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News Article | April 25, 2017
Site: marketersmedia.com

Global Printed Circuit Board Industry Report covering market by types, Regions, Application, and leading vendor’s profile based on sales, price, sales regions, products, profile etcPune, India - April 25, 2017 /MarketersMedia/ — Global Printed Circuit Board Market 2012- 2022 Report provides detailed analysis of market in 9 chapters with required tables and figures. Access this report at https://www.themarketreports.com/report/global-printed-circuit-board-market-research-2011-2022 Global Printed Circuit Board Market report classifies Printed Circuit Board types as R-PCB, FPC, HDI and ICS. Applications covered in this report are Automotive Communications Computers and Consumer Electronics. This report also provides key analysis for the geographical regions like Europe, North America, China, Japan & Korea. Companies like Nippon Mektron, Zhen Ding Technology, Unimicron, Young Poong Group, Samsung Electro-Mechanics, Ibiden, Tripod, TTM Technologies, Sumitomo Electric SEI, Daeduck Group, Nanya PCB, Compeq, Viasystems, HannStar Board, LG Innotek and more are profiled in this report providing information on sale, price, sales regions, products and overview. Purchase a copy of this report at: https://www.themarketreports.com/report/buy-now/483918 Table of Contents: 1 Market Overview 1.1 Objectives of Research 1.2 Market Segment 2 Industry Chain 2.1 Industry Chain Structure 2.2 Upstream 2.3 Market 3 Environmental Analysis 3.1 Policy 3.2 Economic 3.3 Technology 3.4 Market Entry 4 Major Vendors 5 Market/Vendors Distribution 5.1 Regional Distribution 5.2 Product and Application 6 Regions Market 6.1 Global 6.2 Europe 6.3 North America 6.4 China 6.5 Japan & Korea 6.6 Trade 7 Forecast 7.1 Market Trends 7.2 Segment Forecast 8 Marketing Overview 8.1 Ex-factory Price 8.2 Buyer Price 8.3 Price Factors 8.4 Marketing Channel 9 Conclusion Inquire more about this report at: https://www.themarketreports.com/report/ask-your-query/483918 Contact Info:Name: Shirsh GuptaEmail: sales@themarketreports.comOrganization: The Market ReportsAddress: SF-29, Sacred World, Wanawadi, PunePhone: 6314071315Source URL: http://marketersmedia.com/global-printed-circuit-board-market-is-estimated-to-reach-65-8-billion-usd-in-2017/189854For more information, please visit https://www.themarketreports.com/report/global-printed-circuit-board-market-research-2011-2022Source: MarketersMediaRelease ID: 189854


