Sunchang Corporation

Incheon, South Korea

Sunchang Corporation

Incheon, South Korea
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Lee S.-M.,Korea forest Research Institute | Park J.-Y.,Seoul Development Institute | Park S.-B.,Korea forest Research Institute | Han S.-T.,Sunchang Corporation | Kang E.-C.,Sunchang Corporation
Forest Products Journal | Year: 2012

Amino resin wood adhesives used for medium-density fiberboard (MDF), a melamine-urea-formaldehyde (MUF) resin and a urea-formaldehyde (UF) resin, were each synthesized with an overall formaldehyde/urea molar ratio of 1.10. The storage stability of the resins was monitored by their gel times and viscosity changes, as well as by a multiple light scattering method. The storage stability tended to be affected by the temperature at which the resins were stored. MUF resin had a higher storage stability at a storage temperature above room temperature, whereas UF resin exhibited the best storage stability at 10°C with overall good stability at all tested temperatures from 10°C to 40°C. © Forest Products Society 2012.

Park B.-D.,Kyungpook National University | Kang E.-C.,Sunchang Enterprise | Park S.-B.,Korea forest Research Institute | Park J.Y.,Korea forest Research Institute
European Journal of Wood and Wood Products | Year: 2011

Since different test methods of measuring the formaldehyde emission (FE) from wood-based composite panels have been used for different countries and regions, this study attempted to establish empirical correlations between three test methods (i.e., 24-hour desiccator, 1 m 3 chamber, and perforator) for plywood (PLW), particleboard (PB), and medium density fiberboard (MDF), particularly emphasizing on correlations between the 24-hour desiccator and the 1 m 3 chamber method. The desiccator method found statistically high correlations with other two methods, resulting in regression coefficient values ranging from 0.96 to 0.88 for PLW, PB, and MDF samples. In particular, the desiccator method had an empirically high correlation with the 1 m 3 chamber method that had been adopted as the reference method of comparing regionally different test methods of measuring the FE of wood-based composite panels by the ISO/TC89. © 2010 Springer-Verlag.

Seo J.-W.,Konkuk University | Lee E.-S.,Sunchang Corporation | Kang C.-Y.,Korea Forestry Promotion InstituteSeoul | Kim S.-B.,Korea forest Research Institute | And 2 more authors.
Journal of the Korean Wood Science and Technology | Year: 2015

The quality characteristics of the woodpellet manufactured from two domestic pines (Pinus densiflora S. et Z. and Pinus rigida Mill.) were investigated for the efficient energy use of woody biomass resources. Properties of woodpellets such as moisture content, heating value, ash content, apparent density and durability were determined by using the standard test method of woodpellets of Korea Forest Research Institute (KFRI) and elemental analysis. The results of elemental analysis for C, H, O and N showed 61.42% carbon, 5.56% hydrogen, 32.87% oxygen, and 0.15% nitrogen for Pinus densiflora S. et Z. and 61.03% carbon, 5.96% hydrogen, 32.83% oxygen, and 0.18% nitrogen for Pinus rigida Mill. No significant difference between Pinus densiflora S. et Z. and Pinus rigida Mill was observed on elemental analysis. Heating values of each woodpellet were ranged from 19.00 to 19.42 MJ/kg which satisfied the first grade quality standard (≥ 18.0 MJ/kg) by KFRI. The ash contents of woodpellet were slightly different between Pinus densiflora S. et Z. and Pinus rigida Mill., and satisfied the first grade quality standard (≤ 0.7%) by KFRI. Apparent density of woodpellet (Pinus densiflora S. et Z.) was passed the first grade standard level (≥ 640 kg/m3), and woodpellets from Pinus rigida Mill. satisfied the second grade quality of the standard. The moisture contents of each woodpellet were satisfied by the first grade quality standard (≤ 10%). The durability of woodpellet (Pinus densiflora S. et Z.) was passed the third grade level (≥ 95%), but Pinus rigida Mill. woodpellet was insufficient to satisfy the quality standard.

Oh and Sunchang Corporation | Date: 2012-02-08

Disclosed is a floorboard to provide simplified assembly of flooring panels without damage and achieve enhanced horizontal coupling force. The floorboard includes a tongue part provided at a first flooring panel and a recessed part provided at a second flooring panel. The tongue part includes a tongue protrusion, a tongue bottom portion, and a raised retaining portion protruding downward from the tongue bottom portion. The recessed part includes an upper lip caught by the tongue protrusion when the tongue part is inserted into the recessed part, a lower lip, a raised portion protruding upward from an end of the lower lip, and a guide wall defining an inner wall of the recessed part and having the same contour as an arc drawn by an end of the tongue protrusion as the tongue part introduced between the upper and lower lips is pivotally rotated.

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