Dallas, TX, United States

Texas Instruments

www.ti.com
Dallas, TX, United States

Texas Instruments Inc. is an American electronics company that designs and makes semiconductors, which it sells to electronics designers and manufacturers globally. Headquartered at Dallas, Texas, United States, TI is the third largest manufacturer of semiconductors worldwide after Intel and Samsung, the second largest supplier of chips for cellular handsets after Qualcomm, and the largest producer of digital signal processors and analog semiconductors, among a wide range of other semiconductor products, including calculators, microcontrollers and multi-core processors. Texas Instruments is among the Top 20 Semiconductor producing companies in the world.Texas Instruments was founded in 1951. It emerged after a reorganization of Geophysical Service. This company manufactured equipment for use in the seismic industry as well as defense electronics. TI began research in transistors in the early 1950s and produced the world's first commercial silicon transistor. In 1954, Texas Instruments designed and manufactured the first transistor radio and Jack Kilby invented the integrated circuit in 1958 while working at TI's Central Research Labs. The company produced the first integrated circuit-based computer for the U.S. Air Force in 1961. TI researched infrared technology in the late 1950s and later made radar systems as well as guidance and control systems for both missiles and bombs. The hand-held calculator was introduced to the world by TI in 1967.In the 1970s and 80s the company focused on consumer electronics including digital clocks, watches, hand-held calculators, home computers as well as various sensors. In 1997, its defense business was sold to Raytheon. In 2007, Texas Instruments was awarded the Manufacturer of the Year for Global Supply Chain Excellence by World Trade magazine. Texas Instruments is considered to be one of the most ethical companies in the world.After the acquisition of National Semiconductor in 2011, the company has a combined portfolio of nearly 45,000 analog products and customer design tools, making it the world's largest maker of analog technology components. In 2011, Texas Instruments ranked 175 in the Fortune 500. TI is made up of two main divisions: Semiconductors and Educational Technology of which Semiconductor products account for approximately 96% of TI's revenue. Wikipedia.

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Patent
Texas Instruments | Date: 2017-01-30

Testing of die on wafer is achieved by; (1) providing a tester with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, (2) providing die on wafer with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, and (3) providing a connectivity mechanism between the bidirectional transceiver circuitrys of the tester and a selected group or all of the die on wafer for communication of the JTAG signals.


Patent
Texas Instruments | Date: 2017-01-30

An amplifier includes an amplifier input and an amplifier output. A compensation network is coupled to the amplifier output. The compensation network includes at least one RC network tuned to a frequency in which the amplifier operates. The compensation network provides at least one zero to compensate for at least one pole introduced by a load coupled to the amplifier output.


Patent
Texas Instruments | Date: 2017-01-31

In accordance with disclosed embodiments, a first power line communication (PLC) device connected to a PLC network includes channel control logic that assigns a first channel of the PLC network for transmission on a power line of PLC data packets between the first PLC device and a second PLC device connected to the PLC network and assigns a second channel of the PLC network for transmission on the power line of PLC data packets between the first PLC device and the third PLC device connected to the PLC network. The PLC device includes a transceiver that receives and transmits PLC data packets on the PLC network and which operates as a bridge device that communicates on both the first and second channels to pass PLC data packets between the second PLC device and the third PLC device.


The betas of the bipolar transistors in a BiCMOS semiconductor structure are increased by forming the emitters of the bipolar transistors with two implants: a source-drain implant that forms a first emitter region at the same time that the source and drain regions are formed, and an additional implant that forms a second emitter region at the same time that another region is formed. The additional implant has an implant energy that is greater than the implant energy of the source-drain implant.


In a disclosed embodiment, a method for communication in a network includes receiving, at a first device registered to the network, a physical layer (PHY) frame that includes a PHY header and a MAC header. The PHY frame may further include a MAC payload. The PHY header includes a destination address field. The method further includes comparing a network address of the first device to the destination address field to determine whether the destination address field stores a value having the same number of bits as the network address. When the comparison indicates that the value stored by the destination address field does not have the same number of bits as the network address, the method skips decoding the MAC header and the MAC payload.


