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Lin J.-Y.,Tatung University | Liao J.-H.,Tatung University | Wei T.-C.,Tripod Technology Corporation
Electrochemical and Solid-State Letters | Year: 2011

In this study, a transparent CoS counter electrode (CE) fabricated by potentiodynamic deposition was incorporated in a Pt-free dye-sensitized solar cell (DSSC). The CoS CE fabricated by potentiodynamic deposition was observed with high transparency and honeycomblike morphology. Thus it exhibited a low charge-transfer resistance of ∼1.45 cm2 in comparison with a sputtered-Pt CE (∼2.03 cm2). The DSSC assembled with the CoS CE showed a superior photovoltaic conversion efficiency of 6.01 to that with the sputtered-Pt CE (5.71) due to the higher photocurrent density (14.17 mA cm -2) under full sunlight illumination (100 mW cm-2, AM 1.5G). © 2011 The Electrochemical Society.


Lin C.-Y.,National Tsing Hua University | Lin J.-Y.,Tatung University | Wan C.-C.,National Tsing Hua University | Wei T.-C.,Tripod Technology Corporation
Electrochimica Acta | Year: 2011

This study demonstrates platinum (Pt) counter electrodes with low charge-transfer resistance (R ct), low Pt loading and high active surface area can be obtained within 30 s by using the direct-current deposition in the presence of 3-(2-aminoethylamino)propyl-methyldimethoxysilane (Me-EDA-Si) as an additive. The addition of appropriate Me-EDA-Si can not only enhance the current efficiency but also inhibit the growth of semicircle-like grains, thus resulting in Pt electrode with high active surface area. Consequently, the dye-sensitized solar cells (DSSCs) fabricated with so-prepared Pt electrodes exhibited cell efficiency of 7.39% while 0.01 vol% Me-EDA-Si was added, which is much superior to that with sputtered-Pt electrodes under the same assembly conditions. © 2010 Elsevier Ltd.


Chen C.-M.,National Chung Hsing University | Chen C.-H.,National Chung Hsing University | Wei T.-C.,Tripod Technology Corporation
Electrochimica Acta | Year: 2010

Platinum (Pt) layers were grown on metallic sheets, either stainless steel or nickel (Ni), by chemical deposition, and the resulting Pt-coated metallic sheets were used as counterelectrodes for dye-sensitized solar cells (DSSCs). Compared with other methods of depositing Pt layers, chemical deposition is simple, low-temperature, and easy to scale-up for industrial applications. Thin metallic sheets were employed as the substrates for the Pt deposition because of their low cost, excellent electrical conduction capability, and flexibility. The Pt concentration of the plating solution plays an important role in the photovoltaic performance of the DSSC; higher Pt concentrations correlate with better photovoltaic performance. The DSSCs that use Ni sheets coated with chemically deposited Pt as the counterelectrodes were found to have lower series and charge transfer resistances compared with those based on stainless steel. The Ni-based DSSCs also exhibit higher fill factors and short-circuit currents, and therefore, better energy conversion efficiency. The best efficiency observed with the Ni-based DSSCs was 7.29%. © 2009 Elsevier Ltd. All rights reserved.


Wu M.-S.,National Kaohsiung University of Applied Sciences | Tsai C.-H.,National Kaohsiung University of Applied Sciences | Wei T.-C.,Tripod Technology Corporation
Chemical Communications | Year: 2011

A bifunctional TiO2 layer having an inner compact layer and an outer anchoring layer coated on fluorine-doped tin oxide (FTO) glass could reduce the charge recombination and interfacial contact resistance between FTO and the main TiO2 layer; photoelectron conversion efficiency of cell was increased from 7.31 to 8.04% by incorporating the bifunctional layer. © The Royal Society of Chemistry.


Wu M.-S.,National Kaohsiung University of Applied Sciences | Tsai C.-H.,National Kaohsiung University of Applied Sciences | Jow J.-J.,National Kaohsiung University of Applied Sciences | Wei T.-C.,Tripod Technology Corporation
Electrochimica Acta | Year: 2011

Surface modification of porous TiO 2 photoanode with a thin compact TiO 2 layer was carried out by means of anodic electrodeposition in an aqueous TiCl 3 electrolyte. Results indicated that the electrodeposited thin TiO 2 layer could bridge gaps between TiO 2 nanoparticles and improve the electrical contact at the FTO (fluoride-doped tin oxide)/TiO 2 interface, leading to an efficient electron transport. In addition, the thin compact TiO 2 layer could cover the exposed surface area of FTO to the electrolyte, which contributes to the suppression of the charge recombination. The surface treatment of mesoporous TiO 2 photoanode via aqueous electrochemical route is an effective way to improve the performance of DSSC (dye-sensitized solar cell), which could increase the short-circuit current density, and reduce the dark current density compared to DSSCs with bare and TiCl 4-treated TiO 2 photoanodes. The photoelectron conversion efficiency of DSSC was increased from 7.3 to 8.2% after employing the TiO 2-modified photoanode. © 2011 Elsevier Ltd.


