Tescan

Brno, Czech Republic
Brno, Czech Republic

Time filter

Source Type

News Article | November 11, 2016
Site: www.newsmaker.com.au

Global Failure Analysis market is accounted for $4.82 billion in 2015 and is expected to reach $8.3 billion by 2022 to grow at a CAGR of 8.0%. Rising applications of failure analysis equipment in nanotechnology and medical applications and advancements in technology and usage of failure analysis equipment in semiconductors are some of the factors driving the market. However, high maintenance and equipment cost may hinder the market growth. Demand for failure analysis equipment in emerging nations may create an opportunity to the market. Automotive segment is expected to grow at a highest CAGR during the forecast period. The favourable growth is attributed to high breach of advanced driver assistance systems and driverless vehicles. North America accounted for the largest share in the market, while, Asia Pacific is expected to regiser highest CAGR during the forecast period owing to high concentration of semiconductor industries in countries such as Taiwan, China, Japan, South Korea and India. Some of the key players in global failure analysis market include Hitachi High-Technologies Corporation, EAG (Evans Analytical Group) Inc., Thermo Fisher Scientific Inc., A&D Company Ltd., FEI Company, CARL Zeiss SMT GmbH, Motion X Corporation, Tescan Orsay Holding, A.S., Jeol Ltd., Intertek Group PLC, RJ Lee Group, Inc. , Evans Analytical Group, Inc., Ops A La Carte LLC, IMR Test Labs and Westpak, Inc. Techniques Covered:  • Common mode Failure Analysis  • Destructive Physical Analysis  • Failure Modes Effect Analysis(FMEA)  • Failure Modes, Effects, and Criticality Analysis(FMECA)  • Fault Tree Analysis(FTA)  • Functional Failure Analysis  • Physics of Failure Analysis  • Software Failure Analysis  • Sneak Circuit Analysis  • Other Techniques Enduser Industries Covered:  • Oil and Gas  • Aerospace  • Automotive  • Construction  • Chemical and Pharmaceutical  • Food and Beverage  • Industrial  • Defence  • Metrology and Calibration  • Other End User Industries Regions Covered:  • North America  o US  o Canada  o Mexico  • Europe  o Germany  o France  o Italy  o UK  o Spain  o Rest of Europe  • Asia Pacific  o Japan  o China  o India  o Australia  o New Zealand  o Rest of Asia Pacific  • Rest of the World  o Middle East  o Brazil  o Argentina  o South Africa  o Egypt What our report offers:  - Market share assessments for the regional and country level segments  - Market share analysis of the top industry players  - Strategic recommendations for the new entrants  - Market forecasts for a minimum of 7 years of all the mentioned segments, sub segments and the regional markets  - Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)  - Strategic recommendations in key business segments based on the market estimations  - Competitive landscaping mapping the key common trends  - Company profiling with detailed strategies, financials, and recent developments  - Supply chain trends mapping the latest technological advancements About Us Wise Guy Reports is part of the Wise Guy Consultants Pvt. Ltd. and offers premium progressive statistical surveying, market research reports, analysis & forecast data for industries and governments around the globe. Wise Guy Reports understand how essential statistical surveying information is for your organization or association. Therefore, we have associated with the top publishers and research firms all specialized in specific domains, ensuring you will receive the most reliable and up to date research data available.


