatures, and switching frequencies with greater efficiencies. The GaNonCMOS project aims to bring GaN power electronic materials, devices and systems to the next level of maturity by providing the most densely integrated materials to date. This development will drive a new generation of densely integrated power electronics and pave the way toward low cost, highly reliable systems for energy intensive applications. This will be realized by integrating GaN power switches with CMOS drivers densely together using different integration schemes from the package level up to the chip level including wafer bonding between GaN on Si(111) and CMOS on Si (100) wafers. This requires the optimization of the GaN materials stack and device layout to enable fabrication of normally-off devices for such low temperature integration processes (max 400oC). In addition, new soft magnetic core materials reaching switching frequencies up to 200 Mhz with ultralow power losses will be developed. This will be assembled with new materials and methods for miniaturised packages to allow GaN devices, modules and systems to operate under maximum speed and energy efficiency. A special focus is on the long term reliability improvements over the full value chain of materials, devices, modules and systems. This is enabled by the choice of consortium partners that cover the entire value chain from universities, research centers, SMEs, large industries and vendors that incorporate the developed technology into practical systems such as datacenters, automotive, aviation and e-mobility bikes


Grant
Agency: European Commission | Branch: H2020 | Program: IA | Phase: ICT-29-2016 | Award Amount: 15.57M | Year: 2017

PIXAPP will establish the worlds first open access Photonic Integrated Circuit (PIC) assembly & packaging Pilot Line. It combines a highly-interdisciplinary team of Europes leading industrial & research organisations. PIXAPP provides Europes SMEs with a unique one-stop-shop, enabling them to exploit the breakthrough advantages of PIC technologies. PIXAPP bridges the valley of death, providing SMEs with an easy access route to take R&D results from lab to market, giving them a competitive advantage over global competition. Target markets include communications, healthcare & security, which are of great socio-economic importance to Europe. PIXAPPs manufacturing capabilities can support over 120 users per year, across all stages of manufacturing, from prototyping to medium scale manufacture. PIXAPP bridges missing gaps in the value chain, from assembly & packaging, through to equipment optimisation, test and application demonstration. To achieve these ambitious objectives, PIXAPP will; 1) Combine a group of Europes leading industrial & research organisations in an advanced PIC assembly & packaging Pilot Line facility.2) Develop an innovative Pilot Line operational model that coordinates activities between consortium partners & supports easy user access through a single entry point. 3) Establish packaging standards that provide cost-efficient assembly & packaging solutions, enabling transfer to full-scale industrial manufacture. 4) Create the highly-skilled workforce required to manage & operate these industrial manufacturing facilities.5) Develop a business plan to ensure Pilot Line sustainability & a route to industrial manufacturing. PIXAPP will deliver significant impacts to a wide stakeholder group, highlighting how industrial & research sectors can collaborate to address emerging socio-economic challenges.

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