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Patent
Tong Hsing Electronic Industries Ltd. | Date: 2016-09-14

A fingerprint sensing device includes an insulating package, an image-sensing element, a light-emitting element, and a conductive component. The insulating package has a top surface that is formed with a first recess and a second recess, and a bottom surface that is opposite to the top surface. The conductive component is formed in the insulating package and has opposite top and bottom ends that are respectively exposed from the top and bottom surfaces of the insulating package. The image-sensing element is electrically connected to the conductive component by flip-chip techniques and has a sensing region that is exposed from the first recess. The light-emitting element is electrically coupled to the conductive component.


Patent
Tong Hsing Electronic Industries Ltd. | Date: 2016-09-02

A fingerprint sensing device includes an insulating package, an image-sensing die, a light-emitting element, and a conductive component. The insulating package has a bottom surface and a top surface formed with first and second recesses. The image-sensing die is disposed in the first recess and has an outer surface exposed therefrom. The light-emitting element is disposed in the second recess and has an outer surface exposed from the second recess, and an electrode unit. The conductive component is formed in the insulating package, has top and bottom ends exposed from the top and bottom surfaces of the insulating package, and is electrically coupled to the image-sensing die and the electrode unit.


Patent
Tong Hsing Electronic Industries Ltd. | Date: 2013-04-12

A ceramic circuit board for use in packaging an electronic element includes a ceramic-copper plate, and a heat-dissipating unit that is adapted for dissipating heat from the electronic element. The ceramic-copperplate includes a ceramic substrate that has opposite first and second surfaces, and a through-hole formed through the first and second surfaces, a top copper pattern that overlies the first surface of the ceramic substrate and that has at least two conducting portions spaced apart from each other, and a bottom copper layer that underlies the second surface of the ceramic substrate. The heat-dissipating unit includes a heat-dissipating layer that is disposed in the through-hole of the ceramic substrate above the bottom copper layer and that has a thermal conductivity larger than that of the ceramic substrate. A method of making the ceramic circuit board is also disclosed.


Patent
Tong Hsing Electronic Industries Ltd. | Date: 2013-08-07

A stress-reduced circuit board includes an insulating substrate, and first and second electrically conductive layers which are stacked one upon the other, and which respectively have peripheral marginal regions that are configured in a stepped arrangement. The first electrically conductive layer is configured to have an area dimension larger than that of the second electrically conductive layer and a thickness not greater than that of the second electrically conductive layer so as to minimize stress caused by a difference in coefficients of thermal expansion between the insulating substrate and the first and second electrically conductive layers.


Patent
Tong Hsing Electronic Industries Ltd. | Date: 2012-06-01

An image sensor module includes a substrate, a circuit layer, a flip chip, an insulating layer, and a conducting layer. The substrate has at least one transparent area and defines a first surface and a second surface. The circuit layer is provided on the first surface of the substrate. The flip chip is connected to the circuit layer. The insulating layer substantially encases the flip chip and a part of the circuit layer, wherein the insulating layer has at least one groove at a lateral side of said insulating layer thereof each provided with a metal layer. The conducting layer is provided on a top surface of the insulating layer, wherein the conducting layer is electrically connected to the circuit layer via the metal layer.


Patent
Tong Hsing Electronic Industries Ltd. | Date: 2013-09-05

A circuit board module includes a circuit board and a heat-dissipating device. The circuit board includes a ceramic substrate, and a circuit pattern formed on a surface of the ceramic substrate. The circuit board is sinter-bonded to a main body of the heat-dissipating device. A method of making the circuit board module is also disclosed.


Patent
Tong Hsing Electronic Industries Ltd. | Date: 2013-11-12

A liquid-cooled heat dissipating device includes a chamber-confining body confining a liquid chamber adapted to receive a liquid coolant, and having a surrounding wall that surrounds the liquid chamber, a cover plate covering the liquid chamber and sinter-bonded to the surrounding wall, a liquid inlet spatially communicating with the liquid chamber, and a liquid outlet spatially communicating with the liquid chamber. A method of making the liquid-cooled heat dissipating device is also disclosed.


Patent
Tong Hsing Electronic Industries Ltd. | Date: 2015-04-30

A method for manufacturing a multilayer circuit board includes: forming a first patterned conductive layer on a ceramic substrate, the first patterned conductive layer having a first circuit pattern and a first submount pattern; forming a second patterned conductive layer on the first patterned conductive layer, the second patterned conductive layer having a second circuit pattern and a second submount pattern; forming an insulating layer on the ceramic substrate; and forming a third patterned conductive layer on the insulating layer. The third patterned conductive layer having a third circuit pattern and a third submount pattern. The first, second and third submount patterns are stacked one above another.


Patent
Tong Hsing Electronic Industries Ltd. | Date: 2016-05-02

An interposer includes a substrate, an electrically-conductive structure, at least one dielectric layer, a redistribution structure and electrode pads. The substrate is made of a ceramic material and has first and second surfaces and via holes. The electrically-conductive structure includes conductive pads, substrate vias disposed in the via holes, and layered electrically-conductive parts. The dielectric layer is disposed on the second surface to cover the layered electrically-conductive parts. The redistribution structure penetrates the dielectric layer and is connected to the layered electrically-conductive parts. The electrode pads are disposed on a surface of the dielectric layer.


Patent
Tong Hsing Electronic Industries Ltd. | Date: 2015-04-07

An interposer includes a substrate, an electrically-conductive structure, at least one dielectric layer, a redistribution structure and electrode pads. The substrate is made of a ceramic material and has first and second surfaces and via holes. The electrically-conductive structure includes conductive pads, substrate vias disposed in the via holes, and layered electrically-conductive parts. The dielectric layer is disposed on the second surface to cover the layered electrically-conductive parts. The redistribution structure penetrates the dielectric layer and is connected to the layered electrically-conductive parts. The electrode pads are disposed on a surface of the dielectric layer.

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