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Deatsville, AL, United States

University of Aarhus and Tech Force | Date: 2013-03-18

The present invention relates to a method of joining a metal part

A power semiconductor device with improved avalanche capability is disclosed by forming at least one avalanche capability enhancement doped region underneath an ohmic contact doped region. Moreover, a source mask is saved by using three masks process and the avalanche capability is further improved.

Tech Force | Date: 2014-10-17

A super-junction trench MOSFET with a short termination area is disclosed, wherein the short termination area comprising a charge balance region and a channel stop region formed near a top surface of an epitaxial layer with a trenched termination contact penetrating therethrough.

A super-junction trench MOSFET integrated with embedded trench Schottky rectifier is disclosed for soft reverse recovery operation. The embedded trench Schottky rectifier can be integrated in a same unit cell with the super-junction trench MOSFET.

A trench MOSFET with embedded schottky rectifier having at least one anti-punch through implant region using reduced masks process is disclosed for avalanche capability enhancement and cost reduction. The source regions have a higher doping concentration and a greater junction depth along sidewalls of the trenched source-body contacts than along adjacent channel regions near the gate trenches.

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