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A process for the preparation of a printed wiring board that can prevent generation of crack and warpage is provided. A process for the preparation of a printed wiring board, comprising a step of forming a curable resin layer and a non-curable resin layer sequentially on a surface of a substrate; a step of forming depressions in the non-curable resin layer and the curable resin layer from the non-curable resin layer side; a step of applying a catalyst for plating to a surface of the non-curable resin layer and surfaces of the depressions; a step of removing the non-curable resin layer and the catalyst for plating provided on the surface of the non-curable resin layer; and a step of electroless plating the surfaces of the depressions.


Provided are: a curable composition which can attain both good adhesion to a printed circuit board, particularly to a flexible substrate or the like; a resist coating film of the curable composition; and a printed circuit board comprising a resist pattern formed by the curable composition. By the present invention, a curable composition for a printed circuit board comprising (A) a compound having a triazine ring, (B) a (meth)acrylate compound having a hydroxyl group and (C) a photopolymerization initiator; a coating film obtained by photo-curing the curable composition; and a printed circuit board comprising a resist pattern formed by the curable composition, are obtained.


An object of the present invention is to obtain a white curable composition that can yield a highly reflective cured coating film without requiring a complicated step and show good dispersion even without being subjected to an extended dispersion treatment. Provided is a white curable composition for a printed circuit board comprising: (A) a white pigment; (B) a (meth)acrylate compound having a hydroxyl group; (C) a photopolymerization initiator; and (D) a wetting dispersant. The above-described (A) white pigment is preferably titanium oxide. Further, it is also preferred that the above-described titanium oxide be a rutile-type titanium oxide and have a maximum particle size of 1 m or smaller.


Patent
TAIYO INK Manufacturing CO. | Date: 2015-11-06

An object of the present invention is to provide: a dry film comprising a resin layer which has excellent detachability from a carrier film and in which cracking and powdering are inhibited; and a printed wiring board comprising a cured article obtained by curing the dry film. The dry film comprises a resin layer containing a thermosetting resin component, a filler and at least two solvents, wherein the at least two solvents both have a boiling point of 100 C. or higher and the boiling points of the at least two solvents are different by not less than 5 C.


Provided is a photosensitive dry film capable of forming a solder resist layer that has an excellent filling property of underfill and that exhibits an excellent adhesion with a mold material. The photosensitive dry film according to the present invention is a photosensitive dry film including a supporting film and a photosensitive resin layer provided on one side of the supporting film, wherein the arithmetic average surface roughness Ra of the side of the supporting film on which the photosensitive resin layer is provided is 50 to 390 nm.

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