News Article | December 2, 2016
Site: www.newsmaker.com.au

According to Stratistics MRC, Global Failure Analysis market is accounted for $4.82 billion in 2015 and is expected to reach $8.3 billion by 2022 to grow at a CAGR of 8.0%.  Rising applications of failure analysis equipment in nanotechnology and medical applications and advancements in technology and usage of failure analysis equipment in semiconductors are some of the factors driving the market. However, high maintenance and equipment cost may hinder the market growth. Demand for failure analysis equipment in emerging nations may create an opportunity to the market. Automotive segment is expected to grow at a highest CAGR during the forecast period. The favourable growth is attributed to high breach of advanced driver assistance systems and driverless vehicles. North America accounted for the largest share in the market, while, Asia Pacific is expected to regiser highest CAGR during the forecast period owing to high concentration of semiconductor industries in countries such as Taiwan, China, Japan, South Korea and India. Some of the key players in global failure analysis market include Hitachi High-Technologies Corporation, EAG Laboratories, Thermo Fisher Scientific Inc., A&D Company Ltd., FEI Company, CARL Zeiss SMT GmbH, Motion X Corporation, Tescan Orsay Holding, A.S., Jeol Ltd., Intertek Group PLC, RJ Lee Group, Inc. , Evans Analytical Group, Inc., Ops A La Carte LLC, IMR Test Labs and Westpak, Inc. Tests Covered: •  Contamination Analysis • Adhesive Identification • Chemical Analysis and Testing • Coating Contamination • Corrosion Investigation • Electrical Overstress(EOS)/Electrostatic Discharge(EDS) • Fractography • Mechanical Testing • Metallography • Microstructure Evaluation • NDT • Regulatory Compliance Testing • Thermal Mapping • Weld Testing • Other Tests Techniques Covered: • Common mode Failure Analysis   • Destructive Physical Analysis • Failure Modes Effect Analysis(FMEA) • Failure Modes, Effects, and Criticality Analysis(FMECA) • Fault Tree Analysis(FTA) • Functional Failure Analysis • Physics of Failure Analysis • Software Failure Analysis • Sneak Circuit Analysis • Other Techniques End User Industries Covered: • Oil and Gas     • Aerospace • Automotive • Construction • Chemical and Pharmaceutical • Food and Beverage • Industrial • Defence • Metrology and Calibration • Other End User Industries Products Covered: • Transmission Electron Microscope • Focussed ion beam Systems • Scanning Electron Microscopy • Dual Beam Systems • Other Products Technologies Covered: • Broad ion milling (BIM) • Focused ion beam (FIB) • Reactive ion etching (RIE)  • Secondary ion mass spectroscopy (SIMS)  • Energy dispersive X-ray spectroscopy (EDX) • Chemical mechanical planarization (CMP) Applications Covered: • Bio Science o Biomedical Engineering o Cellular Biology o Neuroscience o Structural Biology •  Material science o Ceramic & Glass o Metals & Metallurgy o Nanofabrication o Paper & Fiber Material o Polymer • Electronics o MEMS and Thin Film Production o Semiconductor Manufacturing • Industrial Science o Mining o Automotive & Aerospace o Chemical o Machinery & Tools o Oil & Gas o Power Generation & Energy o Renewable Energy o Others Equipments Covered: • Scanning Electron Microscope (SEM) • Focused ION Beam System (FIB) • Dual–Beam Systems • Transmission Electron Microscope (TEM) Regions Covered: • North America o US o Canada o Mexico • Europe o Germany o France o Italy o UK  o Spain      o Rest of Europe  • Asia Pacific o Japan        o China        o India        o Australia        o New Zealand       o Rest of Asia Pacific       • Rest of the World o Middle East o Brazil o Argentina o South Africa o Egypt What our report offers: - Market share assessments for the regional and country level segments - Market share analysis of the top industry players - Strategic recommendations for the new entrants - Market forecasts for a minimum of 7 years of all the mentioned segments, sub segments and the regional markets - Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations) - Strategic recommendations in key business segments based on the market estimations - Competitive landscaping mapping the key common trends - Company profiling with detailed strategies, financials, and recent developments - Supply chain trends mapping the latest technological advancements


Kral P.,Academy of Sciences of the Czech Republic | Dluhos J.,TESCAN | Perina P.,TESCAN | Bartak T.,TESCAN
Materials Science Forum | Year: 2013

Experiments were conducted to determine microstructure changes occurring during thermal exposure in metals processed by equal-channel angular pressing (ECAP). The ECAP pressing was performed at room temperature by route Bc. Static annealing and constant load creep tests in tension were conducted at 0.3-0.5 Tm. The microstructure was examined by scanning electron microscope combined with focus ion beam - TESCAN LYRA 3 equipped with electron back scatter diffraction (EBSD). © (2013) Trans Tech Publications, Switzerland.