This report studies HDI PCB in Global Market, especially in North America, Europe, China, Japan, Korea and Taiwan, focuses on top manufacturers in global market, with production, price, revenue and market share for each manufacturer, covering  IBIDEN Group  Unimicron  AT&S  SEMCO  NCAB Group  Young Poong Group  ZDT  Compeq  Unitech Printed Circuit Board Corp.  LG Innotek  Tripod Technology  TTM Technologies  Daeduck  HannStar Board  Nan Ya PCB  CMK Corporation  Kingboard  Ellington  CCTC  Wuzhu Technology  Kinwong  Aoshikang  Sierra Circuits  Bittele Electronics  Epec  Würth Elektronik  NOD Electronics  San Francisco Circuits  PCBCart  Advanced Circuits  Market Segment by Regions, this report splits Global into several key Regions, with production, consumption, revenue, market share and growth rate of HDI PCB in these regions, from 2011 to 2021 (forecast), like  North America  Europe  China  Japan  Korea  Taiwan  Split by product type, with production, revenue, price, market share and growth rate of each type, can be divided into  Type I  Type II  Type III  Split by application, this report focuses on consumption, market share and growth rate of HDI PCB in each application, can be divided into  Automotive (Engine Control Units, GPS, Dashboard Electronics)  Computers (Laptops, Tablets, Wearable Electronics, Internet of Things - IoT)  Communication (Mobile phones, Modules, Routers, Switches)  Digital (Cameras, Audio, Video)  Other electronic products Global HDI PCB Market Research Report 2016  1 HDI PCB Market Overview  1.1 Product Overview and Scope of HDI PCB  1.2 HDI PCB Segment by Type  1.2.1 Global Production Market Share of HDI PCB by Type in 2015  1.2.2 Type I  1.2.3 Type II  1.2.4 Type III  1.3 HDI PCB Segment by Application  1.3.1 HDI PCB Consumption Market Share by Application in 2015  1.3.2 Automotive (Engine Control Units, GPS, Dashboard Electronics)  1.3.3 Computers (Laptops, Tablets, Wearable Electronics, Internet of Things - IoT)  1.3.4 Communication (Mobile phones, Modules, Routers, Switches)  1.3.5 Digital (Cameras, Audio, Video)  1.3.6 Other electronic products  1.4 HDI PCB Market by Region  1.4.1 North America Status and Prospect (2011-2021)  1.4.2 Europe Status and Prospect (2011-2021)  1.4.3 China Status and Prospect (2011-2021)  1.4.4 Japan Status and Prospect (2011-2021)  1.4.5 Korea Status and Prospect (2011-2021)  1.4.6 Taiwan Status and Prospect (2011-2021)  1.5 Global Market Size (Value) of HDI PCB (2011-2021) 2 Global HDI PCB Market Competition by Manufacturers  2.1 Global HDI PCB Production and Share by Manufacturers (2015 and 2016)  2.2 Global HDI PCB Revenue and Share by Manufacturers (2015 and 2016)  2.3 Global HDI PCB Average Price by Manufacturers (2015 and 2016)  2.4 Manufacturers HDI PCB Manufacturing Base Distribution, Sales Area and Product Type 2.5 HDI PCB Market Competitive Situation and Trends  2.5.1 HDI PCB Market Concentration Rate  2.5.2 HDI PCB Market Share of Top 3 and Top 5 Manufacturers  2.5.3 Mergers & Acquisitions, Expansion 3 Global HDI PCB Production, Revenue (Value) by Region (2011-2016)  3.1 Global HDI PCB Production by Region (2011-2016)  3.2 Global HDI PCB Production Market Share by Region (2011-2016)  3.3 Global HDI PCB Revenue (Value) and Market Share by Region (2011-2016)  3.4 Global HDI PCB Production, Revenue, Price and Gross Margin (2011-2016)  3.5 North America HDI PCB Production, Revenue, Price and Gross Margin (2011-2016)  3.6 Europe HDI PCB Production, Revenue, Price and Gross Margin (2011-2016)  3.7 China HDI PCB Production, Revenue, Price and Gross Margin (2011-2016)  3.8 Japan HDI PCB Production, Revenue, Price and Gross Margin (2011-2016)  3.9 Korea HDI PCB Production, Revenue, Price and Gross Margin (2011-2016)  3.10 Taiwan HDI PCB Production, Revenue, Price and Gross Margin (2011-2016) For more information or any query mail at [email protected]


