Shah Alam, Malaysia
Shah Alam, Malaysia

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Mukhtar N.Z.F.,UiTM Shah Alam | Mukhtar N.Z.F.,Institute of science | Rusop M.,Institute of science | Rusop M.,Nano ElecTronic Center | And 2 more authors.
Advanced Materials Research | Year: 2014

PTFE is a polymer of the type of Teflon. This polymer is from fluoropolymer family and made from monomer tetrafluoroethylene by polymerization. PTFE have properties that make them very useful in many application such as high melting point, extremely low friction of coefficient, very good chemical resistance, maximum mechanical resistance, non - reactive polymer and good insulation properties. Therefore, this paper will report the study on commercial PTFE as an excellent remarkable polymer. The characterization will take over to analysis this polymer, respectively via Field Emission Scanning Electron Microscopy (FESEM), Fourier Transform Infra - Red Spectroscopy (FTIR) and X-Ray Diffraction (XRD). It was found that PTFE have spherical shape like branches with crystalline phase. © (2014) Trans Tech Publications, Switzerland.


Sohot M.R.,UiTM Shah Alam | Jais U.S.,UiTM Shah Alam
Advanced Materials Research | Year: 2014

Selective catalytic reduction (SCR) is a well-proven method to reduce NO emission. However, to choose the right catalyst that provides a surface for reaction between NO and ammonia at low temperatures is a challenging task for a catalyst's developers. In an earlier study, we prepared V2O5-CeO2-SiO2 catalyst with increasing V2O5 content by sol-gel route and found that the catalytic activity improved with increasing the V2O5 loading up to 0.5%. The catalytic activity, however, dropped when V2O5 loading was about 1% and increased back when the loading of V2O5 was about 5%. In this study, we looked into the microstructural relationship to explain these findings. The microstructures of the catalysts before and after exposure to NO gas revealed that the catalysts with 0.2% and 0.5% V2O5 were more porous after the reduction process possibly due to improved breakdown of (NH4)HCO3 to NH3 by the possible interaction with the V2O5 and CeO2-containing catalysts which consequently resulted in a more efficient NO reduction to N2 and H2O at low temperature. The microstructure of the catalyst with 1% V2O5 content to 5%, improved back the efficiency although clogging by CeVO4 phase still possible due to its presence based on XRD. The well-ordered micropores before exposure to NO and the more efficient breakdown of (NH4)HCO3 could have contributed to increase back the catalytic activity at low temperature. © (2014) Trans Tech Publications, Switzerland.


Aziz M.R.,UiTM Penang | Kuntjoro W.,UiTM Shah Alam | David N.V.,UiTM Shah Alam | Rais F.,Malaysian Science and Technology Research Institute for Defence
Applied Mechanics and Materials | Year: 2013

This paper presents the ballistic impact study for the non-filled aluminum tank. The objective was to determine the ballistic limit for front tank wall and rear tank wall. The tank was impacted with fragment simulating projectile (FSP) with various velocities range from 239 m/s up to 556 m/s. The aluminum tank was 3 mm thick, 150 mm wide and 750 mm long. The ends of tank were closed with two Polymethyl methacrylate (PMMA) windows which fixed to the tank with four steel bars. The test was conducted at the Science and Technology Research Institute for Defense (STRIDE) Batu Arang, Selangor. The results showed that the ballistic limit for the front tank wall and rear tank wall was 257.7 m/s and 481 m/s, respectively. © (2013) Trans Tech Publications, Switzerland.


As-received samples of an austenitic stainless steel AISI 304 type was welded by Gas metal arc welding (GMAW) robotic operation process using ER308L-Si filler metal wire. Two different atmospheres were used: 68% Argon plus 32% CO2, and 100% Argon. The aim of this study is investigates the influence of quenching heat treatment on the mechanical and microstructure properties of AISI 304 type which welded by GMAW under different shielding gas compositions. The fractured surfaces of the tensile test specimens examined using scanning electron microscopy (S.E.M). The results showed that the welding using shielding gas of 68% Argon plus 32% CO2 stronger than 100% Argon. After performed quenching heat treatment process, both specimens experienced a slight decreased in hardness. © (2014) Trans Tech Publications, Switzerland.


Mazlan M.,UiTM Pulau Pinang | Rahim A.,UiTM Shah Alam | Iqbal M.A.,UiTM Pulau Pinang | Mustafa Al Bakri A.M.,University Malaysia Perlis | And 2 more authors.
Advanced Materials Research | Year: 2013

The paper present the three dimensional numerical analysis of heat and fluid flow through Plastic Leaded Chip Carrier (PLCC) packages in inline orientation horizontally mounted on a printed circuit board in a wind tunnel is carried out using a commercial CFD code, FLUENT™ by using Epoxy Moulding Compound (EMC) as a main material. The study was made for four and eight packages with different Reynolds Number and package chip powers. The results are presented in term of junction temperature for four and eight PLCC package under different conditions. It is observed the chip temperatures of eight PLCC packages have higher junction temperature compare to four PLCC packages due to effect of other PLCC because of space and gap between PLCC that have more number of PLCC is smaller. Hence it makes junction temperature of eight PLCC higher compare to four PLCC packages. Moreover, the junction temperature of the packages decreases with increase in Reynolds Number. © (2013) Trans Tech Publications, Switzerland.


