Greco G.,CNR Institute for Microelectronics and Microsystems |
Iucolano F.,STMicroelectronics |
Bongiorno C.,CNR Institute for Microelectronics and Microsystems |
Di Franco S.,CNR Institute for Microelectronics and Microsystems |
And 15 more authors.
Physica Status Solidi (A) Applications and Materials Science | Year: 2015
In this work, the electrical and structural properties of Ti/Al contacts on AlGaN/GaN heterostructures with a different crystalline quality were investigated. In particular, the sample with a lower defects density required a higher temperature (800 ° C) to obtain Ohmic contacts, while the more defective sample showed Ohmic behaviour at lower annealing temperature (500 ° C). The susceptibility to oxidation of the metal stack upon annealing has been monitored by chemical analyses. Moreover, the temperature dependence of the contact resistance of the Ti/Al annealed contacts revealed that the interface current transport mechanism depends on the material quality. These results were attributed to the presence of V-shaped defect close to the surface of the AlGaN barrier layer. A nanoscale electrical analysis demonstrated a preferential current conduction through these defects, which indeed plays a relevant role for the formation of the Ohmic contact. © 2015 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim. Source