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Akashi, Japan

[Problem] To provide a fluoride spray coating covered member adhered with a fluoride spray coating having excellent properties on quality by suppressing a thermal decomposition reaction and an oxide reaction, and to propose a method for forming a cover by firmly adhering the coating. [Solution] A method for forming a fluoride spray coating in an implantation structure onto a substrate surface by spraying particles of a fluoride spraying material onto a substrate surface or a pretreated substrate surface, if necessary through an undercoat layer or spray particle dotted parts of carbide cermet, at a flying velocity of particles of not less than 500 m/sec with an inert gas as a working gas for coating formation at an inert gas temperature of 600 C.-1300 C. as well as a fluoride spray coating covered member.

[Problem] To provide a fluoride spray coating covered member in which a fluoride spray coating firmly adheres by coating carbide cermet to a surface of a substrate and interposing it, and to propose a method therefor. [Solution] A fluoride spray coating is formed in such a manner that an undercoat layer of carbide cermet, which covers a substrate in a film-shaped manner while a tip portion of carbide cermet particles is embedded in the substrate, or a primer part of carbide cermet, is formed by blowing a carbide cermet material at a high velocity by using a spray gun to a surface of the substrate, and after that, a fluoride particle is sprayed thereon.

Forming a densified layer in a spray coating which forms a densified layer providing a sufficient effect while preventing generation of excessively large cracks and does not cause the increase of costs; also provided in a spray coating covering member. When a high-energy beam for remelting and resolidifying a coating composition of a surface layer of an Al

Tocalo Co. | Date: 2012-04-11

Provided is a member for semiconductor manufacturing device which hardly causes component contamination and is capable of sufficiently reducing generation of particles in a semiconductor manufacturing device. A spray coating is formed by spraying a ceramic onto a mounting member of a transfer arm, and laser beam is irradiated to the spray coating to remelt and resolidify the ceramic composition for modification to thereby form a high-strength ceramic layer made from a ceramic recrystallized material and having a net-like crack, whereby particles dropped out from the mounting member due to external factors in a semiconductor manufacturing device are reduced to an extent not affecting a semiconductor manufacturing process.

An electrostatic chuck and a manufacturing method are disclosed in which drawbacks of using an adhesive are not existent and a freedom degree of design is high. The electrostatic chuck includes a substrate part constituting a main chuck body, a first insulating layer of a spray coating formed to the surface of the substrate part, a heater part of an electric conductor formed by applying a conductive paste to the surface of the first insulating layer, a second insulating layer of a spray coating formed to the surface of the first insulating layer so as to cover the heater part, an electrode part formed by thermal spraying to the surface of the second insulating layer and a dielectric layer of a spray coating formed to the surface of the second layer so as to cover the electrode part and lowers a volume resistivity without using an adhesive.

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