— Multilayer printed-wiring boards are made from the same base material with copper foil on the top & bottom and one or more“inner layer”cores. The number of “layers” corresponds to the number of copper foil layers. Scope of the Report: This report focuses on the Multilayer Printed-wiring Board in Global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application. For more information or any query mail at sales@wiseguyreports.com Market Segment by Regions, regional analysis covers North America (USA, Canada and Mexico) Europe (Germany, France, UK, Russia and Italy) Asia-Pacific (China, Japan, Korea, India and Southeast Asia) South America, Middle East and Africa Market Segment by Applications, can be divided into Consumer electronics Communications Computer related industry Automotive industry Others 2 Manufacturers Profiles 2.1 Nippon Mektron 2.1.1 Business Overview 2.1.2 Multilayer Printed-wiring Board Type and Applications 2.1.2.1 Type 1 2.1.2.2 Type 2 2.1.3 Nippon Mektron Multilayer Printed-wiring Board Sales, Price, Revenue, Gross Margin and Market Share 2.2 Zhen Ding Technology 2.2.1 Business Overview 2.2.2 Multilayer Printed-wiring Board Type and Applications 2.2.2.1 Type 1 2.2.2.2 Type 2 2.2.3 Zhen Ding Technology Multilayer Printed-wiring Board Sales, Price, Revenue, Gross Margin and Market Share 2.3 Unimicron 2.3.1 Business Overview 2.3.2 Multilayer Printed-wiring Board Type and Applications 2.3.2.1 Type 1 2.3.2.2 Type 2 2.3.3 Unimicron Multilayer Printed-wiring Board Sales, Price, Revenue, Gross Margin and Market Share 2.4 Young Poong Group 2.4.1 Business Overview 2.4.2 Multilayer Printed-wiring Board Type and Applications 2.4.2.1 Type 1 2.4.2.2 Type 2 2.4.3 Young Poong Group Multilayer Printed-wiring Board Sales, Price, Revenue, Gross Margin and Market Share 2.5 Samsung Electro-Mechanics 2.5.1 Business Overview 2.5.2 Multilayer Printed-wiring Board Type and Applications 2.5.2.1 Type 1 2.5.2.2 Type 2 2.5.3 Samsung Electro-Mechanics Multilayer Printed-wiring Board Sales, Price, Revenue, Gross Margin and Market Share 2.6 Ibiden 2.6.1 Business Overview 2.6.2 Multilayer Printed-wiring Board Type and Applications 2.6.2.1 Type 1 2.6.2.2 Type 2 2.6.3 Ibiden Multilayer Printed-wiring Board Sales, Price, Revenue, Gross Margin and Market Share 2.7 Tripod 2.7.1 Business Overview 2.7.2 Multilayer Printed-wiring Board Type and Applications 2.7.2.1 Type 1 2.7.2.2 Type 2 2.7.3 Tripod Multilayer Printed-wiring Board Sales, Price, Revenue, Gross Margin and Market Share 2.8 TTM Technologies 2.8.1 Business Overview 2.8.2 Multilayer Printed-wiring Board Type and Applications 2.8.2.1 Type 1 2.8.2.2 Type 2 2.8.3 TTM Technologies Multilayer Printed-wiring Board Sales, Price, Revenue, Gross Margin and Market Share 2.9 Sumitomo Electric SEI 2.9.1 Business Overview 2.9.2 Multilayer Printed-wiring Board Type and Applications 2.9.2.1 Type 1 2.9.2.2 Type 2 2.9.3 Sumitomo Electric SEI Multilayer Printed-wiring Board Sales, Price, Revenue, Gross Margin and Market Share 2.10 Daeduck Group 2.10.1 Business Overview 2.10.2 Multilayer Printed-wiring Board Type and Applications 2.10.2.1 Type 1 2.10.2.2 Type 2 2.10.3 Daeduck Group Multilayer Printed-wiring Board Sales, Price, Revenue, Gross Margin and Market Share 2.11 Nanya PCB 2.11.1 Business Overview 2.11.2 Multilayer Printed-wiring Board Type and Applications 2.11.2.1 Type 1 2.11.2.2 Type 2 2.11.3 Nanya PCB Multilayer Printed-wiring Board Sales, Price, Revenue, Gross Margin and Market Share 2.12 Compeq 2.12.1 Business Overview 2.12.2 Multilayer Printed-wiring Board