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Ōtsu-shi, Japan

Onishi H.,Torav Industries Inc | Kamemoto S.,Torav Industries Inc | Yuba T.,Torav Industries Inc | Tomikawa M.,Torav Industries Inc
Journal of Photopolymer Science and Technology

We developed the low-temperature curable positive-tone photosensitive polyimide by compounding flexible structured polyimide resin, napthoquinonediazide photosensitive (DNQ), and cross-linking agent reacting below 200°C. The obtained photosensitive material lias low residual stress about half of the existing low-temperature curing materials. To compare the pattern profile at different curing temperature, pattern shapes of this photosensitive material cured at 170°C, 200°C, 250°Cexhibit same taper angle (about 60°). In addition, the material shows good chemical resistance, heat stability, and flux stability to be suitable for next generation advanced packaging process. © 2012CPST. Source

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