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Kyoto, Japan

Okada A.,Okayama University | Kitada R.,TOWA Corporation | Okamoto Y.,Okayama University | Uno Y.,Okayama University
CIRP Annals - Manufacturing Technology | Year: 2011

Cemented carbide has many excellent properties. However, it is sometimes difficult to apply conventional surface finishing or surface modification methods for the cemented carbide. The possibility of surface modification by large-area electron beam irradiation, namely EB polishing was discussed. The surface structure of the EB polished cemented carbide was observed by TEM. The hardness and the water repellency were tested. Also, the separation force of molded resin from the surface was measured for evaluating the releasability of the resin. The water repellency and the releasability of the molded resin could be improved by EB polishing, because the surface structure changed. © 2011 CIRP. Source

Amaya S.,TOWA Corporation | Dao D.V.,Ritsumeikan University | Sugiyama S.,Ritsumeikan University
Journal of Micromechanics and Microengineering | Year: 2011

This paper presents a novel fabrication process for monolithic PMMA (polymethylmethacrylate) vertical comb-drive actuators utilizing hot embossing, surface-activated direct bonding and elliptical vibration cutting. The robustness and capability of the method are demonstrated through the fabrication of sophisticated PMMA freestanding microstructures, such as a rotation mirror device integrated with vertical comb actuators. The fabrication process consists of silicon mold fabrication by deep-RIE, PMMA microstructure formation by hot embossing, PMMA-PMMA direct bonding by surface activation, releasing or removal of a PMMA layer remaining after hot embossing by elliptical vibration cutting, and finally, metallization by sputtering to form electrodes. An efficient technique to protect the PMMA microstructures during the release process using reinforcement material is applied. A monolithic PMMA torsion mirror driven by a vertical comb actuator has been fabricated successfully. © 2011 IOP Publishing Ltd. Source

Miura M.,TOWA Corporation
2016 International Conference on Electronics Packaging, ICEP 2016 | Year: 2016

There has been great progress on Compression Molding Technology and Equipment. © 2016 The Japan Institute of Electronics Packaging. Source

The present invention provides a method for producing a resin-encapsulated electronic component, capable of simply and efficiently producing a resin-encapsulated electronic component having both of a via electrode(s) (bump(s)) and a plate-like member. The method includes a resin-encapsulation step of encapsulating at least one electronic component in a resin. A produced resin-encapsulated electronic component includes: a substrate; the at least one electronic component; the resin; a plate-like member; and at least one bump. A wiring pattern is formed on the substrate. In the resin-encapsulation step, between a bump-formed surface in a bump-formed plate-like member obtained by forming the at least one bump in the plate-like member and a wiring pattern-formed surface in the substrate, the at least one electronic component is encapsulated in the resin, and the at least one bump is caused to be in contact with the wiring pattern.

Towa Corporation Co. | Date: 2015-01-12

The present invention provides a glove having both high softness and high air tightness. A glove of the present invention has a fiber-made base having a shape of a hand of a person and a coating formed on a surface of at least a portion of the base, where a burning treatment is applied to the base, air tightness of a portion of the glove which has been applied with the burning treatment is maintained even when pressure of 9 kPa or higher is imparted to inside of the base, and the fiber-made base is formed of filament yarns.

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