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Nova Odesa, Ukraine

Semenyuk V.,THERMION Company | Dekhtiaruk R.,Odessa State Academy of Refrigeration
AIP Conference Proceedings | Year: 2012

A generalized approach to cooling of localized heat sources is given with emphasis on light emitting diodes (LEDs) thermal management. Considered is the thermal model of the system containing a LED with its internal thermal resistance, thermoelectric cooler (TEC) and a heat sink. The problem of optimal matching of system components is solved with consideration of 3-dimensional heat spreading in the system elements. The method of optimal integration of a TEC into the system is described. Particularly, the LED with the maximum power of 11.8 W is under consideration. It is shown that with optimized TEC the LED performance can be increased considerably. © 2012 American Institute of Physics.

The influence of the thermal properties of the substrate on the performance of cascade thermoelectric coolers (TECs) is studied with an emphasis on a justified choice of substrate material. An analytical model is developed for predicting the thermal resistance of the substrate associated with three-dimensional heat transfer from a smaller cascade area into a larger cooling cascade. The model is used to define the maximum temperature difference for a line of standard multistage TECs based on various substrate materials with different thermal conductivities, including white 96% Al2O 3 "Rubalit" ceramic, grey 99.8% Al2O3 "Policor" ceramic, and AlN and BeO ceramics. Two types of multistage TECs are considered, namely with series and series-parallel connection of TE pellets, having from two to five cascades with TE pellet length in the range from 0.3 mm to 2 mm. A comparative analysis of the obtained results is made, and recommendations are formulated concerning the selection of an appropriate substrate material providing the highest performance-to-cost ratio. © 2013 TMS.

Semenyuk V.,THERMION Company
Journal of Electronic Materials | Year: 2014

The effect of heat sink (HS) thermal resistance on the performance of a thermoelectric cooler (TEC) has been studied. A method of HS characterization is proposed for the typical case of substantial mismatch in the dimensions of these components. This dimension mismatch causes significant heat spreading resistance in the HS base plate which is highly dependent on the lack of conformity of the components. In this study we investigated modern a HS whose thermal resistance R d was determined experimentally by use of a dummy heater of fixed dimensions. An analytical method is proposed for predicting HS thermal resistance for arbitrary heater dimensions using the certified R d value as sole reference point. The method is based on an HS thermal model with three-dimensional heat spread in its base plate. This theoretical approach was used for characterization of HS from Alpha Company, a manufacturer of HS for microelectronics. HS with low pressure drop were considered under conditions of natural and forced convection. It is shown that their thermal resistance, which depends on TEC dimensions, can differ substantially from the certified value. © 2014 TMS.

Semenyuk V.,THERMION Company
Journal of Electronic Materials | Year: 2010

Thermal waves induced in a thermoelectric (TE) element by periodic current pulses are studied. An analytical description is obtained in the form of a Fourier series. Different combinations of current pulses and frequencies are reviewed. The utmost performance of a TE thermal cycler is estimated. © 2010 TMS.

Semenyuk V.,THERMION Company | Dekhtiaruk R.,Odessa State Academy of Refrigeration
Journal of Electronic Materials | Year: 2013

We present the results of an experimental study of a cooling system based on a novel thermoelectric module specifically designed for thermal management of high-power light-emitting diodes (LEDs). The Seoul Semiconductor LED W724C0 device was chosen for experimental validation of the efficiency of the proposed cooling unit. Two cooling systems with identical heat sinks were tested for comparison: a state-of-the-art one based on an insulated metal substrate-printed circuit board (IMS-PCB) and a system with thermoelectric cooling. The obtained results show that use of thermoelectrics results in a considerable reduction of the LED operating temperature, providing increased light output and greatly increased LED lifetime. © 2013 TMS.

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