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Taoyuan City, Taiwan

Chen Y.-Y.,Tatung University | Lin Y.-R.,Tatung University | Wu T.-T.,National Taiwan University | Pao S.-Y.,TXC Corporation
2015 IEEE International Ultrasonics Symposium, IUS 2015 | Year: 2015

This study aims at developing an AT-cut quartz resonator with low anchor loss. Phononic crystals are utilized for trapping acoustic energy and reducing anchor loss of the AT-cut quartz resonators. Finite element analyses of the AT-cut quartz resonators with phononic crystals and the lossy epoxy attachments are presented herein. The resonance response of an AT-cut quartz resonator with no phononic crystal was first calculated. A square-lattice phononic crystal plate, made of an AT-cut quartz plate with air holes, was analyzed and designed to have a complete band gap covering the quartz resonator's resonance frequency. Finally, the mode shape and impedance of the quartz resonator with 3 rows of phononic crystals were calculated to evaluate the isolation performance of the phononic crystals. Results show the quartz resonator with the through-hole phononic crystals exhibits a good energy confinement inside electrode area and small impedance. Accordingly, the phononic crystal is verified to be capable of reducing anchor loss in an AT-cut quartz resonator. © 2015 IEEE. Source


Patent
Txc Corporation | Date: 2013-12-12

A package structure of crystal oscillator with embedded thermistor is disclosed. The package structure comprises a ceramic substrate. A crystal oscillation device is mounted in the accommodation space of the ceramic substrate. A cover is used to seal the accommodation space. At least one thermistor is embedded in the ceramic substrate. A patterned metal interconnection in the ceramic substrate is electrically connected with the crystal oscillation device and the thermistor, respectively. The present invention describes as follows: the thermistor is directly embedded in the ceramic substrate to avoid the short-circuit problem caused by electroplating a thermistor exposed and shorten a distance between the thermistor and the crystal oscillation device. Thus, the thermistor can more precisely sense the operating temperature of the crystal oscillation device to timely compensate frequency drift caused by changing the temperature of the crystal oscillation device.


The present invention provides a TSV-based oscillator WLP structure and a method for fabricating the same. The method of the present invention comprises steps: providing a silicon base having an oscillator unit disposed thereon; forming on the silicon base at least one package ring surrounding the oscillator unit; and disposing a silicon cap on the package ring to envelop the oscillator unit. The present invention adopts a cap and a base, which are made of the same material, to effectively overcome the problem of thermal stress occurring in a conventional sandwich package structure. Further, the present invention elaborately designs the wiring on the lower surface of the base to reduce the package size and decrease consumption of noble metals.


Patent
Txc Corporation | Date: 2013-08-16

A package device for a microelectromechanical inertial sensor comprises a ceramic substrate having an upper accommodation space and a lower accommodation and having a plurality of interconnect metal lines thereinside; a microelectromechanical system (MEMS) chip mounted inside the upper accommodation of the ceramic substrate and electrically connected with the interconnect metal lines; a top cover arranged on the ceramic substrate and sealing the upper accommodation space; and an integrated circuit (IC) chip mounted inside the lower accommodation space and electrically connected with the interconnect metal lines. The present invention can improve the reliability of components, increase the yield and decrease the fabrication cost.


Kao S.-H.,TXC Corporation | Tsao M.-F.,TXC Corporation | Chiang C.-W.,TXC Corporation | Chao M.-C.,TXC Ningbo Corporation
Proceedings of the 2014 Symposium on Piezoelectricity, Acoustic Waves and Device Applications, SPAWDA 2014 | Year: 2014

Temperature compensated crystal oscillators (TCXOs) are widely used for mobile communication systems such as personal navigation devices (PNDs) and cell phones. Recently, wearable devices strongly require electronic components inside them to be smaller and thinner. Besides, the close-in phase noise and overall frequency stability also need be considerated for GPS/GNSS application. Therefore, this paper demonstrates the ultra-miniature size TCXO with H-type package to meet such requirements. © 2014 IEEE. Source

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