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Patent
Japan Advanced Institute of Science, Technology and Sumitomo Seika Chemicals Co. | Date: 2016-06-15

The invention provides an oxide semiconductor layer that has less cracks and is excellent in electrical property and stability, as well as a semiconductor element and an electronic device each including the oxide semiconductor layer. The invention provides an exemplary method of producing an oxide semiconductor layer, and the method includes the precursor layer forming step of forming, on or above a substrate, a layered oxide semiconductor precursor including a compound of metal to be oxidized into an oxide semiconductor dispersed in a solution including a binder made of aliphatic polycarbonate, and the annealing step of heating the precursor layer at a first temperature achieving decomposition of 90wt% or more of the binder, and then annealing the precursor layer at a temperature equal to or higher than a second temperature (denoted by X) that is higher than the first temperature, achieves bonding between the metal and oxygen, and has an exothermic peak value in differential thermal analysis (DTA).


Patent
Japan Advanced Institute of Science, Technology and Sumitomo Seika Chemicals Co. | Date: 2016-10-26

It is an object of the invention to provide a thin film transistor and a method for producing the same, which will easily achieve self-aligned formation of a source/drain region without through processes under a vacuum or a low pressure or with no use of expensive equipment. An exemplary method for producing a thin film transistor according to the invention includes an aliphatic polycarbonate layer forming step of forming an aliphatic polycarbonate layer 50 that covers a gate electrode layer 40 disposed above a semiconductor layer 20 with a gate insulator 30 being interposed between the gate electrode layer 40 and the semiconductor layer 20, and also covers the semiconductor layer 20, and has a dopant causing the semiconductor layer 20 to become an n-type or p-type semiconductor layer, and a heating step of heating at a temperature causing introduction of the dopant into the semiconductor layer 20 and decomposition of the aliphatic polycarbonate layer 50.


Patent
Sumitomo Seika Chemicals Co. | Date: 2016-03-23

Provided are a water-absorbent resin having better water-absorption performance and being prevented from discoloring before and after storage for a long time under high temperature and high humidity, and an absorbent article including the absorbent resin. The water-absorbent resin according to the present invention is prepared by polymerizing a water-soluble ethylenically unsaturated monomer in the presence of an internal-crosslinking agent and performing post-crosslinking with a post-crosslinking agent, wherein the water-absorbent resin satisfies the following properties: (A) a water-absorption capacity of physiological saline of 55 g/g or more, a water-absorption capacity of physiological saline under a load of 4.14 kPa of 15 mL/g or more, and a residual monomer content of 300 ppm or less; and (B) a yellow index of 5.0 or less and a yellow index change ratio (YI) after leaving for 10 days under 70C and 90% RH of 10 or less.


Patent
Sumitomo Seika Chemicals Co. | Date: 2016-03-02

This invention provides a polyolefin-based resin composition excellent in mechanical strength and elasticity. The polyolefin-based resin composition comprises a polyolefin-based resin, and, per 100 parts by mass of the polyolefin-based resin, 0.05 to 10 parts by mass of an aliphatic polycarbonate resin and 0.01 to 2 parts by mass of an acid modified polypropylene.


Patent
Sumitomo Seika Chemicals Co. | Date: 2016-06-08

By allowing a water-soluble ethylenically unsaturated monomer to undergo a reversed-phase suspension polymerization in the presence of a dispersion stabilizer containing a tall oil fatty acid ester, using a radical polymerization initiator in a hydrocarbon dispersion medium, water-absorbent resin particles achieving both satisfactory water-absorption ability and a state of particles having a moderate particle size and having a narrow particle size distribution are obtained. The tall oil fatty acid ester usable herein is usually at least one kind of ester selected from the group consisting of a sorbitol tall oil fatty acid ester, a sorbitan tall oil fatty acid ester and a polyethylene glycol tall oil fatty acid ester.


Patent
Sumitomo Seika Chemicals Co. | Date: 2016-04-20

To provide: a fracturing fluid viscosity-controlling agent, which is capable of maintaining the high viscosity of the fracturing fluid during fracture formation in hydraulic fracturing and of reducing the viscosity during recovery of the fracturing fluid; a fracturing fluid comprising said viscosity-controlling agent; and a crude oil or natural gas drilling method using said fracturing fluid. This viscosity-controlling agent, which is used for controlling viscosity changes of a fracturing fluid used in hydraulic fracturing, comprises polyalkylene oxide and a viscosity-reducing agent and is a tablet.


Disclosed is a water-absorbent resin particle in which the water-absorption rate of physiological saline is 1 second to 15 seconds, the median particle size is 100 m to 600 m, and the residual volatile component content is 1.5% by weight or less.


Patent
Sumitomo Seika Chemicals Co. | Date: 2016-10-26

The present invention provides an epoxy resin adhesive that exhibits low shrinkage and excellent adhesiveness. The epoxy resin adhesive includes (A) an epoxy resin, (B) a curing agent, and (C) a particulate polyolefin-based resin having a volume average particle size of 1 to 25 m, wherein the particulate polyolefin-based resin is spherical, and wherein the particulate polyolefin-based resin is present in an amount of 1 to 50 parts by mass per 100 parts by mass of the epoxy resin.


Disclosed is a water-absorbent resin particle in which the water-absorption rate of physiological saline is 1 second to 15 seconds, the median particle size is 100 m to 600 m, and the residual volatile component content is 1.5% by weight or less.


An object of the present invention is to provide a fiber treatment agent that is capable of forming on fibers a film that has excellent water resistance and excellent adhesion to a matrix resin. The present invention provides a fiber treatment agent comprising an aqueous medium, a water-insoluble polyamide dispersed in the aqueous medium, and a water-soluble polyamide that is present in an amount of 2 to 50 parts by mass per 100 parts by mass of the water-insoluble polyamide.

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