Satori C.P.,University of Minnesota | Henderson M.M.,University of Minnesota | Krautkramer E.A.,University of Minnesota | Kostal V.,Tescan | And 3 more authors.
Chemical Reviews | Year: 2013

The role that organelle analysis has played in understanding biology is studied. Organelle analysis enables a more specific description of the molecular, biochemical, and physiological processes associated with diseases, embryonic development, tissue differentiation, organism aging, disease treatments, and organism response to pathogens. Confocal microscopy has become a routine tool for investigating subcellular organization, organelle networks, and organelle dynamics in cellular and tissue samples. Most organelles have a dynamic, three-dimensional (3D) organization inside the cell, which is tightly connected to their physiological functions. Due to this, a single 2D image inherently limits the information acquired about the distribution of a particular property within the organelle. The combination of subcellular fractionation with 'omic' technologies has become a powerful resource to characterize and catalogue the various subcellular environments in a cell.


Jiruse J.,TESCAN | Havelka M.,TESCAN | Lopour F.,TESCAN
Ultramicroscopy | Year: 2014

A novel field-emission SEM column has been developed that features Beam Deceleration Mode, high-probe current and ultra-fast scanning. New detection system in the column is introduced to detect true secondary electron signal. The resolution power at low energy was doubled for conventional SEM optics and moderately improved for immersion optics. Application examples at low landing energies include change of contrast, imaging of non-conductive samples and thin layers. © 2014 Elsevier B.V.


Hrncir T.,TESCAN | Hladik L.,TESCAN
Conference Proceedings from the International Symposium for Testing and Failure Analysis | Year: 2013

3D tomography of TSVs was performed by combining Xe plasma FIB milling and lift-out techniques. This approach allows analyzing the structure of TSVs in detail using a method faster than the usual 3D tomography by Ga FIB and more precise than X-ray tomography. Both well-filled TSVs and TSVs with voids were analyzed and the results were compared. The analysis procedure was optimized in order to reduce the analysis time and to increase the throughput. The lift-out of the analyzed block of material was performed to obtain 90° angle between TSV and the ion beam axes, which is critical to reduce the curtaining effect and which allowed to increase FIB beam current significantly, reducing the analysis time. Copyright © 2013 ASM International® All rights reserved.


Polonskyi O.,Charles University | Solar P.,Charles University | Kylian O.,Charles University | Drabik M.,Charles University | And 8 more authors.
Thin Solid Films | Year: 2012

Nanocomposite metal/plasma polymer films have been prepared by simultaneous plasma polymerization using a mixture of Ar/n-hexane and metal cluster beams. A simple compact cluster gas aggregation source is described and characterized with emphasis on the determination of the amount of charged clusters and their size distribution. It is shown that the fraction of neutral, positively and negatively charged nanoclusters leaving the gas aggregation source is largely influenced by used operational conditions. In addition, it is demonstrated that a large portion of Ag clusters is positively charged, especially when higher currents are used for their production. Deposition of nanocomposite Ag/C:H plasma polymer films is described in detail by means of cluster gas aggregation source. Basic characterization of the films is performed using transmission electron microscopy, ultraviolet-visible and Fourier-transform infrared spectroscopies. It is shown that the morphology, structure and optical properties of such prepared nanocomposites differ significantly from the ones fabricated by means of magnetron sputtering of Ag target in Ar/n-hexane mixture. © 2011 Elsevier B.V. All rights reserved.


PubMed | Tescan and University of Veterinary And Pharmaceutical Sciences Brno
Type: | Journal: BioMed research international | Year: 2015

Carmellose (CMC) is frequently used due to its high biocompatibility, biodegradability, and low immunogenicity for development of site-specific or controlled release drug delivery systems. In this experimental work, CMC dispersions in two different concentrations (1% and 2%) cross-linked by copper (II) ions (0.5, 1, 1.5, or 2.0M CuCl) were used to prepare microspheres with antimicrobial activity against Escherichia coli and Candida albicans, both frequently occurring pathogens which cause vaginal infections. The microparticles were prepared by an ionotropic gelation technique which offers the unique possibility to entrap divalent copper ions in a CMC structure and thus ensure their antibacterial activity. Prepared CMC microspheres exhibited sufficient sphericity. Both equivalent diameter and copper content were influenced by CMC concentration, and the molarity of copper (II) solution affected only the copper content results. Selected samples exhibited stable but pH-responsive behaviour in environments which corresponded with natural (pH 4.5) and inflamed (pH 6.0) vaginal conditions. All the tested samples exhibited proven substantial antimicrobial activity against both Gram-negative bacteria Escherichia coli and yeast Candida albicans. Unexpectedly, a crucial parameter for microsphere antimicrobial activity was not found in the copper content but in the swelling capacity of the microparticles and in the degree of CMC surface shrinking.


