Schetty R.,Technic Inc.
National Association for Surface Finishing Annual Conference and Trade Show, SUR/FIN 2014 | Year: 2014
Increasingly stringent regulatory restrictions on the chemical industry continue on a global basis. Governmental regulations may in some cases force manufacturers to abandon well-established, proven solutions and force the adoption of inferior, non-feasible and/or higher cost solutions in order to be in compliance. A recent example is a policy statement issued by China's "National Development and Reform Commission" (NDRC) in March 2013, of which a summary translation states: "Any plating process containing toxic and hazardous cyanide (i.e., gold plating of potassium gold(III) cyanide (KAu(CN)4) and potassium aurocyanide (KAu(CN)2)) will be banned by the end of 2014". This regulation was met with widespread industry resistance and in September 2013 the government decided to postpone the legislation. However, most users of potassium gold cyanide (PGC) consider this to be a warning and it is expected that the legislation will ultimately be enacted. The electronic plating industry is the largest user of PGC in China and globally. While it is technically feasible to replace PGC in some applications - particularly those involving pure gold in rack or barrel plating applications - so far no process has been developed that is free of PGC in high speed 'hard' alloyed gold applications which are most commonly used in the electronic connector plating industry. This paper will describe the challenges involved in formulating a plating process chemistry which is free of all cyanide-compounds (including PGC) for electronic connector plating applications. Studies of several different electrolytes will be presented, and a novel solution will be introduced which satisfies the basic properties required as a contact finish for the connector plating industry. Source
Schetty R.,Technic Inc.
Electrical Contacts, Proceedings of the Annual Holm Conference on Electrical Contacts | Year: 2015
Tin whiskers are thin, crystalline, conductive filaments that can emanate from electrodeposited tin coatings, which pose electrical reliability concerns. Several driving forces for tin whisker growth related to deposit stress have been identified and accelerated test methods have been developed to simulate these. Preferred crystal orientation (texture) and grain size of electrodeposited matte tin have been found to be correlated with whisker growth propensity. This paper examines tin whisker growth properties of electroplated matte tin deposits with specific crystal orientations <220> and <321> and grain sizes (5-8 μm diameter vs. 1-4μm diameter), using tin whisker tests designed to simulate stress formation due to ambient storage (30°C/60%) RH, 4000 hrs), high temperature and humidity storage (55°C/85% RH, 4000 hrs), thermal coefficient of expansion mismatch (TC +85°C/-55°C, 1500 cycles), externally applied forces (2000g load size/1 mm diameter, 48 hrs), and corrosion (85°C/85% RH, 1000 hrs). In addition, these whisker results are compared to a tin deposit with <112> and <101> crystal orientations. The data and observations of the experiments are discussed in this paper. © 2014 IEEE. Source
Technic Inc. | Date: 2012-04-23
Machines for metal finishing, namely for electroplating parts, electroless plating parts, anodizing parts, electrocoating parts, phosphating parts, cleaning, etching and electropolishing parts, chromating parts and electroforming parts.
Technic Inc. | Date: 2012-12-11
Machines for metal finishing, namely, for electroplating parts, electroless plating parts, anodizing parts, electrocoating parts, phosphating parts, cleaning, etching and electropolishing parts, chromating parts and electroforming parts.
Technic Inc. | Date: 2015-03-02
personal care products, namely, skin creams, skin lotions, skin moisturizers, shower gels, skin exfoliant and make-up remover.