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News Article | May 8, 2017
Site: news.yahoo.com

The Galaxy S8 is a phone that’s supposed to double down on quality, since it’s the first flagship to come out after last year’s Galaxy Note 7 disaster. So far, there have not been any major issues with the handset, although Galaxy S8 users have witnessed various minor problems with the phone such as the screen’s red tint, Wi-Fi connectivity troubles, and unexpected restarts. But now, a new report indicates that Samsung may have been lying to you about one of the phone’s most important components. Don't Miss: Amazon just discounted the Echo for the first time in 2017 The Galaxy S8 features built-in UFS 2.1 storage, which is Samsung’s fastest flash storage for mobile devices. However, SamMobile discovered that Samsung has quietly removed the mention of UFS 2.1 storage from the Galaxy S8’s specifications page. Initially, Samsung’s Galaxy S8 page said the Galaxy S8 phones ship with UFS 2.1 storage, although a fine print said that storage “may differ by country and carrier.” Samsung has since removed the UFS 2.1 mention completely. Galaxy S8 buyers posting on xda-developers discovered that the Galaxy S8 version that is powered by the Snapdragon 835 processor gets slower UFS 2.0 storage. Yes, that’s the US version of Samsung’s new flagship phone, which we’ve already seen is slower than the global model. SamMobile adds that the UFS 2.1 storage delivers 800MB/s sequential read speeds, which is 300MB/s quicker than UFS 2.0’s performance. That’s not to say you’ll notice any performance issues with UFS 2.0 memory during regular use. After all, previous Galaxy S versions also shipped with UFS 2.0 storage on board. But it doesn’t mean that Samsung should be able to quietly change that particular detail, especially since many people reporting on and/or reviewing the phone may have delivered wrong information about the phone — that it sports high-speed UFS 2.1 storage when that’s not always the case. Samsung isn’t the only company to have been caught lying about a phone’s specs. In fact just a few weeks ago, Huawei had to publicly address similar criticism. The company’s CEO Richard Yu explained that the company used slower eMMC flash and high-speed UFS storage in the Huawei P10 because of component shortages. However, the Chinese smartphone maker also advertised its latest smartphone as a device that would deliver speedy UFS storage, before removing the mention of UFS memory from its website. See the original version of this article on BGR.com


News Article | May 12, 2017
Site: www.businesswire.com

FORT MILL, S.C.--(BUSINESS WIRE)--Domtar Corporation (NYSE: UFS) (TSX: UFS) a annoncé aujourd’hui que Monsieur John D. Williams, président et chef de la direction, fera une présentation à la conférence « Basic Materials » de Goldman Sachs qui se tiendra à New York, le mercredi 17 mai 2017, à 10 h 35 (HE). La présentation sera retransmise en direct et accessible dans la section investisseurs du site de la Société Domtar au : www.domtar.com À propos de Domtar Domtar est un important fournisseur d'une grande variété de produits à base de fibre, dont des papiers de communication, de spécialité et d’emballage, de la pâte commerciale, ainsi que des produits hygiéniques absorbants. Comptant près de 10 000 employés au service de clients dans plus de 50 pays, Domtar est animée par la volonté de transformer la fibre de bois durable en produits utiles sur lesquels les gens peuvent compter au quotidien. Les ventes annuelles de Domtar s'élèvent à près de 5,1 milliards de dollars, et ses actions ordinaires sont cotées aux bourses de New York et de Toronto. Le bureau administratif principal de Domtar se trouve à Fort Mill, en Caroline du Sud. Pour en savoir davantage, visitez www.domtar.com.


