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The invention relates to a coating method for depositing a layer system formed from hard material layers on a substrate, by depositing at least one contact layer including the evaporation material on the surface of the substrate only by means of a cathodic vacuum arc evaporation source. After the depositing of the contact layer, at least one intermediate layer is deposited in the form of a nano-layer intermediate layer in a hybrid phase or as a nanocomposite layer, including the evaporation material and the discharge material, by parallel operation of a cathodic vacuum arc evaporation source and of a magnetron discharge source.


The invention relates to a high-power pulsed magnetron sputtering process (1), wherein within a process chamber (2) by means of an electrical energy source (3) a sequence of complex discharge pulses (4) is produced by applying an electrical voltage (V) between an anode (5) and a cathode (6) in order to ionize a sputtering gas (7). Said complex discharge pulse (4) is applied for a complex pulse time (). The cathode (6) has a target (8) comprising a material to be sputtered for the coating of a substrate (9), and said complex discharge pulse (4) includes an electrical high-power sputtering pulse (10) having a negative polarity with respect to the anode (5) and being applied for a first pulse-time (_(1)), the high-power sputtering pulse (10) being followed by an electrical low-power charge cleaning pulse (11) having a positive polarity with respect to the anode (5) and being applied for a second pulse-time (_(2)). According to the present invention, a ratio _(1) / _(2) of the first pulse-time (_(1)) in proportion to the second pulse-time (_(2)) is 0.5 at the most. The invention relates furthermore to a high-power electrical energy source (3) for producing a complex discharge pulse (4) for carrying out a process in accordance with the present invention.


Patent
Sulzer Metaplas Gmbh | Date: 2014-02-24

Cylindrical evaporation source which includes, at an outer cylinder wall, target material to be evaporated as well as a first magnetic field source and a second magnetic field source which form at least a part of a magnet system and are arranged in an interior of the cylindrical evaporation source for generating a magnetic field. In this respect, first magnetic field source and second magnetic field source are provided at a carrier system such that a shape and/or a strength of the magnetic field can be set in a predefinable spatial region in accordance with a predefinable scheme. In embodiments, the carrier system is configured for setting the shape and/or strength of the magnetic field of the carrier system such that the first magnetic field source is arranged at a first carrier arm and is pivotable by a predefinable pivot angle (_(1)) with respect to a first pivot axis.


Patent
Sulzer Metaplas GmbH | Date: 2014-08-06

The invention relates to a method to increase the wettability of a substrate by providing said substrate at least partially with a conductive, metal free, hydrophilic carbon based coating. The carbon based coating is doped with nitrogen and has an electrical resistivity lower than 10^(8) ohm-cm. The invention further relates to a substrate coated at least partially with a conductive metal free, hydrophilic carbon based coating.


Patent
Sulzer Metaplas GmbH | Date: 2010-02-03

The invention provides a multilayer film-coated member having sufficient heat resistance and abrasion resistance and capable of exhibiting an effect of preventing adhesion even in cutting work of steel materials that may readily cause adhesion to cutting tools, and therefore capable of prolonging tools, and provides a method for producing it. The multilayer film-coated member is fabricated by coating the surface of a substrate with at least two hard coating films having different compositions, in which the first composition hard coating film of the outermost layer of the hard coating films represented by Si_(a)B_(b)N_(c)C_(d)O_(e) with a+b+c+d+e=1, 0.1 a 0.5, 0.01 b 0.2, 0.05 c 0.6, 0.1 d 0.7 and 0 < e 0.2, the second composition hard coating film of the lower layer below the first composition hard coating film is a hard film having at least two selected from Al, Ti, Cr, Ni, Ce, Mg, Nb, W, Si, V, Zr, and Mo and N and at least one selected from B, C, O and S and in X-ray photoelectric spectrometry (XPS) of the first composition hard coating film, Si-O bond and B-O bond are detected, the ratio of the peak area of Si-C to the peak area of Si-O, /, as obtained from the peak separation of the 2p orbit of Si, satisfies 10.0 / 20.0, and the ratio of the peak area X of B-O to the peak area Y of B-N, X/Y, as obtained from the peak separation of the 1s orbit of B, satisfies 5.0 X/Y 10.0.