Tescan, Czechoslovakia, will present a webinar on "Failure analysis of Microelectronic Devices" Wednesday May 4 at 9 am EDT. In this webinar, recent achievements in advanced failure analysis in state-of-the-art microelectronic devices will be presented. The presentation is divided into two parts. The first part will include FA results on integrated circuits based on state-of-the-art 14-nm node technology. The focus will be on well-controlled orthogonal and planar IC delayering using gas-assisted Xe plasma FIB etching The second part will cover FA results on advanced packaging technologies using Xe plasma FIB. It will show how TEM lamellae are prepared with Ga and Xe plasma FIB. Particular attention will be paid to the preparation of front- and back-side artifact-free lamellae. Cross-sections with dimensions exceeding 100 µm will be demonstrated, emphasizing the mitigation of FIB artifacts using the proprietary Rocking stage technology and special masking methods. These approaches allow for processing of even the most challenging packages.


This report studies Scanning Electron Microscopy (SEM) in Global market, especially in North America, Europe, China, Japan, Southeast Asia and India, focuses on top manufacturers in global market, with production, price, revenue and market share for each manufacturer, covering  Phenom-World  Tescan  Hitachi  FEI  Carl Zeiss  JOEL  KYKY  KEYSIGHT  COXEM  Oxford Instruments  Felles Photonic  Bruker Market Segment by Regions, this report splits Global into several key Regions, with production, consumption, revenue, market share and growth rate of Scanning Electron Microscopy (SEM) in these regions, from 2011 to 2021 (forecast), like  North America  Europe  China  Japan  Southeast Asia  India Split by product type, with production, revenue, price, market share and growth rate of each type, can be divided into  Type I  Type II  Type III Split by application, this report focuses on consumption, market share and growth rate of Scanning Electron Microscopy (SEM) in each application, can be divided into  Application 1  Application 2  Application 3 1 Scanning Electron Microscopy (SEM) Market Overview  1.1 Product Overview and Scope of Scanning Electron Microscopy (SEM)  1.2 Scanning Electron Microscopy (SEM) Segment by Type  1.2.1 Global Production Market Share of Scanning Electron Microscopy (SEM) by Type in 2015  1.2.2 Type I  1.2.3 Type II  1.2.4 Type III  1.3 Scanning Electron Microscopy (SEM) Segment by Application  1.3.1 Scanning Electron Microscopy (SEM) Consumption Market Share by Application in 2015  1.3.2 Application 1  1.3.3 Application 2  1.3.4 Application 3  1.4 Scanning Electron Microscopy (SEM) Market by Region  1.4.1 North America Status and Prospect (2011-2021)  1.4.2 Europe Status and Prospect (2011-2021)  1.4.3 China Status and Prospect (2011-2021)  1.4.4 Japan Status and Prospect (2011-2021)  1.4.5 Southeast Asia Status and Prospect (2011-2021)  1.4.6 India Status and Prospect (2011-2021)  1.5 Global Market Size (Value) of Scanning Electron Microscopy (SEM) (2011-2021) 2 Global Scanning Electron Microscopy (SEM) Market Competition by Manufacturers  2.1 Global Scanning Electron Microscopy (SEM) Production and Share by Manufacturers (2015 and 2016)  2.2 Global Scanning Electron Microscopy (SEM) Revenue and Share by Manufacturers (2015 and 2016)  2.3 Global Scanning Electron Microscopy (SEM) Average Price by Manufacturers (2015 and 2016)  2.4 Manufacturers Scanning Electron Microscopy (SEM) Manufacturing Base Distribution, Sales Area and Product Type  2.5 Scanning Electron Microscopy (SEM) Market Competitive Situation and Trends  2.5.1 Scanning Electron Microscopy (SEM) Market Concentration Rate  2.5.2 Scanning Electron Microscopy (SEM) Market Share of Top 3 and Top 5 