News Article | May 12, 2017
Site: www.prweb.com

Protocol Insight announces the availability of the Falcon v1.1 SW/FW with the unique Trace Validation and Events view capabilities. With v1.1 software Falcon now offers full support for UFS compliance testing of embedded UFS2.1, the UFS 2.1 external card and the UFSA CTM1.2. This release also adds enhanced analyzer and exerciser features. Trace Validation is an expert system that uses state machine logic to analyze captured traces algorithmically without user intervention. It analyzes UFS and UniPro traffic for any deviations from the UFS or UniPro specifications or any other abnormalities of interest to the engineer, and presents the results linked to the packet listing windows for complete debug. Events view displays events on the bus in a unique time-aligned display, allowing the engineer to easily drill down from the highest level trace view to the lowest level M-PHY primitives. UFS compliance verifies embedded UFS2.1 and UFS 2.1 external cards to the CTS test cases in JESD224 as modified for JESD220B, JESD220C and JESD220-2. The Falcon v1.1 release adds support for 244 CTS test cases, including JESD224 compliant test cases, errata test cases and preliminary embedded UFS2.1 and UFS2.1 external card CTS test cases. With both stimulus tests and Trace Validation analysis tests, a total of 491 tests are provided. The previous v1.0 release provided support for 50 UniPro CTS test cases with 99 stimulus and Trace Validation analysis tests, as well as 14 UniPro Debug Trace Validation tests and 1 other Trace Validation test. New analyzer features with v1.1 include: 1. Simple Trigger on all UniPro and UFS packet types and payloads, from M-PHY primitives to UFS SCSI and Protocol. 2. Simple Packet Search of all UniPro and UFS packet headers and payloads. 3. Performance enhancements and multi-lane support for Events view. 4. Trace Validation™ for UFS, using pre-existing Trace Validation analysis tests from the Falcon software library. New Exerciser features include: 1. JEDEC JESD224 and UFSA CTM v1.2 support. 2. Stimulus error injection for UFS and UniPro. 3. Additional test executive UFS device configuration and control. Pricing, configuration and availability: The Falcon G300/G350 series UFS/UniPro Exerciser/Analyzer instruments are shipping now. Contact sales(at)protocolinsight(dot)com for pricing information or to request a demo. About Protocol Insight: Protocol Insight (http://www.protocolinsight.com) offers test and measurement software tools to customers who are developing products for the mobile computing market, and consulting and design services to engineers implementing serial protocol interfaces. Protocol Insight is a MIPI expert, with a background in both D-PHY and M-PHY protocol exercisers and analyzers. Protocol Insight contributes to the development of the UniPro standard thru the UniPro and Test Working Groups, and serves as Liaison between MIPI and JEDEC and UFSA. About UFSA The Universal Flash Storage Association (UFSA) was founded in 2010 as an open trade association to promote widespread adoption and acceptance of the UFS standard. Board of Director members include Keysight Technologies, Micron Technology, Montage Technology, Phison Electronics, Samsung Electronics, Silicon Motion Technology, SK Hynix and Tuxera. About the MIPI Alliance The MIPI Alliance is a global, collaborative organization comprised of companies that span the mobile ecosystem and are committed to defining and promoting interface specifications for mobile devices. The MIPI® Alliance is a non-profit corporation that operates as an open membership organization. All companies in the mobile device industry are encouraged to join, including semiconductor companies, software vendors, IP providers, peripheral manufacturers, test labs and end product OEMs. Today, more than 250 member companies actively participate in the Alliance, developing interface specifications which drive consistency in processor and peripheral interfaces, promoting reuse and compatibility in mobile devices. MIPI and the MIPI logo are a licensed trademark of the MIPI Alliance. JEDEC® and the JEDEC logo are registered trademarks of JEDEC Solid State Technology Association.


News Article | May 12, 2017
Site: www.businesswire.com

FORT MILL, S.C.--(BUSINESS WIRE)--Domtar Corporation (NYSE: UFS) (TSX: UFS) today announced that Mr. John D. Williams, President and Chief Executive Officer, will present at the Goldman Sachs Basic Materials Conference in New York, NY on Wednesday, May 17, 2017 at 10:35 a.m. (ET). The presentation will be webcast and can be accessed in the Investors section of the Domtar corporate website at www.domtar.com About Domtar Domtar is a leading provider of a wide variety of fiber-based products including communication, specialty and packaging papers, market pulp and absorbent hygiene products. With approximately 10,000 employees serving more than 50 countries around the world, Domtar is driven by a commitment to turn sustainable wood fiber into useful products that people rely on every day. Domtar’s annual sales are approximately $5.1 billion and its common stock is traded on the New York and Toronto Stock Exchanges. Domtar’s principal executive office is in Fort Mill, South Carolina. To learn more, visit www.domtar.com.