Type and Applications 2.12.2.1 Type 1 2.12.2.2 Type 2 2.12.3 Compeq Multilayer Printed-wiring Board Sales, Price, Revenue, Gross Margin and Market Share 2.13 HannStar Board 2.13.1 Business Overview 2.13.2 Multilayer Printed-wiring Board Type and Applications 2.13.2.1 Type 1 2.13.2.2 Type 2 2.13.3 HannStar Board Multilayer Printed-wiring Board Sales, Price, Revenue, Gross Margin and Market Share 2.14 LG Innotek 2.14.1 Business Overview 2.14.2 Multilayer Printed-wiring Board Type and Applications 2.14.2.1 Type 1 2.14.2.2 Type 2 2.14.3 LG Innotek Multilayer Printed-wiring Board Sales, Price, Revenue, Gross Margin and Market Share 2.15 AT&S 2.15.1 Business Overview 2.15.2 Multilayer Printed-wiring Board Type and Applications 2.15.2.1 Type 1 2.15.2.2 Type 2 2.15.3 AT&S Multilayer Printed-wiring Board Sales, Price, Revenue, Gross Margin and Market Share 2.16 Meiko 2.16.1 Business Overview 2.16.2 Multilayer Printed-wiring Board Type and Applications 2.16.2.1 Type 1 2.16.2.2 Type 2 2.16.3 Meiko Multilayer Printed-wiring Board Sales, Price, Revenue, Gross Margin and Market Share 2.17 Chin-Poon 2.17.1 Business Overview 2.17.2 Multilayer Printed-wiring Board Type and Applications 2.17.2.1 Type 1 2.17.2.2 Type 2 2.17.3 Chin-Poon Multilayer Printed-wiring Board Sales, Price, Revenue, Gross Margin and Market Share 2.18 Shennan 2.18.1 Business Overview 2.18.2 Multilayer Printed-wiring Board Type and Applications 2.18.2.1 Type 1 2.18.2.2 Type 2 2.18.3 Shennan Multilayer Printed-wiring Board Sales, Price, Revenue, Gross Margin and Market Share 2.19 WUS 2.19.1 Business Overview 2.19.2 Multilayer Printed-wiring Board Type and Applications 2.19.2.1 Type 1 2.19.2.2 Type 2 2.19.3 WUS Multilayer Printed-wiring Board Sales, Price, Revenue, Gross Margin and Market Share 3 Global Multilayer Printed-wiring Board Market Competition, by Manufacturer 3.1 Global Multilayer Printed-wiring Board Sales and Market Share by Manufacturer 3.2 Global Multilayer Printed-wiring Board Revenue and Market Share by Manufacturer 3.3 Market Concentration Rate 3.3.1 Top 3 Multilayer Printed-wiring Board Manufacturer Market Share 3.3.2 Top 6 Multilayer Printed-wiring Board Manufacturer Market Share 3.4 Market Competition Trend 4 Global Multilayer Printed-wiring Board Market Analysis by Regions 4.1 Global Multilayer Printed-wiring Board Sales, Revenue and Market Share by Regions 4.1.1 Global Multilayer Printed-wiring Board Sales by Regions (2011-2016) 4.1.2 Global Multilayer Printed-wiring Board Revenue by Regions (2011-2016) 4.2 North America Multilayer Printed-wiring Board Sales and Growth (2011-2016) 4.3 Europe Multilayer Printed-wiring Board Sales and Growth (2011-2016) 4.4 Asia-Pacific Multilayer Printed-wiring Board Sales and Growth (2011-2016) 4.5 South America Multilayer Printed-wiring Board Sales and Growth (2011-2016) 4.6 Middle East and Africa Multilayer Printed-wiring Board Sales and Growth (2011-2016) For more information or any query mail at sales@wiseguyreports.com ABOUT US: Wise Guy Reports is part of the Wise Guy Consultants Pvt. Ltd. and offers premium progressive statistical surveying, market research reports, analysis & forecast data for industries and governments around the globe. Wise Guy Reports features an exhaustive list of market research reports from hundreds of publishers worldwide. We boast a database spanning virtually every market category and an even more comprehensive collection of market research reports under these categories and sub-categories. For more information, please visit https://www.wiseguyreports.com