Patent
Sulzer Metaplas Gmbh | Date: 2014-09-26

Method for the coating of a substrate (S) in a process chamber (3), in which a gas atmosphere is set up and maintained in the process chamber (3) and an anode (6, 61) and a cylindrical vaporization cathode (2, 21, 22) formed as a target (2, 21, 22) are provided in the process chamber (3). The cylindrical vaporization cathode (2, 21, 22) includes the target material (200, 201, 202) and the target material (200, 201, 202) of the cylindrical cathode (2, 21, 22) is transferred into a vapor phase by means of an electrical source of energy (7, 71, 72). A magnetic field source (8, 81, 82) generates a magnetic field is provided in the process chamber (3) in such a way that, a magnetic field strength of the magnetic field can be changed in a preset region of the cylindrical vaporization cathode (2, 21, 22), characterized in that a cylindrical sputtering cathode (2, 21) and a cylindrical arc cathode (2, 22) are simultaneously provided in the process chamber (3) and in that the substrate (S) is coated with an arc vaporization process and/or with a cathode sputtering process.


The invention relates to a physical vapour deposition coating device (1), comprising a process chamber (2) with an anode (3) and a consumable cathode (4) to be consumed by an electrical discharge for coating a substrate located within the process chamber (2). The coating device (1) further includes a first electrical energy source (5) being connected with its negative pole to said consumable cathode (4), and a second electrical energy source (6) being connected with its positive pole to said anode (3). According to the invention, a third electrical energy source (7) is provided being connected with its negative pole to a source cathode (8) which is different from the consumable cathode (4). In addition, the invention relates to a physical vapour deposition method for coating a substrate.


Patent
Sulzer Metaplas GmbH | Date: 2015-02-11

The present invention relates to a wear resistant AlTiN coating suitable to be deposited on cutting tool inserts for chip forming metal machining. The coating comprises at least two layers with different grain size, but with essentially the same composition. The coating is deposited by Physical Vapour Deposition (PVD).


Patent
Sulzer Metaplas GmbH | Date: 2010-02-03

The invention provides a multilayer film-coated member which has both sufficient heat resistance and sufficient abrasion resistance and has excellent coating film adhesion strength so that it can sufficiently exhibit the capability of the coating film even in cutting environments that may be more and more severe, and provides a method for producing it. The multilayer film-coated member is fabricated by coating the surface of a substrate with at least two hard coating films having different compositions, wherein the first composition hard film of the outermost layer of the hard coating films represented by Si_(a)B_(b)N_(c)C_(d)O_(e) with a+b+c+d+e=1, 0.1 a 0.5, 0.01 b 0.2, 0.05 c 0.6, 0.1 d 0.7 and 0 < e 0.2, the second composition hard coating film of the lower layer below the first composition hard coating film is a hard film having at least two selected from Al, Ti, Cr, Ni, Ce, Mg, Nb, W, Si, V, Zr and Mo and N and at least one selected from B, C, 0 and S and the oxygen content of the film within a range of at least 25 nm from the interface of the first composition hard coating film that is in contact with the underlying layer toward the surface of the first composition hard coating film is limited to a range of less than 3.5 atm.%. The method for producing the multilayer film-coated member comprises forming the first composition hard coating film under temperature control to keep the substrate temperature not higher than 400C, and comprises forming it, after the coating target surface is cleaned through preliminary discharging, at a sputtering output power of less than 2500 W up to a thickness of at least 5 nm from the interface to the underlying layer.


Patent
Sulzer Metaplas Gmbh | Date: 2014-01-24

Evaporation source, in particular for use in a sputtering process or in a vacuum arc evaporation process, preferably a cathode vacuum arc evaporation process. The evaporation source includes an inner base body which is arranged in an outer carrier body and which is arranged with respect to the outer carrier body such that a cooling space in flow communication with an inlet and an outlet is formed between the base body and the carrier body. In accordance with the invention, the cooling space includes an inflow space and an outflow space, and the inflow space is in flow communication with the outflow space via an overflow connection for the cooling of the evaporation source such that a cooling fluid can be conveyed from the inlet via the inflow space the overflow connection and the outflow space to the outlet.

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