Patent
Texas Instruments | Date: 2017-02-22

A serial bus network includes a voltage regulator, a plurality of power switches, and a voltage monitor. The voltage regulator provides power to a plurality of serial buses. Each of the serial buses provides power from the voltage regulator to a device coupled to the serial bus. Each of the power switches power from the voltage regulator to one of the serial buses, and includes an input terminal coupled to a voltage regulator output, and an output terminal coupled to one of the serial buses. The voltage monitor is coupled to the voltage regulator and to the output terminal of each of the power switches. The voltage monitor compares bus voltages at the output terminals of the power switches, identifies a lowest of the bus voltages, and adjusts the voltage regulator output voltage such that the identified lowest of the bus voltages is within a predetermined operational voltage range.


Patent
Texas Instruments | Date: 2017-09-13

In described examples, a packaged transistor device (100) includes a semiconductor chip (101) including a transistor with terminals distributed on the first and the opposite second chip side; and a slab (110) of low-grade silicon (1-g-Si) configured as a ridge (111) framing a depression including a recessed central area suitable to accommodate the chip, the ridge having a first surface in a first plane and the recessed central area having a second surface in a second plane spaced from the first plane by a depth (112) at least equal to the chip thickness, the ridge covered by device terminals (120, 121) connected to attachment pads in the central area having the terminals of the first chip side attached, so that the terminals (103) of the opposite second chip side are co-planar with the device terminals on the slab ridge.


Patent
Texas Instruments | Date: 2017-09-20

In described examples, a rotational resolver system includes a rotational shaft (215) to which at least one eccentric conductive coarse resolution disc (205) is fixed and to which at least one conductive fine resolution disc (210) is also fixed. The fine resolution disc (210) defines generally semicircular protruding edge segments (230). At least one conductive coarse-disc sensing coil (220, 225) is disposed adjacent an edge of the coarse resolution disc (205), and at least one conductive fine-disc sensing coil (235, 240) is disposed adjacent the edge of the fine resolution disc (210). These coils may be oriented for axial sensing of the respective disc.


In described examples of a voltage/current regulator supplying controlled current with PVT headroom adjustment (350), an LED backlight driver (300) controls ILED string current (LED1-LED4), and controls a voltage regulator supplying string voltage with sufficient headroom voltage VHDRM (305) to supply the ILED string current. The LED driver controls ILED string current with an MLED current control transistor (321-324), including gate drive (311-314) referenced to a reference voltage VREF. String voltage and VHDRM are adjusted for PVT operating conditions by generating a replica/reference current ILED/RATIO (354) (proportional to ILED string current) with a replica current control transistor MLED/RATIO (353) based on VREF. ILED/RATIO (354) is mirrored (358) to a second replica MLED/RATIO transistor (357) that saturates at a PVT REF reference voltage corresponding to a minimum voltage that can supply the required ILED current (as represented by the ILED/RATIO replica/reference current), accounting for PVT operating conditions.


Patent
Texas Instruments | Date: 2017-09-20

In described examples, an output discharge circuit for a load switch (14) may include a capacitor (50) coupled between a power rail of the output discharge circuit and a ground lead, and a diode (54, 56) coupled between a power input of the output discharge circuit and the power rail. The output discharge circuit may charge the capacitor (50) via a current path formed by the diode (54, 56) while power is being supplied to the load switch (14). When the power supply to the output discharge circuit is turned off, the diode (54, 56) may prevent the capacitor (50) from discharging through the current path, and the stored charge on the capacitor (50) may be used for powering the output discharge switch during a period of time after the power supply has been turned off. In this way, the output discharge circuit may continue to discharge the output of the load switch (14), even when power ceases being supplied to the load switch (14).

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