Lee B.,Texas Instrument Taiwan Ltd 142 |
Yu F.,Texas Instrument Taiwan Ltd 142
Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013 | Year: 2013
This paper presents TI development of high reliability molding compound material for power enhancement packages with PPF LDF. The mold gate remains due to good molding compound high adhesion and low flexural strength/Modulus are observed in several packages during mass production run. Correlations of adhesion and modulus change with Respect to its fracture strength under different conditions are studied. As a result, the gate remains solved by achieving the sweet spot based on material properties on optimized molding parameters. The gate remains on LDF side rail which will be stuck at T&F process. A modification to dies and LDF design can jump across the hurdle, but high investment needed. With this study, the gate remains can be conquered after an effective DOE with the proper understanding of Material (Mold compound) properties and Mold Machine's capability. © 2013 IEEE.