Lan J.-L.,National Tsing Hua University | Wan C.-C.,National Tsing Hua University | Wei T.-C.,Tripod Technology Corporation | Hsu W.-C.,Tripod Technology Corporation | Chang Y.-H.,Tripod Technology Corporation
Progress in Photovoltaics: Research and Applications | Year: 2012

In this paper, the durability of PVP-capped Pt nanoclusters counter electrode (PVP-Pt CE) for dye-sensitized solar cell (DSSC) has been extensively evaluated including electrochemical reaction durability, thermal stress durability and light soaking durability. It is revealed that PVP-Pt CE exhibits both electrochemical and thermal durability by cyclic voltammetry (CV) and electrochemical impedance spectroscopy (EIS) test. Moreover, DSSC containing PVP-Pt CE shows over 9.37% conversion efficiency in highly volatile electrolyte system. As to device thermal durability, both low-volatile and non-volatile electrolyte systems were tested and the results show relative efficiency can maintain more than 85% after accelerated thermal test at 85°C for 1000 h, and 110% after 60°C for 1000 h. Finally, after continuous light soaking test under 60°C for 1000 h, the relative efficiency can still maintain at 94%. Copyright © 2011 John Wiley & Sons, Ltd.


Patent
Tripod Technology Corporation | Date: 2014-03-11

A printed circuit board package structure includes a substrate having a first surface and a second surface, a ring-shaped magnetic element, an adhesive layer, conductive portions and conductive channels. The first and second surfaces respectively have first and second metal portions. A ring-shaped concave portion is formed on a position not covered by the first metal portions of the first surface. The ring-shaped magnetic element is placed in the ring-shaped concave portion. The adhesive layer covers the first metal portions and the ring-shaped magnetic element. The conductive portions are formed on the adhesive layer. The conductive channels penetrate the conductive portions, the adhesive layer, and the substrate, and are respectively located in an inner wall and outside an outer wall of the ring-shaped concave portion. Each of the conductive channels includes a conductive film electrically connects to the aligned conductive portion and second metal portion.


Patent
Tripod Technology Corporation | Date: 2014-09-17

A printed circuit board package structure includes a substrate (110) having a first surface (111) and a second surface (113), a ring-shaped magnetic element (120), an adhesive layer (130), conductive portions (140) and conductive channels (150). The first and second surfaces respectively have first (114) and second (116) metal portions. A ring-shaped concave portion (112) is formed on a position not covered by the first metal portions of the first surface. The ring-shaped magnetic element is placed in the ring-shaped concave portion. The adhesive layer covers the first metal portions and the ring-shaped magnetic element. The conductive portions are formed on the adhesive layer. The conductive channels penetrate the conductive portions, the adhesive layer, and the substrate, and are respectively located in an inner wall (122) and outside an outer wall (124) of the ring-shaped concave portion. Each of the conductive channels includes a conductive film (152) electrically connects to the aligned conductive portion and second metal portion.


Patent
Tripod Technology Corporation | Date: 2015-04-22

A printed circuit board package structure 100 includes a substrate 110, plural ring-shaped magnetic elements 130, a support layer 140, and first conductive layers 160, 162, 164. The substrate has two opposite first and second surfaces 112, 114, first ring-shaped recesses 116, and first grooves 118. Each of the first ring-shaped recesses is communicated with another first ring-shaped recess through at least one of the first grooves, and at least two of the first ring-shaped recesses are communicated with a side surface of the substrate through the first grooves to form at least two openings 119. The ring-shaped magnetic elements are respectively located in the first ring-shaped recesses. The support layer is located on the first surface, and covers the first ring-shaped recesses and the first grooves. The support layer and the substrate have through holes 150. The first conductive layers are respectively located on surfaces of support layer and substrate facing the through holes.


Patent
Tripod Technology Corporation | Date: 2014-10-13

A printed circuit board package structure includes a substrate, plural ring-shaped magnetic elements, a support layer, and first conductive layers. The substrate has two opposite first and second surfaces, first ring-shaped recesses, and first grooves. Each of the first ring-shaped recesses is communicated with another first ring-shaped recess through at least one of the first grooves, and at least two of the first ring-shaped recesses are communicated with a side surface of the substrate through the first grooves to form at least two openings. The ring-shaped magnetic elements are respectively located in the first ring-shaped recesses. The support layer is located on the first surface, and covers the first ring-shaped recesses and the first grooves. The support layer and the substrate have through holes. The first conductive layers are respectively located on surfaces of support layer and substrate facing the through holes.

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