News Article | May 16, 2017
Site: www.businesswire.com

FORT MILL, S.C.--(BUSINESS WIRE)--Domtar Corporation today announced that its Board of Directors has declared a quarterly dividend on its common stock (NYSE: UFS) (TSX: UFS). The dividend of US$0.415 per share is payable on July 17, 2017 to stockholders of record on July 3, 2017. About Domtar Domtar is a leading provider of a wide variety of fiber-based products including communication, specialty and packaging papers, market pulp and absorbent hygiene products. With approximately 10,000 employees serving more than 50 countries around the world, Domtar is driven by a commitment to turn sustainable wood fiber into useful products that people rely on every day. Domtar’s annual sales are approximately $5.1 billion, and its common stock is traded on the New York and Toronto Stock Exchanges. Domtar’s principal executive office is in Fort Mill, South Carolina. To learn more, visit www.domtar.com.


News Article | May 17, 2017
Site: www.businesswire.com

SUNNYVALE, Calif.--(BUSINESS WIRE)--Rambus Inc. (NASDAQ:RMBS), today announced it is collaborating with PLDA, the industry leader in PCI Express® controller IP solutions, and Avery Design Systems Inc., an innovator in functional verification productivity solutions, to offer a comprehensive, silicon-proven PCI Express (PCIe) 4.0 solution, with backward compatibility to PCIe 3.0 and 2.0. The new PCIe sub-system includes a Rambus SerDes PHY, a PLDA PCIe controller and Avery Design’s verification IP. The solution is pre-verified and validated for simple integration into application-specific integrated circuits (ASICS). “Our collaboration with PLDA and Avery Design offers customers a complete, pre-verified PCIe sub-system, with silicon-proven SerDes and a PCIe controller,” said Luc Seraphin, senior vice president and general manager of the Rambus Memory and Interfaces Division. “Our line-up of SerDes PHYs is optimized for power and efficiency, delivering maximum performance and flexibility for today’s most challenging systems for a variety of applications including networking, data center and high-performance computing.” “Our new solution enables designers to quickly bring their products to market using a sub-system that combines the expertise of proven industry leaders, including Rambus, for their broad portfolio of PHYs, and Avery, for their comprehensive verification solutions," said Arnaud Schleich, CEO at PLDA. “This platform, which supports endpoint, root port and switch applications, demonstrates the high-quality of our PCI Express IP cores, solving performance and integration issues in the market.” “We are excited to team with PLDA and Rambus to offer designers a complete, pre-validated sub-system solution to get their PCIe solution to market,” said Chris Browy, vice president of Sales and Marketing at Avery Design. “Pre-qualifying the new PCIe solution with Avery’s VIP solutions enables customers to reduce verification cycles and implementation risks for their PCI Express solution.” For additional information on Rambus SerDes PHY, please visit rambus.com/serdes. The new PCIe solution is now available worldwide in leading CMOS processes. For more information, please visit https://www.rambus.com/memory-and-interfaces/serdes/pcie-phy. Rambus creates innovative hardware and software technologies, driving advancements from the data center to the mobile edge. Our chips, customizable IP cores, architecture licenses, tools, software, services, training and innovations improve the competitive advantage of our customers. We collaborate with the industry, partnering with leading ASIC and SoC designers, foundries, IP developers, EDA companies and validation labs. Our products are integrated into tens of billions of devices and systems, powering and securing diverse applications, including Big Data, Internet of Things (IoT), mobile payments, and smart ticketing. At Rambus, we are makers of better. For more information, visit rambus.com. PLDA has been successfully delivering PCI and PCI Express IP for 20 years. With over 6,200 licenses, PLDA has established a vast customer base and the world’s broadest PCIe ecosystem. PLDA has maintained its leadership over four generations of PCI Express specifications, enabling customers to reduce risk and accelerate time to market for their ASIC and FPGA based designs. PLDA provides a complete PCIe solution with its IP cores, FPGA boards for ASIC prototyping, PCIe BFM/testbench, PCIe drivers and APIs. PLDA is a global company with offices in North America (San Jose, California) and Europe (France, Italy, Bulgaria). Founded in 1999, Avery Design Systems, Inc. enables system and SOC design teams to achieve dramatic functional verification productivity improvements through the use of formal analysis applications for RT-level and gate-level X verification; robust core-through-chip-level Verification IP for PCI Express, USB, AMBA, UFS, Unipro, CSI-2/DSI-2, Soundwire, Sensewire, DDR/LPDDR, HBM, HMC, ONFI/Toggle, NVM Express, SAS, SATA, eMMC, SD/SDIO, CAN FD, LIN, FlexRay, HDMI, and DisplayPort standards. The company is a member of the Mentor Graphics Value Added Partnership (VAP) program and has established numerous Avery Design VIP partner program affiliations with leading IP suppliers. More information about the company may be found at www.avery-design.com.


