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Li G.,Oracle Inc. | Zheng X.,Oracle Inc. | Lexau J.,SUN Laboratories | Luo Y.,Oracle Inc. | And 16 more authors.
Proceedings of SPIE - The International Society for Optical Engineering | Year: 2010

The Ultra-performance Nanophotonic Intrachip Communication (UNIC) project aims to achieve unprecedented high-density, low-power, large-bandwidth, and low-latency optical interconnect for highly compact supercomputer systems. This project, which has started in 2008, sets extremely aggressive goals on power consumptions and footprints for optical devices and the integrated VLSI circuits. In this paper we will discuss our challenges and present some of our first-year achievements, including a 320 fJ/bit hybrid-bonded optical transmitter and a 690 fJ/bit hybrid-bonded optical receiver. The optical transmitter was made of a Si microring modulator flip-chip bonded to a 90nm CMOS driver with digital clocking. With only 1.6mW power consumption measured from the power supply voltages and currents, the transmitter exhibits a wide open eye with extinction ratio >7dB at 5Gb/s. The receiver was made of a Ge waveguide detector flip-chip bonded to a 90nm CMOS digitally clocked receiver circuit. With 3.45mW power consumption, the integrated receiver demonstrated -18.9dBm sensitivity at 5Gb/s for a BER of 10-12. In addition, we will discuss our Mux/Demux strategy and present our devices with small footprints and low tuning energy. © 2010 Copyright SPIE - The International Society for Optical Engineering. Source


Zheng X.,Oracle Inc. | Cunningham J.E.,Oracle Inc. | Koka P.,SUN Laboratories | Schwetman H.,SUN Laboratories | And 7 more authors.
Journal of Nanoscience and Nanotechnology | Year: 2010

We present an advanced wavelength-division multiplexing point-to-point network enabled by silicon nanophotonic devices. This network offers strictly non-blocking all-to-all connectivity while maximizing bisection bandwidth, making it ideal for multi-core and multi-processor interconnections. We introduce one of the key components, the nanophotonic grating coupler, and discuss, for the first time, how this device can be useful for practical implementations of the wavelength-division multiplexing network using optical proximity communications. Finite difference time-domain simulation of the nanophotonic grating coupler device indicates that it can be made compact (20 μm x 50 μm), low loss (3.8 dB), and broadband (100 nm). These couplers require subwavelength material modulation at the nanoscale to achieve the desired functionality. We show that optical proximity communication provides unmatched optical I/O bandwidth density to electrical chips, which enables the application of wavelength-division multiplexing point-to-point network in macrochip with unprecedented bandwidth-density. The envisioned physical implementation is discussed. The benefits of such an interconnect network include a 5-6x improvement in latency when compared to a purely electronic implementation. Performance analysis shows that the wavelength-division multiplexing point-to-point network offers better overall performance over other optical network architectures. Copyright © 2010 American Scientific Publishers All rights reserved. Source


Zheng X.,Oracle Inc. | Lexau J.,SUN Laboratories | Luo Y.,Oracle Inc. | Thacker H.,Oracle Inc. | And 10 more authors.
Optics Express | Year: 2010

We report the first sub-picojoule per bit (400fJ/bit) operation of a silicon modulator intimately integrated with a driver circuit and embedded in a clocked digital transmitter. We show a wall-plug power efficiency below 400μW/Gbps for a 130nm SOI CMOS carrier-depletion ring modulator flip-chip integrated to a 90nm bulk Si CMOS driver circuit. We also demonstrate stable error-free transmission of over 1.5 petabits of data at 5Gbps over 3.5 days using the integrated modulator without closed-loop ring resonance tuning. Small signal measurements of the CMOS ring modulator, sans circuit, showed a 3dB bandwidth in excess of 15GHz at 1V of reverse bias, indicating that further increases in transmission rate and reductions of energy-per-bit is possible while retaining compatibility with CMOS drive voltages. © 2010 Optical Society of America. Source


Li G.,Oracle Inc. | Zheng X.,Oracle Inc. | Lexau J.,SUN Laboratories | Luo Y.,Oracle Inc. | And 15 more authors.
Optics InfoBase Conference Papers | Year: 2010

We report a 320fJ/bit transmitter made of a Si microring modulator flip-chip bonded to a CMOS driver. The transmitter consumes only 1.6mW power, and exhibits a wide open eye with extinction ratio >7dB at 5Gb/s. © 2010 Optical Society of America. Source


Li G.,Oracle Inc. | Zheng X.,Oracle Inc. | Lexau J.,Oracle Inc. | Lexau J.,SUN Laboratories | And 25 more authors.
2010 Conference on Optical Fiber Communication, Collocated National Fiber Optic Engineers Conference, OFC/NFOEC 2010 | Year: 2010

We report a 320fJ/bit transmitter made of a Si microring modulator flip-chip bonded to a CMOS driver. The transmitter consumes only 1.6mW power, and exhibits a wide open eye with extinction ratio >7dB at 5Gb/s. © 2010 Optical Society of America. Source

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