Tochigi, Japan
Tochigi, Japan

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Patent
Sumitomo Bakelite | Date: 2016-09-14

A packaging bag for a cell culture vessel used for sealing a cell culture vessel, wherein when the packaging bag for a cell culture vessel sealing the cell culture vessel is accommodated in a closed space in which ordinary pressure is maintained, a temperature of 45 C. is maintained and the volume is 170 L, and the total amount of 70 mL of 6-mass % hydrogen peroxide aqueous solution is vaporized by applying ultrasonic vibration for 7 minutes in the closed space, and the hydrogen peroxide is decomposed by ultraviolet irradiation at a wavelength of 254 nm so that hydrogen peroxide concentration in the closed space becomes equal to or smaller than 1 mg/L within 90 minutes from the stop of the ultrasonic vibration, the amount of hydrogen peroxide adsorbed to the cell culture vessel is less than 3 ng/cm^(2).


According to the present invention, there is provided a resol phenolic resin for a friction material wherein the resol phenolic resin has a structural unit A represented by Formula (1) and a structural unit B represented by Formula (2): wherein in Formula (1), m represents an integer of 1 or more; in a case where m is 1, R represents a methylol group; and in a case where m is 2 or more, Rs independently represent a hydrogen atom or a methylol group and at least one R is a methylol group; and wherein in Formula (2), n represents an integer of 1 or more; in a case where n is 1, R represents a methylol group; and in a case where n is 2 or more, Rs independently represent a hydrogen atom or a methylol group and at least one R is a methylol group.


Patent
Promerus Llc and Sumitomo Bakelite | Date: 2016-04-12

The present invention relates to photosensitive compositions containing polynorbornene (PNB) polymers and certain additives that are useful for forming microelectronic and/or optoelectronic devices and assemblies thereof, and more specifically to compositions encompassing PNBs and certain hindered phenols as additives which are capable of controlling the adhesiveness by radiation.


Patent
Akron Polymer Systems, Inc. and Sumitomo Bakelite | Date: 2016-01-15

In an aspect, the present disclosure relates to a polyamide solution comprising an aromatic polyamide and a solvent, wherein a Youngs modulus of at least one direction of a cast film produced by casting the polyamide solution on a glass plate is 3.0 GPa or more, and a tensile strength of the cast film is 100 MPa or more and 250 MPa or less. In another aspect, the present disclosure relates to a polyamide solution comprising an aromatic polyamide and a solvent, wherein a Youngs modulus of at least one direction of a cast film produced by casting the polyamide solution on a glass plate is 3.0 GPa or more, and an aromatic polyamide of the polyamide solution has a constitutional unit represented by following general formulae (I) and (II).


A method for producing a molded article of the present invention includes a step of preparing a pellet raw material containing a resin and raw fibers, a step of cutting the pellet raw material to obtain a plurality of pellets each containing the resin and fibers produced by cutting the raw fibers, a step of opening the fibers contained in each pellet; and a step of molding the pellets after being opened to obtain the molded article. According to the present invention, it is possible to easily produce a molded article (e.g., a back plate of a brake pad) having excellent mechanical strength. Further, According to the present invention, it is also possible to provide a molded article and a back plate each having excellent mechanical strength, and a brake pad having high reliability.


Patent
Sumitomo Bakelite | Date: 2016-04-27

The resin composition for sealing semiconductor according to the present invention is characterized by containing a maleimide-based compound represented by the following general formula (1), at least one of the benzoxazine-based compounds represented by the following general formula (2-1) and the following general formula (2-2), a curing catalyst, and an inorganic filler. In the general formulae (1), (2-1) and (2-2), each of X^(2), X^(3) and X^(4) independently represents an alkylene group having 1 to 10 carbon atoms, a group represented by the following general formula (3), a group represented by the formula -SO_(2)- or -CO-, an oxygen atom or a single bond.


Patent
Sumitomo Bakelite | Date: 2016-10-26

A thermosetting resin composition (P) of the present invention is used for forming a resin member (101) in a metal-resin composite body (100) including the resin member (101) and an aluminum-based metal member (102) bonded to the resin member (101) and contains a thermosetting resin (A) and a filler (B), in which a rate of change of warpage is equal to or greater than -35% and equal to or less than 35%.


Patent
Sumitomo Bakelite | Date: 2016-07-20

A method for manufacturing a molded article obtained by integrating a plate-shaped or sheet-shaped metal member (100) and a resin member, includes a step of putting the metal member (100) in a molding space (10) by using a molding mold (3) which includes a first mold portion (1) and a second mold portion (2) and has the molding space (10) formed of these mold members; a step of introducing a resin material (50) including a thermosetting resin into the molding space (10) in the molding mold (3) and filling the resin material (50) into the molding space (10) while pressing the metal member (100) onto any one molding surface of the first mold portion (1) and the second mold portion (2) by a fluid pressure of the resin material (50); and a step of curing the introduced resin material (50) so as to obtain the molded article.


Patent
Sumitomo Bakelite | Date: 2016-12-14

A thermally conductive sheet of the present invention includes a thermosetting resin (A) and an inorganic filler material (B) that is dispersed in the thermosetting resin (A). In the thermally conductive sheet of the present invention, at a frequency of 1 kHz and at a temperature of 100C to 175C, the maximum value of a dielectric loss factor of a cured product of the thermally conductive sheet is less than or equal to 0.030, and a change in relative dielectric constant of the cured product of the thermally conductive sheet is less than or equal to 0.10.


Patent
Sumitomo Bakelite | Date: 2016-02-24

The present invention is a method for decomposing a polymer material by chemically decomposing a polymer material containing a first monomer and a second monomer in a mixture of the polymer material with the first monomer or a derivative of the first monomer to produce a chemical raw material. A relationship between a proportion of number of molecules of the second monomer to number of molecules of the first monomer in a reaction system for decomposing the polymer material and the molecular weight of the chemical raw material produced in the reaction system is acquired in advance (S101). Subsequently, an addition mount of the derivative of the first monomer to be added to the polymer material is determined based on the above relationship (S102). The first monomer in the addition amount determined is then mixed with the polymer material (S103).

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