News Article | May 23, 2017
Site: globenewswire.com

Dublin, May 23, 2017 (GLOBE NEWSWIRE) -- Research and Markets has announced the addition of the "NAND Insights Q1/17: MobileAgain" report to their offering. Strong demand from mobile contributed to the NAND shortage in 2H/16. It looks like history will repeat itself in 2017. This report provides a forecast of the supply-demand and application drivers for NAND flash memory out to 2021. Information on the following areas in included in this report: - NAND Flash Forecast - NAND Flash Revenue Trend - NAND Supplier Profitability - and more... This reports comes as a 27 page powerpoint presentation and an excel spreadsheet. Key Topics Covered: NAND Flash Forecast NAND Flash Revenue Trend - NAND Supplier Profitability - Capex - Wafer Capacity - Vendor Status - Technology Mix - Product Mix - 3bpc by Applications - 3D NAND by Applications Demand Flash Cards - USB Drives - Smartphones - Tablets - eMMC/UFS - SSDs - Applications Forecast Supply-Demand Pricing - Summary Excel File TOC - Revisions - Changes - Overview - NAND Supplier Operating Margin - Revenues - $ per GB - Capex - Supply-Demand - Applications - e-Reader - eMMC - Flash Cards - Mobile Phone - Smartwatch - Smart TV - SSD - Tablet - USB Flash Drives - Wafer Capacity - Bits by Vendor - Samsung - Toshiba - SanDisk - SK Hynix - Micron - Intel - Macronix - Powerchip - Winbond - YRST - ASP - eMMC Pricing - Overview Charts - Demand Charts - Supply Charts For more information about this report visit http://www.researchandmarkets.com/research/4cf54j/nand_insights


News Article | May 23, 2017
Site: globenewswire.com

Dublin, May 23, 2017 (GLOBE NEWSWIRE) -- Research and Markets has announced the addition of the "NAND Insights Q1/17: MobileAgain" report to their offering. Strong demand from mobile contributed to the NAND shortage in 2H/16. It looks like history will repeat itself in 2017. This report provides a forecast of the supply-demand and application drivers for NAND flash memory out to 2021. Information on the following areas in included in this report: - NAND Flash Forecast - NAND Flash Revenue Trend - NAND Supplier Profitability - and more... This reports comes as a 27 page powerpoint presentation and an excel spreadsheet. Key Topics Covered: NAND Flash Forecast NAND Flash Revenue Trend - NAND Supplier Profitability - Capex - Wafer Capacity - Vendor Status - Technology Mix - Product Mix - 3bpc by Applications - 3D NAND by Applications Demand Flash Cards - USB Drives - Smartphones - Tablets - eMMC/UFS - SSDs - Applications Forecast Supply-Demand Pricing - Summary Excel File TOC - Revisions - Changes - Overview - NAND Supplier Operating Margin - Revenues - $ per GB - Capex - Supply-Demand - Applications - e-Reader - eMMC - Flash Cards - Mobile Phone - Smartwatch - Smart TV - SSD - Tablet - USB Flash Drives - Wafer Capacity - Bits by Vendor - Samsung - Toshiba - SanDisk - SK Hynix - Micron - Intel - Macronix - Powerchip - Winbond - YRST - ASP - eMMC Pricing - Overview Charts - Demand Charts - Supply Charts For more information about this report visit http://www.researchandmarkets.com/research/4cf54j/nand_insights


