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Shah Alam, Malaysia

Mazlan M.,UiTM Pulau Pinang | Rahim A.,UiTM Shah Alam | Iqbal M.A.,UiTM Pulau Pinang | Mustafa Al Bakri A.M.,University Malaysia Perlis | And 2 more authors.
Advanced Materials Research | Year: 2013

The paper present the three dimensional numerical analysis of heat and fluid flow through Plastic Leaded Chip Carrier (PLCC) packages in inline orientation horizontally mounted on a printed circuit board in a wind tunnel is carried out using a commercial CFD code, FLUENT™ by using Epoxy Moulding Compound (EMC) as a main material. The study was made for four and eight packages with different Reynolds Number and package chip powers. The results are presented in term of junction temperature for four and eight PLCC package under different conditions. It is observed the chip temperatures of eight PLCC packages have higher junction temperature compare to four PLCC packages due to effect of other PLCC because of space and gap between PLCC that have more number of PLCC is smaller. Hence it makes junction temperature of eight PLCC higher compare to four PLCC packages. Moreover, the junction temperature of the packages decreases with increase in Reynolds Number. © (2013) Trans Tech Publications, Switzerland. Source


Mazlan M.,UiTM Pulau Pinang | Rahim A.,UiTM Shah Alam | Iqbal M.A.,UiTM Pulau Pinang | Mustafa Al Bakri A.M.,University Malaysia Perlis | And 2 more authors.
Advanced Materials Research | Year: 2013

Plastic Leaded Chip Carrier (PLCC) package has been emerged a promising option to tackle the thermal management issue of micro-electronic devices. In the present study, three dimensional numerical analysis of heat and fluid flow through PLCC packages oriented in-line and mounted horizontally on a printed circuit board, is carried out using a commercial CFD code, FLUENT™. The simulation is performed for 12 PLCC under different inlet velocities and chip powers. The contours of average junction temperatures are obtained for each package under different conditions. It is observed that the junction temperature of the packages decreases with increase in inlet velocity and increases with chip power. Moreover, the increase in package density significantly contributed to rise in temperature of chips. Thus the present simulation demonstrates that the chip density (the number of packages mounted on a given area), chip power and the coolant inlet velocity are strongly interconnected; hence their appropriate choice would be crucial. © (2013) Trans Tech Publications, Switzerland. Source


As-received samples of an austenitic stainless steel AISI 304 type was welded by Gas metal arc welding (GMAW) robotic operation process using ER308L-Si filler metal wire. Two different atmospheres were used: 68% Argon plus 32% CO2, and 100% Argon. The aim of this study is investigates the influence of quenching heat treatment on the mechanical and microstructure properties of AISI 304 type which welded by GMAW under different shielding gas compositions. The fractured surfaces of the tensile test specimens examined using scanning electron microscopy (S.E.M). The results showed that the welding using shielding gas of 68% Argon plus 32% CO2 stronger than 100% Argon. After performed quenching heat treatment process, both specimens experienced a slight decreased in hardness. © (2014) Trans Tech Publications, Switzerland. Source


Mazlan M.,UiTM Pulau Pinang | Rahim A.,UiTM Shah Alam | Mustafa Al Bakri A.M.,University Malaysia Perlis | Iqbal M.A.,UiTM Pulau Pinang | And 2 more authors.
Advanced Materials Research | Year: 2013

Thermal pad is new technology in the world that been used in PLCC in order to reduce junction temperature to the minimum level in electronic components. Thermal Pad was made by using nano-silver as main material. Nano-silver silica films were applied on PLCC using a sol-gel process and heat-treated at different temperatures. In electronic industry, the electronic components that exceed 70°C will malfunction and damage due to the overheated. The design is used nano-silver as main material in thermo pad because it has high value of thermal conductivity and enables to dissipate heat very efficiently. The advantages of this product are enables to reduce junction temperature of PLCC 20-30%. It also had constant thickness in order to get accurate results. It was a new technology that been applied in electronic industry in order to reduce the temperature of the electronic components. © (2013) Trans Tech Publications, Switzerland. Source


Ikhsan N.,UiTM Shah Alam | Ramli R.,University of Malaya | Alias A.,Perusahaan Otomobil National PROTON
Jurnal Teknologi | Year: 2015

In this paper, the optimum setting for suspension hard points was determined from a half vehicle suspension system. These optimized values were obtained by considering the Kinematic and Compliance (K&C) effects of a verified PROTON WRM 44 P0-34 suspension model developed using MSC/ADAMS/CAR. For optimization process, multi body dynamic software, MSC/ADAMS/INSIGHT and Design of Experiment (DoE) method was employed. There were total of 60 hard points (factors) in x, y and z axis-direction for both front and rear suspension while toe, camber and caster change were selected as the objective function (responses) to be minimized. The values of 5 mm, 10 mm and 15 mm were used as relative values of factor setting to determine the factor range during optimization process. The hard point axis-direction that has the most effects on the responses was identified using the Pareto chart to optimize while the rests were eliminated. As expected result, a new set of suspension system model with a selected of Kinematic and Compliance (K&C) data set were obtained, and compared with the verified simulation data when subjected to the vertical parallel movement simulation test to determine the best setting and optimum suspension hard points configuration. © 2015 Penerbit UTM Press. All rights reserved. Source

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