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Patent
Japan Advanced Institute of Science, Technology and Sumitomo Seika Chemicals Co. | Date: 2016-12-13

The invention provides an oxide semiconductor layer that has less cracks and is excellent in electrical property and stability, as well as a semiconductor element and an electronic device each including the oxide semiconductor layer. The invention provides an exemplary method of producing an oxide semiconductor layer, and the method includes the precursor layer forming step of forming, on or above a substrate, a layered oxide semiconductor precursor including a compound of metal to be oxidized into an oxide semiconductor dispersed in a solution including a binder made of aliphatic polycarbonate, and the annealing step of heating the precursor layer at a first temperature achieving decomposition of 90 wt % or more of the binder, and then annealing the precursor layer at a temperature equal to or higher than a second temperature (denoted by X) that is higher than the first temperature, achieves bonding between the metal and oxygen, and has an exothermic peak value in differential thermal analysis (DTA).


Patent
Sumitomo Seika Chemicals Co. | Date: 2017-05-17

Provided are: a water-absorbent resin which has a better water absorption performance and with which it is possible to improve absorption performance under a load when used in an absorbent material; and an absorbent article using an absorbent material that includes the water-absorbent resin. This water-absorbent resin, obtained by polymerising a water soluble ethylenically unsaturated monomer in the presence of an internal-crosslinking agent and by post-crosslinking using a post-crosslinking agent, has a water-absorption capacity of physiological saline under a load of 4.14 kPa of 16 mL/g or more, has a mass proportion of particles from 150 to 850 m relative to the whole proportion of 85 mass% or more, moreover has a mass proportion of particles from 300 to 400 m relative to the whole proportion of 20 mass% or more, and has an absorption capacity elasticity index represented by formula (I) of 68,000 or more. Absorption capacity elasticity index = storage elastic modulus [Pa] centrifugal retention rate [g/g] ...(I)


Patent
Sumitomo Seika Chemicals Co. | Date: 2017-07-05

The present invention aims to provide a polyester resin composition capable of producing a molded article having excellent stretchability. The present invention also aims to provide a molded article including the polyester resin composition. The present invention relates to a polyester resin composition including: a polyester resin; and a polyrotaxane that has a cyclic molecule, a linear molecule threading through a cavity of the cyclic molecule in a skewered manner, and capping groups capping both ends of the linear molecule.


Patent
Kanazawa University and Sumitomo Seika Chemicals Co. | Date: 2017-07-05

The present invention provides a polyolefin-based resin composition that has improved resilience while maintaining mechanical strength and stretching properties, as well as a molded article and a polyolefin-based resin film formed from this composition. The polyolefin-based resin composition comprises a polyolefin-based resin, a polyalkylene carbonate resin, and an ionic liquid. The polyolefin-based resin film of the present invention is formed by molding the polyolefin-based resin composition and is stretched at least in a monoaxial direction.


Patent
Japan Advanced Institute of Science, Technology and Sumitomo Seika Chemicals Co. | Date: 2016-10-26

It is an object of the invention to provide a thin film transistor and a method for producing the same, which will easily achieve self-aligned formation of a source/drain region without through processes under a vacuum or a low pressure or with no use of expensive equipment. An exemplary method for producing a thin film transistor according to the invention includes an aliphatic polycarbonate layer forming step of forming an aliphatic polycarbonate layer 50 that covers a gate electrode layer 40 disposed above a semiconductor layer 20 with a gate insulator 30 being interposed between the gate electrode layer 40 and the semiconductor layer 20, and also covers the semiconductor layer 20, and has a dopant causing the semiconductor layer 20 to become an n-type or p-type semiconductor layer, and a heating step of heating at a temperature causing introduction of the dopant into the semiconductor layer 20 and decomposition of the aliphatic polycarbonate layer 50.


Patent
Sumitomo Seika Chemicals Co. | Date: 2016-06-08

By allowing a water-soluble ethylenically unsaturated monomer to undergo a reversed-phase suspension polymerization in the presence of a dispersion stabilizer containing a tall oil fatty acid ester, using a radical polymerization initiator in a hydrocarbon dispersion medium, water-absorbent resin particles achieving both satisfactory water-absorption ability and a state of particles having a moderate particle size and having a narrow particle size distribution are obtained. The tall oil fatty acid ester usable herein is usually at least one kind of ester selected from the group consisting of a sorbitol tall oil fatty acid ester, a sorbitan tall oil fatty acid ester and a polyethylene glycol tall oil fatty acid ester.


Patent
Sumitomo Seika Chemicals Co. | Date: 2016-04-20

To provide: a fracturing fluid viscosity-controlling agent, which is capable of maintaining the high viscosity of the fracturing fluid during fracture formation in hydraulic fracturing and of reducing the viscosity during recovery of the fracturing fluid; a fracturing fluid comprising said viscosity-controlling agent; and a crude oil or natural gas drilling method using said fracturing fluid. This viscosity-controlling agent, which is used for controlling viscosity changes of a fracturing fluid used in hydraulic fracturing, comprises polyalkylene oxide and a viscosity-reducing agent and is a tablet.


Patent
Sumitomo Seika Chemicals Co. | Date: 2016-10-26

The present invention provides an epoxy resin adhesive that exhibits low shrinkage and excellent adhesiveness. The epoxy resin adhesive includes (A) an epoxy resin, (B) a curing agent, and (C) a particulate polyolefin-based resin having a volume average particle size of 1 to 25 m, wherein the particulate polyolefin-based resin is spherical, and wherein the particulate polyolefin-based resin is present in an amount of 1 to 50 parts by mass per 100 parts by mass of the epoxy resin.


Disclosed is a water-absorbent resin particle in which the water-absorption rate of physiological saline is 1 second to 15 seconds, the median particle size is 100 m to 600 m, and the residual volatile component content is 1.5% by weight or less.


An object of the present invention is to provide a fiber treatment agent that is capable of forming on fibers a film that has excellent water resistance and excellent adhesion to a matrix resin. The present invention provides a fiber treatment agent comprising an aqueous medium, a water-insoluble polyamide dispersed in the aqueous medium, and a water-soluble polyamide that is present in an amount of 2 to 50 parts by mass per 100 parts by mass of the water-insoluble polyamide.

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