Mazlan M.,UiTM Pulau Pinang | Rahim A.,UiTM Shah Alam | Iqbal M.A.,UiTM Pulau Pinang | Mustafa Al Bakri A.M.,University Malaysia Perlis | And 2 more authors.
Advanced Materials Research | Year: 2013

Plastic Leaded Chip Carrier (PLCC) package has been emerged a promising option to tackle the thermal management issue of micro-electronic devices. In the present study, three dimensional numerical analysis of heat and fluid flow through PLCC packages oriented in-line and mounted horizontally on a printed circuit board, is carried out using a commercial CFD code, FLUENT™. The simulation is performed for 12 PLCC under different inlet velocities and chip powers. The contours of average junction temperatures are obtained for each package under different conditions. It is observed that the junction temperature of the packages decreases with increase in inlet velocity and increases with chip power. Moreover, the increase in package density significantly contributed to rise in temperature of chips. Thus the present simulation demonstrates that the chip density (the number of packages mounted on a given area), chip power and the coolant inlet velocity are strongly interconnected; hence their appropriate choice would be crucial. © (2013) Trans Tech Publications, Switzerland.


Mazlan M.,UiTM Pulau Pinang | Rahim A.,UiTM Shah Alam | Mustafa Al Bakri A.M.,University Malaysia Perlis | Razak W.,University of Malaysia, Kelantan | And 3 more authors.
Advanced Materials Research | Year: 2013

This paper presents the thermal management of electronic components, microprocessor by using three dimensional numerical analysis of heat and fluid flow in computer. 3D model of microprocessors is built using GAMBIT and simulated using FLUENT software. The study was made for four microprocessors arranged in line under different types of materials, inlet velocities and package (chip) powers. The results are presented in terms of averagejunction temperature and thermal resistance of each package Thejunction temperature is been observed and it was found that the junction temperature of the microprocessors is not exceed 70° C. It also found that the (chip) powers and inlet velocities are the most important elements to control and manage the junction temperature. The strength of CFD software in handling heat transfer problems is proved to be excellent. © (2013)Trans Tech Publications, Switzerland.


Mazlan M.,UiTM Pulau Pinang | Rahim A.,UiTM Shah Alam | Mustafa Al Bakri A.M.,University Malaysia Perlis | Iqbal M.A.,UiTM Pulau Pinang | And 2 more authors.
Advanced Materials Research | Year: 2013

Thermal pad is new technology in the world that been used in PLCC in order to reduce junction temperature to the minimum level in electronic components. Thermal Pad was made by using nano-silver as main material. Nano-silver silica films were applied on PLCC using a sol-gel process and heat-treated at different temperatures. In electronic industry, the electronic components that exceed 70°C will malfunction and damage due to the overheated. The design is used nano-silver as main material in thermo pad because it has high value of thermal conductivity and enables to dissipate heat very efficiently. The advantages of this product are enables to reduce junction temperature of PLCC 20-30%. It also had constant thickness in order to get accurate results. It was a new technology that been applied in electronic industry in order to reduce the temperature of the electronic components. © (2013) Trans Tech Publications, Switzerland.


Abidin A.B.Z.,UiTM Shah Alam | Manurung Y.H.,UiTM Shah Alam
Applied Mechanics and Materials | Year: 2013

This paper presents an investigation on hot forging process using simulation and experimental study. The product to be investigated was water meter housing made of material CuZn40Pb2. In the simulation part, Finite Volume Method (FVM) was applied by using commercial FEM/FVM software SIMUFACT version 10.0 and material database MATILDA. The simulation parameters followed the actual setting under consideration of the machine characteristic and friction. The simulation was further verified using crank-pressed forging machine with graphite lubrication. As the final result, the comparison defect of "folds and laps" between simulation and experiment is presented. It can be concluded that this simulation software offered fast solution analysis time in prediction of forging defects within good agreement between simulation and experiment. © (2013) Trans Tech Publications, Switzerland.


Sarnin S.S.,UiTM Shah Alam | Sulong S.M.,UiTM Shah Alam
Lecture Notes in Electrical Engineering | Year: 2016

This paper is focusing on the performance of the proposed extended MIMO channel model based on 3D wave scattering with NLMS channel estimator using simulations, in the context of communication system with MIMO antenna operating in outdoor and indoor environments. Different training rates and different Doppler frequencies are used to track time-variations of the channel. The adaptive algorithm is namely Least Means Square (LMS) algorithm and normalized LMS (NLMS). The performance is evaluated in system BER, for different Doppler frequencies (correspond to different mobility speeds). Simulation results have demonstrated that time-domain adaptive channel estimation and tracking in MIMO OFDM systems based on the DD-NLMS is very effective in slowly to moderate time-varying fading channels. This paper provides analysis, evaluation and computer simulations in MATLAB. © Springer International Publishing Switzerland 2016.

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