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Chang T.L.,National Taiwan Normal University | Chang C.F.,National Taiwan Normal University | Lee Y.W.,Chung Cheng Institute of Technology | Cheng C.H.,National Taiwan Normal University | And 2 more authors.
Advanced Materials Research | Year: 2014

An advanced LED multi-die-bonding integration using a fluidic self-assembly technique is proposed in the field of flip chip packages. Different form the conventional pick-and-place methods for a single LED die bonding, the fluidic approach is a relatively new design and a batch process, which can achieve not only die self-alignment but die self-assembly. Here, the size of LED die is 1-mm-square chip with the thickness of 0.3 mm. Due to the smaller size of LED die, the die-bonding process is still in need of finding a suitable approach and breakthrough. In this study, our design of fluidic self-assembly device is based on the experimental test and simulation results. The device design is the gas-flow channels with the magnetism. The width, height and length of each gas-flow channel are 1.1 mm, 0.5 mm, and 1 cm, respectively. With the restriction of the channel width, this structure design can control well to die self-alignment. In addition, the design of two circular structures in the channel can form a flat rim to achieve the die self-assemble. This mechanism of fluidic approach can be useful to the LED die self-alignment and self-assembly in the future batch processing. © (2014) Trans Tech Publications, Switzerland.

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