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A resin composition for a permanent insulating film is provided, by which, in particular, partial through-holes obtained by partitioning a through-hole can be easily and precisely formed as designed without a deposition of catalytic species (seed) in a plating resist portion. The present invention provides a resin composition for a permanent insulating film, including a thermosetting resin, a resin filler, and a compound containing at least one atom selected from a sulfur atom and a nitrogen atom. The present invention also provides a multilayer printed wiring board in which conductive layers having a circuit pattern and insulation layers are alternately overlaid with each other, and a through-hole enabling electric conductivity among conductive layers via a through-hole. The through-hole includes a plating resist portion provided on either of an interlaminar part between the conductive layer and the insulation layer or another interlaminar part between the insulation layers, or both. The plating portion(s) is/are provided on the interlaminar parts which had been exposed in an opening as the through-hole, and on an exposed region other than the plating resist portion, and the plating resist portion is made of a cured product of the resin composition.


Patent
Taiyo Ink Manufacturing Co. | Date: 2016-09-14

Provided are: a curable composition that shows good adhesion on a printed wiring board, particularly a flexible substrate or the like, and has a high hardness; a resist coating film of the curable composition; and a printed wiring board having a resist pattern of the resist coating film. The curable composition comprises: (A) a photobase generator; (B-1) an epoxy group-containing (meth)acrylate compound or (B-2) a carboxyl group-containing (meth)acrylate compound; (C) a photopolymerization initiator; and (D-1) a thermosetting component (excluding the (B-1) epoxy group-containing (meth)acrylate compound) or (D-2) a thermosetting component (excluding the (B-2) carboxyl group-containing (meth)acrylate compound).


Patent
TAIYO INK Manufacturing CO. | Date: 2014-06-27

An object of the present invention is to provide: a heat-curable composition capable of yielding a cured article in which crack generation during a heating-cooling cycle can be inhibited; a dry film thereof; and a printed wiring board comprising the cured article. The heat-curable composition is characterized by comprising a semisolid or a solid epoxy compound and a curing accelerator that is made miscible with the epoxy compound when heated at 130 to 220 C. The dry film comprises a resin layer formed from this heat-curable composition, and the printed wiring board comprises a cured article obtained from the heat-curable composition or the dry film.


An alkaline development-type curable resin composition having an excellent strength against tearing, breaking, distortion and torsion, and excellent toughness, a cured product of the curable resin composition, a printed circuit board having the cured product, and a process for manufacturing the cured product are disclosed. A curable resin composition is obtained, which contains (A) a thermoplastic resin, (B) a thermosetting component, (C) an alkali-soluble component, and at least one of (D-1) a photopolymerization initiator and (D-2) a photo-base generator, the thermoplastic resin (A) having two or more glass transition points including two glass transition points Tgx and Tgy, which satisfy Tgx>30 C. and Tgy<0 C. and the thermosetting component (B) having a glass transition point Tgz, which satisfies TgzTgy+20 C. Moreover, a cured product of the curable resin composition, a printed circuit board having the cured product, and a process for manufacturing the cured product are obtained.


Provided is a curable composition for a printed wiring board, which composition exhibits high physical strength as a coating film in terms of solder heat resistance, pencil hardness and the like and in which the components contained therein are not likely to precipitate in long-term storage even when the composition is configured to have a low viscosity and thereby made applicable to ink-jet printing, spin-coating and the like. The curable composition for a printed wiring board is characterized by comprising (A) a filler having a specific gravity of 3 or less, (B) a hydroxyl group-containing (meth)acrylate compound and (C) a photopolymerization initiator. The (A) filler having a specific gravity of 3 or less is preferably an inorganic filler.


Patent
TAIYO INK Manufacturing CO. | Date: 2015-11-06

An object of the present invention is to provide: a dry film comprising a resin layer which has excellent detachability from a carrier film and in which cracking and powdering are inhibited; and a printed wiring board comprising a cured article obtained by curing the dry film. The dry film comprises a resin layer containing a thermosetting resin component, a filler and at least two solvents, wherein the at least two solvents both have a boiling point of 100 C. or higher and the boiling points of the at least two solvents are different by not less than 5 C.


Patent
TAIYO INK Manufacturing CO. | Date: 2015-01-14

A three-dimensional circuit board which can prevent solder flow during component mounting or a short in a circuit, and a solder resist composition used for the same. The three-dimensional circuit board includes a circuit formed on a three-dimensional board and a component mount unit. A solder resist is formed such that a component mount unit is open, and an electronic component is mounted on a component mount unit with solder. The solder resist can be a photoresist, and the three-dimensional board can be a resin molding with a circuit formed on the resin molding.


Patent
Taiyo Ink Manufacturing Co. | Date: 2016-11-23

Provided is a highly reliable three-dimensional circuit board which can prevent solder flow during component mounting or a short in a circuit, and a solder resist composition used for the same. Provided is a three-dimensional circuit board (10) comprising a circuit (2) formed on a three-dimensional board (1) and a component mount unit (3). A solder resist (4) is formed such that a component mount unit (3) is open, and an electronic component is mounted on a component mount unit (3) with solder. Preferably, a solder resist (4) is a photoresist, and preferably, a three-dimensional board 1 is a resin molding and a circuit (2) is formed on a resin molding.


Provided is a photosensitive dry film capable of forming a solder resist layer that has an excellent filling property of underfill and that exhibits an excellent adhesion with a mold material. The photosensitive dry film according to the present invention is a photosensitive dry film including a supporting film and a photosensitive resin layer provided on one side of the supporting film, wherein the arithmetic average surface roughness Ra of the side of the supporting film on which the photosensitive resin layer is provided is 50 to 390 nm.


Provided is a curable composition for a printed wiring board, which composition exhibits high physical strength as a coating film in terms of solder heat resistance, pencil hardness and the like and in which the components contained therein are not likely to precipitate in long-term storage even when the composition is configured to have a low viscosity and thereby made applicable to ink-jet printing, spin-coating and the like. The curable composition for a printed wiring board is characterized by comprising (A) a filler having a specific gravity of 3 or less, (B) a hydroxyl group-containing (meth)acrylate compound and (C) a photopolymerization initiator. The (A) filler having a specific gravity of 3 or less is preferably an inorganic filler.

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