COSTA MESA, Calif., Dec. 15, 2016 (GLOBE NEWSWIRE) -- TTM Technologies, Inc. (Nasdaq:TTMI) was recognized by FiberHome Telecommunication Technologies Co., Ltd. (FiberHome) as one of their Excellent Core Partners on December 1, 2016 at FiberHome’s Core Partner Convention in Wuhan, China. TTM was one of ten suppliers to earn the FiberHome’s “Excellent Core Partner for 2016” award in recognition of TTM's excellent delivery, quality and service this year. This is the second time TTM has been awarded for exceptional overall performance as a supplier to FiberHome. “We are very honored and would like to thank FiberHome for this recognition. We are committed to supporting FiberHome and look forward to further strengthening our business relationship with them in the future,” said Mr. Tony Princiotta, President of TTM’s Electro Mechanical Solutions Business Unit. About TTM Technologies, Inc. TTM Technologies, Inc. is a leading global printed circuit board ("PCB") manufacturer, focusing on quick-turn and volume production of technologically advanced PCBs, backplane assemblies and electro-mechanical solutions. TTM stands for "time-to-market", representing how TTM's time-critical, one-stop manufacturing services enable customers to shorten the time required to develop new products and bring them to market. Additional information can be found at www.ttm.com.


News Article | November 18, 2016
Site: globenewswire.com

COSTA MESA, Calif., Nov. 18, 2016 (GLOBE NEWSWIRE) -- TTM Technologies, Inc. (NASDAQ:TTMI) ("TTM") announced today that the underwriters of its registered public secondary offering exercised in full their option to purchase an additional 1,800,000 shares of common stock from its largest stockholder, Su Sih (BVI) Ltd. (the “Selling Stockholder”), at the public secondary offering price, less underwriting discounts and commissions.  As a result, the total secondary offering size is 13,800,000 shares of common stock. Closing of the sale of the shares is expected to occur on November 22, 2016. The Selling Stockholder will receive all of the proceeds from the offering. No shares of common stock are being sold by TTM in the offering. The offering is being made pursuant to TTM’s shelf registration statement filed with the Securities and Exchange Commission. J.P. Morgan Securities LLC acted as sole book-running manager in the offering. Needham & Company, LLC and Stifel, Nicolaus & Company, Incorporated acted as co-managers in the offering. The offering of these securities is being made by means of a prospectus supplement and the accompanying prospectus only, copies of which may be obtained from J.P. Morgan Securities LLC, c/o Broadridge Financial Solutions, 1155 Long Island Avenue, Edgewood, NY 11717 or by calling toll-free 1-866-803-9204. This press release shall not constitute an offer to sell or a solicitation of an offer to buy, nor shall there be any sale of these securities in any state or jurisdiction in which such an offer, solicitation or sale would be unlawful prior to registration or qualification under the securities laws of any such state or jurisdiction. About TTM TTM Technologies, Inc. is a major global printed circuit board manufacturer, focusing on quick-turn and technologically advanced PCBs, backplane assemblies and electro-mechanical solutions. TTM stands for time-to-market, representing how TTM's time-critical, one-stop manufacturing services enable customers to shorten the time required to develop new products and bring them to market.


News Article | November 17, 2016
Site: globenewswire.com

COSTA MESA, Calif., Nov. 17, 2016 (GLOBE NEWSWIRE) -- TTM Technologies, Inc. (NASDAQ:TTMI) ("TTM") announced today that it has priced an underwritten registered public secondary offering of 12,000,000 shares of its common stock by its largest stockholder, Su Sih (BVI) Ltd. (the “Selling Stockholder”), at $11.50 per share, pursuant to TTM’s shelf registration statement filed with the Securities and Exchange Commission. The Selling Stockholder will receive all of the proceeds from the offering. The underwriters have a 30-day option to purchase up to an additional 1,800,000 shares of common stock from the Selling Stockholder. The offering is expected to close on November 22, 2016. No shares of common stock are being sold by TTM in the offering. J.P. Morgan Securities LLC acted as sole book-running manager in the offering. Needham & Company, LLC and Stifel, Nicolaus & Company, Incorporated acted as co-managers in the offering. The offering of these securities is being made by means of a prospectus supplement and the accompanying prospectus only, copies of which may be obtained from J.P. Morgan Securities LLC, c/o Broadridge Financial Solutions, 1155 Long Island Avenue, Edgewood, NY 11717 or by calling toll-free 1-866-803-9204. This press release shall not constitute an offer to sell or a solicitation of an offer to buy, nor shall there be any sale of these securities in any state or jurisdiction in which such an offer, solicitation or sale would be unlawful prior to registration or qualification under the securities laws of any such state or jurisdiction. About TTM TTM Technologies, Inc. is a major global printed circuit board manufacturer, focusing on quick-turn and technologically advanced PCBs, backplane assemblies and electro-mechanical solutions. TTM stands for time-to-market, representing how TTM's time-critical, one-stop manufacturing services enable customers to shorten the time required to develop new products and bring them to market.