Manufacturers  2.5.3 Mergers & Acquisitions, Expansion 3 Global Scanning Electron Microscopy (SEM) Production, Revenue (Value) by Region (2011-2016)  3.1 Global Scanning Electron Microscopy (SEM) Production by Region (2011-2016)  3.2 Global Scanning Electron Microscopy (SEM) Production Market Share by Region (2011-2016)  3.3 Global Scanning Electron Microscopy (SEM) Revenue (Value) and Market Share by Region (2011-2016)  3.4 Global Scanning Electron Microscopy (SEM) Production, Revenue, Price and Gross Margin (2011-2016)  3.5 North America Scanning Electron Microscopy (SEM) Production, Revenue, Price and Gross Margin (2011-2016)  3.6 Europe Scanning Electron Microscopy (SEM) Production, Revenue, Price and Gross Margin (2011-2016)  3.7 China Scanning Electron Microscopy (SEM) Production, Revenue, Price and Gross Margin (2011-2016)  3.8 Japan Scanning Electron Microscopy (SEM) Production, Revenue, Price and Gross Margin (2011-2016)  3.9 Southeast Asia Scanning Electron Microscopy (SEM) Production, Revenue, Price and Gross Margin (2011-2016)  3.10 India Scanning Electron Microscopy (SEM) Production, Revenue, Price and Gross Margin (2011-2016) 4 Global Scanning Electron Microscopy (SEM) Supply (Production), Consumption, Export, Import by Regions (2011-2016)  4.1 Global Scanning Electron Microscopy (SEM) Consumption by Regions (2011-2016)  4.2 North America Scanning Electron Microscopy (SEM) Production, Consumption, Export, Import by Regions (2011-2016)  4.3 Europe Scanning Electron Microscopy (SEM) Production, Consumption, Export, Import by Regions (2011-2016)  4.4 China Scanning Electron Microscopy (SEM) Production, Consumption, Export, Import by Regions (2011-2016)  4.5 Japan Scanning Electron Microscopy (SEM) Production, Consumption, Export, Import by Regions (2011-2016)  4.6 Southeast Asia Scanning Electron Microscopy (SEM) Production, Consumption, Export, Import by Regions (2011-2016)  4.7 India Scanning Electron Microscopy (SEM) Production, Consumption, Export, Import by Regions (2011-2016) 7 Global Scanning Electron Microscopy (SEM) Manufacturers Profiles/Analysis  7.1 Phenom-World  7.1.1 Company Basic Information, Manufacturing Base and Its Competitors  7.1.2 Scanning Electron Microscopy (SEM) Product Type, Application and Specification  7.1.2.1 Type I  7.1.2.2 Type II  7.1.3 Phenom-World Scanning Electron Microscopy (SEM) Production, Revenue, Price and Gross Margin (2015 and 2016)  7.1.4 Main Business/Business Overview  7.2 Tescan  7.2.1 Company Basic Information, Manufacturing Base and Its Competitors  7.2.2 Scanning Electron Microscopy (SEM) Product Type, Application and Specification  7.2.2.1 Type I  7.2.2.2 Type II  7.2.3 Tescan Scanning Electron Microscopy (SEM) Production, Revenue, Price and Gross Margin (2015 and 2016)  7.2.4 Main Business/Business Overview  7.3 Hitachi  7.3.1 Company Basic Information, Manufacturing Base and Its Competitors  7.3.2 Scanning Electron Microscopy (SEM) Product Type, Application and Specification  7.3.2.1 Type I  7.3.2.2 Type II  7.3.3 Hitachi Scanning Electron Microscopy (SEM) Production, Revenue, Price and Gross Margin (2015 and 2016)  7.3.4 Main Business/Business Overview  7.4 FEI  7.4.1 Company Basic Information, Manufacturing Base and Its Competitors  7.4.2 Scanning Electron Microscopy (SEM) Product Type, Application and Specification  7.4.2.1 Type I  7.4.2.2 Type II  7.4.3 FEI Scanning Electron Microscopy (SEM) Production, Revenue, Price and Gross Margin (2015 and 2016)  7.4.4 Main Business/Business Overview  7.5 Carl Zeiss  7.5.1 Company Basic Information, Manufacturing Base and Its Competitors  7.5.2 Scanning Electron Microscopy (SEM) Product Type, Application and Specification  7.5.2.1 Type I  7.5.2.2 Type II

Loading Tescan collaborators
Loading Tescan collaborators