Kyoto, Japan
Kyoto, Japan

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Patent
Towa Corporation Co. | Date: 2017-03-29

[Problem] To provide a glove base and glove which enhance water-absorbing properties for moisture on a surface of a hand and easily release moisture to the outside from the entire glove even if the glove is configured only of a fiber-made base or even if coating is provided to a surface of the glove. [Solution] A glove base of the present invention is a glove base made of fiber and having a hand shape, wherein water-absorbing properties of a first fiber exposed mainly to inside of the glove base are higher than water-absorbing properties of a second fiber exposed mainly to outside of the glove base, the first fiber absorbs and moves moisture on a surface of a hand on the inside to the second fiber, and the second fiber moves the moisture moved from the first fiber mainly in a surface direction.


Patent
Towa Corporation Co. | Date: 2013-07-10

The present invention provides a glove that can reduce a humid feeling during usage while realizing a grip force, usability, workability, and breathability. The glove of the present invention includes a hand-shaped base layer (2a, 2b) made of fibers having a stretching property, a coating (3a, 3b) formed on the surface of the base layer (2a, 2b), at least on the surface of a palm of the base layer, and a plurality of breathing pores (4a, 4b) formed in the coating (3a, 3b), wherein the opening areas of the breathing pores (4b) when the glove is worn are larger than the opening areas of the breathing pores (4a) when the glove is not worn.


Patent
Towa Corporation Co. | Date: 2015-08-12

The present invention provides a glove having both high softness and high air tightness. A glove of the present invention has a fiber-made base having a shape of a hand of a person and a coating formed on a surface of at least a portion of the base, where a burning treatment is applied to the base, air tightness of a portion of the glove which has been applied with the burning treatment is maintained even when pressure of 9 kPa or higher is imparted to inside of the base, and the fiber-made base is formed of filament yarns. Selected Figure: Fig. 6


A molding module 2 includes: a mold 11 including a lower mold 10 and an upper mold 7 facing each other; a cavity 12 provided in the lower mold; a bottom member 9 forming the inner bottom surface 14 of the cavity; a circumferential member 8 forming the inner circumferential surface 13 of the cavity; a mold-driving mechanism for opening and closing the mold 11; a lower base 3; a support member 4 vertically provided on the lower base; an upper base 5 provided in the upper portion of the support member; and an elevating platen 6 mounted on the middle portion of the support member in a vertically moveable manner. Motors 16 and 23 included in the mold-driving mechanism are respectively attached to the lower base and the elevating platen. The upper mold is attached to the upper base. The circumferential member is connected to the elevating platen. The bottom member is connected to the motor 23. The circumferential member is driven vertically by the elevating platen which is driven vertically by the motor 16. The bottom member is driven vertically by the motor 23.


Patent
Towa Corporation | Date: 2016-09-28

Resin sealing apparatus and method of sealing a substrate. A lower mold (18) facing an upper mold (13) has a bottom surface member (22) for a cavity and a side surface member (23) for the cavity. An upper end surface of the bottom surface member (22) forms an inner bottom surface of the cavity (24) and has a planar shape corresponding to an unusual planar shape of a sealing resin (R2). The side surface member (23) and the bottom surface member (22) can slide relatively. A substrate (19) is disposed on a mold surface of the upper mold (13) such that a component (19a) to be sealed attached to the substrate (19) faces downward, and the cavity (24) is filled with a fluid resin (R1). The upper mold (13) and the lower mold (18) are clamped, and the component (19a) to be sealed is immersed in the fluid resin (R1) filled into the cavity (24). Then, the bottom surface member (22) is raised, and the fluid resin (R1) within the cavity (24) is pressed at a prescribed resin pressure and cured to form the sealing resin (R2). The bottom surface member (22) and the side surface member (23) are moved relatively, and thereby, a molded product (M) having the sealing resin (R2) is released from a mold surface of the lower mold (18).


The present invention provides a method for producing an electronic component, capable of simply and efficiently producing an electronic component having both of a via electrode(s) (bump(s)) and a plate-like member. The method is a method for producing an electronic component. The electronic component includes: a substrate 21, a chip(s) 31, a resin 41, a plate-like member 11 having a surface(s), a bump(s) 12 that includes a deformable portion 12A, and a wiring pattern 22. The method includes: disposing the chip(s) 31 on the surface(s); and encapsulating the bump(s) 31 in the resin 41. The encapsulating includes: encapsulating the chip(s) 31 in the resin 41 between a bump 12-formed surface of the plate-like member 11 on which the bump(s) 12 is formed and a wiring pattern 22-formed surface of the substrate 21 on which the wiring pattern is formed; and causing the bump(s) 12 to be in contact with the wiring pattern 22.


The present invention provides a method for producing a resin-encapsulated electronic component, capable of simply and efficiently producing a resin-encapsulated electronic component having both of a via electrode(s) (bump(s)) and a plate-like member. The method includes a resin-encapsulation step of encapsulating at least one electronic component in a resin. A produced resin-encapsulated electronic component includes: a substrate; the at least one electronic component; the resin; a plate-like member; and at least one bump. A wiring pattern is formed on the substrate. In the resin-encapsulation step, between a bump-formed surface in a bump-formed plate-like member obtained by forming the at least one bump in the plate-like member and a wiring pattern-formed surface in the substrate, the at least one electronic component is encapsulated in the resin, and the at least one bump is caused to be in contact with the wiring pattern.


Patent
Towa Corporation Ltd. | Date: 2013-04-24

Provided is a work glove which has further improved wear resistance and workability while ensuring functions such as dielectric breakdown strength and water proofing property. In a work glove according to the present invention, a fabric material which is formed of one selected from cloth, knitted fabric and meshed fabric and has a predetermined area is affixed to an outer surface of a glove base which is made of an elastic material, and a coating film having a higher friction coefficient than the fabric material is formed on a surface of the fabric material.


Patent
Towa Corporation Co. | Date: 2015-01-12

The present invention provides a glove having both high softness and high air tightness. A glove of the present invention has a fiber-made base having a shape of a hand of a person and a coating formed on a surface of at least a portion of the base, where a burning treatment is applied to the base, air tightness of a portion of the glove which has been applied with the burning treatment is maintained even when pressure of 9 kPa or higher is imparted to inside of the base, and the fiber-made base is formed of filament yarns.


A molding module 2 includes: a mold 11 including a lower mold 10 and an upper mold 7 facing each other; a cavity 12 provided in the lower mold; a bottom member 9 forming the inner bottom surface 14 of the cavity; a circumferential member 8 forming the inner circumferential surface 13 of the cavity; a mold-driving mechanism for opening and closing the mold 11; a lower base 3; a support member 4 vertically provided on the lower base; an upper base 5 provided in the upper portion of the support member; and an elevating platen 6 mounted on the middle portion of the support member in a vertically moveable manner. Motors 16 and 23 included in the mold-driving mechanism are respectively attached to the lower base and the elevating platen. The upper mold is attached to the upper base. The circumferential member is connected to the elevating platen. The bottom member is connected to the motor 23. The circumferential member is driven vertically by the elevating platen which is driven vertically by the motor 16. The bottom member is driven vertically by the motor 23.

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