Noninterest income was $2.73 million for the quarter ended March 31, 2017, compared to $2.64 million in the prior year quarter. This increase was the result of higher service charge revenue as well as increased income from the sale and servicing of our secondary market loan portfolio. This increase was offset by a slight decline in revenues contributed by the Bank's investments in UFS, LLC and Ansay & Associates, LLC. Noninterest expense was $6.35 million for the first quarter of 2017, up from $6.01 million for the first quarter of 2016. Salary expense increased $0.25 million, or 7%, year-over-year as the Bank continued to add quality bankers to serve our growing customer base. Data processing costs increased $0.08 million, or 15%, year-over-year as we invest in technology to provide our customers with innovative banking alternatives. The Bank's efficiency ratio, a measure of how well resources are utilized by an institution, remained very strong at 49.3%. "We are excited to report continued earnings growth fueled by increasing deposits and loans one relationship at a time," said Mike Molepske, Chief Executive Officer. "We have experienced year-over-year growth in every market we serve. Our Appleton office, in its first year of operation, paced the bank with an increase of nearly $11 million in deposits, 20% of the bank's overall deposit growth. Our Bellevue office, near Green Bay, grew loans by over $22 million to lead our bank in that area." Total assets were $1.29 billion at March 31, 2017, up 6% from $1.22 billion at March 31, 2016. The Corporation's Board of Directors approved a quarterly cash dividend of $0.16 per common share, equaling the prior quarter and representing an increase of 14.3% from the dividend declared one year earlier. The dividend is payable on July 6, 2017, to shareholders of record as of June 29, 2017. For further information, contact: Kevin M LeMahieu, Chief Financial Officer Phone: (920) 652-3200 klemahieu@bankfirstnational.com To view the original version on PR Newswire, visit:http://www.prnewswire.com/news-releases/bank-first-reports-quarterly-earnings-per-share-of-064-declares-a-per-share-cash-dividend-of-016-300443565.html


News Article | April 26, 2017
Site: www.gizmag.com

Last week, Asus officially released its home-cooked project board challenge to the immensely popular Raspberry Pi in the shape of the Tinker Board. Now another big player has joined the fray, but a high price tag will likely keep Huawei's HiKey 960 way beyond the reach of many makers, hobbyists and amateur enthusiasts. It does impress in the specs department though. The HiKey 960 board is aimed at Android developers, rather than DIY makers, and is priced accordingly at US$240. For that money, the single board computer is treated to a Huawei Kirin 960 octa-core ARM processor with four high performance Cortex-A73 cores (2.4 GHz) and four low power Cortex-A53 cores (1.8 GHz) – as found in Huawei's Mate 9 smartphone. By comparison, the Pi 3 Model B rocks a 1.2 GHz quad core A53 processor, while the Tinker Board has a 1.8 GHz RK3288 quad core SoC at its heart. The Kirin 960 chip features a 900 MHz Mali-G71 MP8 GPU that was developed for smooth premium gaming and mobile VR applications, as well as H.264/H.265 UHD content (though the included HDMI 1.2a port is only capable of supporting output at up to 1080p). The 85 x 55 mm board comes with 32 GB of UFS 2.1 flash storage, microSD media expansion, and 3 GB of LPDDR4 RAM. Connectivity shapes up as one USB 2.0 Type C OTG port and two USB 3.0 Type A host ports, Bluetooth 4.1 and dual-band 802.11b/g/n/ac Wi-Fi. The HiKey includes two expansion interfaces – a 40-pin low speed connector and a 60-pin high speed connector – for hooking up to sensors, switches, motors and LEDs, display screens and cameras. And unlike the Asus and Pi boards, the HiKey 960 isn't powered via USB but by a 12 V/2 A supply plugged into a DC jack. The board supports Android and Linux operating platforms. The impressive-looking, though rather pricey, HiKey 960 development board is available now through LeMaker for US$239.99, and is expected to be locally distributed in the US, EU and Japan early next month.

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