COSTA MESA, Calif., March 01, 2017 (GLOBE NEWSWIRE) -- TTM Technologies, Inc. (Nasdaq:TTMI) will be exhibiting at the Electric & Hybrid Vehicle Technology Expo Europe 2017 at Booth B205. The expo runs from April 4-6 and will be held in the backyard of many world-class automotive companies at Sindelfingen, Germany. Technical experts will be available at the booth to answer printed circuit board design, manufacturing, and assembly-related questions. The following samples of key TTM PCB technologies for automotive will also be displayed at the booth: “The Electric & Hybrid Vehicle Technology Expo Europe is a premier event which provides a great opportunity for TTM to showcase our capabilities in manufacturing Automotive PCBs. We understand the importance of quality and reliability and are looking forward to introducing our ONE TTM Solution with ISO/TS16949 certified manufacturing facilities in China and North America to support this end market,” said Jon Pereira, TTM’s President of The Automotive, Medical and Industrial & Instrumentation Business Unit. About the Electric & Hybrid Technology Expo Europe Electric & Hybrid Vehicle Technology Expo Europe is the leading trade fair for electric, hybrid and plugin hybrid vehicle technology, taking place 4-6 April 2017 in Sindelfingen, Stuttgart, Baden-Württemberg, Germany. The free-to-attend exhibition is a showcase of manufacturing and supply chain solutions for passenger, commercial and industrial vehicles, including electrical powertrains and components, battery management systems, materials and equipment. www.evtechexpo.eu About TTM TTM Technologies, Inc. is a leading global printed circuit board (PCB) manufacturer, focusing on quick-turn and volume production of technologically advanced PCBs, backplane assemblies and electro-mechanical solutions. TTM stands for time-to-market, representing how TTM's time-critical, one-stop manufacturing services enable customers to shorten the time required to develop new products and bring them to market. Additional information can be found at www.ttm.com.


News Article | February 22, 2017
Site: globenewswire.com

COSTA MESA, Calif., Feb. 22, 2017 (GLOBE NEWSWIRE) -- TTM Technologies, Inc. (NASDAQ:TTMI), a leading global printed circuit board (PCB) manufacturer, today announced that members of its management team will present at the J.P. Morgan Global High Yield & Leveraged Finance Conference in Miami at the Loews Miami Beach Hotel on February 27th, 2017 at 9:00 am Eastern Time. About TTM TTM Technologies, Inc. is a leading global printed circuit board manufacturer, focusing on quick-turn and volume production of technologically advanced PCBs, backplane assemblies and electro-mechanical solutions. TTM stands for time-to-market, representing how TTM's time-critical, one-stop manufacturing services enable customers to shorten the time required to develop new products and bring them to market. Additional information can be found at www.ttm.com.


News Article | February 21, 2017
Site: globenewswire.com

COSTA MESA, Calif., Feb. 21, 2017 (GLOBE NEWSWIRE) -- TTM Technologies, Inc. (NASDAQ:TTMI) celebrated the grand opening of its Denver West Building in Littleton, Colorado with government officials, customers, TTM leaders, and employees. The Denver West Building allows TTM to expand its capacity and capabilities to better support customers. The new building doubles the manufacturing floor space to 55,000 sqft, allowing for critical expansion and technology upgrades over the next two years. These changes are part of TTM’s plan to create a TTM Center of Excellence for satellite manufacturing in Denver. Participants in the Grand Opening included representatives from the US Department of Defense, Deputy Director OEDIT Michelle Hadwiger, on behalf of Governor Hickenlooper, and Harris Corporation Director of Supply Chain Space & Intelligence Systems, Dr. Joseph A. Packard, Ph.D. TTM attendees included Aerospace & Defense / Specialty Business Unit President Phil Titterton and Senior Vice President and General Counsel Dan Weber, along with Denver’s employees. “The expansion of the Denver operations was due to increased demand and TTM is proud to financially support Denver’s growth for our customers’ current and future needs for satellite production,” said Phil Titterton. About TTM TTM Technologies, Inc. is a leading global printed circuit board (“PCB”) manufacturer, focusing on quick-turn and volume production of technologically advanced PCBs, backplane assemblies and electro-mechanical solutions. TTM stands for time-to-market, representing how TTM's time-critical, one-stop manufacturing services enable customers to shorten the time required to develop new products and bring them to market. Additional information can be found at www.ttm.com.


Patent
TTM Technologies | Date: 2013-03-28

Some embodiments of the invention provide a method of fabricating an interconnect comprising aligning and stacking a plurality of printed circuit boards with at least one adhesive component, laminating the printed circuit boards and the adhesive component, preparing bonded pair holes, depositing a copper seed layer, forming a copper plate image, electroplating a copper layer, removing a plate resist and depositing an insulator layer.

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