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Schetty R.,Technic Inc.
National Association for Surface Finishing Annual Conference and Trade Show, SUR/FIN 2014 | Year: 2014

Increasingly stringent regulatory restrictions on the chemical industry continue on a global basis. Governmental regulations may in some cases force manufacturers to abandon well-established, proven solutions and force the adoption of inferior, non-feasible and/or higher cost solutions in order to be in compliance. A recent example is a policy statement issued by China's "National Development and Reform Commission" (NDRC) in March 2013, of which a summary translation states: "Any plating process containing toxic and hazardous cyanide (i.e., gold plating of potassium gold(III) cyanide (KAu(CN)4) and potassium aurocyanide (KAu(CN)2)) will be banned by the end of 2014". This regulation was met with widespread industry resistance and in September 2013 the government decided to postpone the legislation. However, most users of potassium gold cyanide (PGC) consider this to be a warning and it is expected that the legislation will ultimately be enacted. The electronic plating industry is the largest user of PGC in China and globally. While it is technically feasible to replace PGC in some applications - particularly those involving pure gold in rack or barrel plating applications - so far no process has been developed that is free of PGC in high speed 'hard' alloyed gold applications which are most commonly used in the electronic connector plating industry. This paper will describe the challenges involved in formulating a plating process chemistry which is free of all cyanide-compounds (including PGC) for electronic connector plating applications. Studies of several different electrolytes will be presented, and a novel solution will be introduced which satisfies the basic properties required as a contact finish for the connector plating industry.


Schetty R.,Technic Inc.
Electrical Contacts, Proceedings of the Annual Holm Conference on Electrical Contacts | Year: 2015

Tin whiskers are thin, crystalline, conductive filaments that can emanate from electrodeposited tin coatings, which pose electrical reliability concerns. Several driving forces for tin whisker growth related to deposit stress have been identified and accelerated test methods have been developed to simulate these. Preferred crystal orientation (texture) and grain size of electrodeposited matte tin have been found to be correlated with whisker growth propensity. This paper examines tin whisker growth properties of electroplated matte tin deposits with specific crystal orientations <220> and <321> and grain sizes (5-8 μm diameter vs. 1-4μm diameter), using tin whisker tests designed to simulate stress formation due to ambient storage (30°C/60%) RH, 4000 hrs), high temperature and humidity storage (55°C/85% RH, 4000 hrs), thermal coefficient of expansion mismatch (TC +85°C/-55°C, 1500 cycles), externally applied forces (2000g load size/1 mm diameter, 48 hrs), and corrosion (85°C/85% RH, 1000 hrs). In addition, these whisker results are compared to a tin deposit with <112> and <101> crystal orientations. The data and observations of the experiments are discussed in this paper. © 2014 IEEE.


A process for creating a predictive data set predicting the amount of target constituents are in an electrolyte solution at varying temperatures is provided. The process includes (a) obtaining a sample set in which each sample comprises an electrolyte solution of known composition; (b) obtaining an electroanalytical response for each sample in the sample set to produce a electroanalytical response data set at a pre-determined, chosen target temperature; (c) obtaining a plurality of training sets, each training set being measured at a different pre-selected temperature in a range of low to high temperatures that comprises the sample set and corresponds to the electroanalytical response data set; (d) analyzing each of the training sets individually using decomposition and multivariate regression methods to produce a plurality of regression data sets, each at different temperature; and (e) validating the plurality of training data sets to produce a predictive data set for predictive calibration models, each at different temperatures in the pre-selected range of low to high temperatures.


A process for quantifying, by means of soft modeling, the characteristics of an electroplating solution is provided. The process includes (a) obtaining a sample set, wherein each sample comprises a plating solution of proper performance, (b) obtaining an electrochemical response (in form of a tensor) for each of the sample to produce a multi-way electrochemical response data set, (c) obtaining a training set that comprises the sample set and corresponding the multi-way electrochemical response data set, (d) analyzing the training set by soft modeling using multi-way decomposition method coupled with outlier-detection analysis methods to produce a outlier-detection parameters data set, and (e) validating said training data set by soft modeling to produce the multi-way predictive data set for a predictive model.


Trademark
Technic Inc. | Date: 2015-03-02

personal care products, namely, skin creams, skin lotions, skin moisturizers, shower gels, skin exfoliant and make-up remover.


Trademark
Technic Inc. | Date: 2012-04-23

Machines for metal finishing, namely for electroplating parts, electroless plating parts, anodizing parts, electrocoating parts, phosphating parts, cleaning, etching and electropolishing parts, chromating parts and electroforming parts.


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Trademark
Technic Inc. | Date: 2012-12-11

Machines for metal finishing, namely, for electroplating parts, electroless plating parts, anodizing parts, electrocoating parts, phosphating parts, cleaning, etching and electropolishing parts, chromating parts and electroforming parts.


Trademark
Technic Inc. | Date: 2012-04-20

solutions for use in the manufacture of semiconductors.


Trademark
Technic Inc. | Date: 2013-01-30

solutions, powders, salts and alloys for use in cleaning, stripping, plating, immersing, coating or preventing tarnish of precious metals and non-precious metals; powders and chemicals for use in manufacture of photovoltaic and solar cells, modules and devices. machines for metal finishing, namely for electroplating parts, electroless plating parts, anodizing parts, electrocoating parts, phosphating parts, cleaning, etching and electropolishing parts, chromating parts and electroforming parts; machines for the processing and electrodeposition of solar cells and semiconductors; and computer programs for use in operating and monitoring the aforementioned machines.


Trademark
Technic Inc. | Date: 2012-05-17

chemical solutions, powders, salts and alloys for use in plating, immersing, and coating of precious metals and non-precious metals. chemical solutions, powders, and salts for use in preventing tarnish of precious metals and non-precious metals. chemical solutions, powders, and salts for use in cleaning and stripping of precious metals and non-precious metals. machines for metal finishing, namely for electroplating parts, electroless plating parts, anodizing parts, electrocoating parts, phosphating parts, cleaning, etching and electropolishing parts, chromating parts and electroforming parts; machines for the processing and electrodeposition of solar cells and semiconductors. computer programs for use in operating and monitoring machines for electroplating parts, electroless plating parts, anodizing parts, electrocoating parts, phosphating parts, cleaning, etching and electropolishing parts, chromating parts and electroforming parts and machines for the processing and electrodeposition of solar cells and semiconductors.

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