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Minamiaizu, Japan

Patent
Toyoda Gosei and Sumita Optical Glass Inc. | Date: 2010-10-07

A solid element device includes a solid element, an electric power receiving and supplying part for receiving electric power from and supplying the electric power to the solid element, and an inorganic sealing material for sealing the solid element. The inorganic sealing material includes a low melting glass selected from SiO


Patent
Sumita Optical Glass Inc. and Toyoda Gosei | Date: 2012-03-13

A method of making a solid element device that includes a solid element, an element mount part on which the solid element is mounted and which has a thermal conductivity of not less than 100 W/mK, an external terminal provided separately from the element mount part and electrically connected to the solid element, and a glass sealing part directly contacting and covering the solid element for sealing the solid element, includes pressing a glass material at a temperature higher than a yield point of the glass material for forming the glass sealing part.


Patent
Sumita Optical Glass Inc. | Date: 2015-04-15

Provided is an optical glass having low specific gravity, low abrasion degree, and high devitrification-proof stability, as well as a preform for precision press molding and an optical element which use such an optical glass. The optical glass has a composition including, in cationic % expression, P


Patent
Sumita Optical Glass Inc. | Date: 2015-03-10

Provided is a medium-refractive-index low-dispersion optical glass that may be precision press-molded, that has a high water resistance, and that has a low specific gravity, as well as a preform for precision press molding and an optical element which use such an optical glass. The optical glass has a composition including, in % by mass, SiO


Patent
Sumita Optical Glass Inc. and Toyoda Gosei | Date: 2010-12-20

A light-emitting device includes a light source including an element mounting substrate, an LED element mounted thereon by flip-chip connection and a sealing portion for sealing the LED element on the element mounting substrate, and a light guide plate including a housing hole for housing the light source. The housing hole extends from one surface side to another surface side of the light guide plate and an area of an inner surface thereof on which light is incident from the light source is parallel to a thickness direction of the light guide plate. The light source is housed in the housing hole so that the element mounting substrate is located on the other surface side of the light guide plate, emits light toward the one surface side of the light guide plate in the housing hole and the inner surface side of the housing hole, and has an optical axis parallel to the thickness direction of the light guide plate. A solid angle of the inner surface of the housing hole with respect to the center of an upper surface of the light source is not less than 4.44 steradians.

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