STMicroelectronics is a French-Italian electronics and semiconductor manufacturer headquartered in Geneva, Switzerland. While STMicroelectronics corporate headquarters and the headquarters for EMEA region are based in Geneva, the holding company, STMicroelectronics N.V. is registered in Amsterdam, Netherlands. The company’s US headquarters is in Coppell, Texas. Headquarters for the Asia-Pacific region is in Singapore whilst Japan and Korea operations are headquartered in Tokyo. Wikipedia.
News Article | May 2, 2017
The 2017 study has 678 pages, 240 tables and figures. Worldwide Internet of Things (IoT) markets are poised to achieve significant growth with the use of sensors, cameras, and platforms that are used to help implement precision digital control and send alerts for all manner or management of devices and machinery. Visualization and digitization let people better control any device or mechanical thing. Providers of Industrial IoT aim to implement asset efficiency solutions. Designing the asset efficiency solution, developing the application, adapting advanced engineering knowledge for the use cases, and supplying the information platform is the composite task of the analytics engine. IBM is a premier supplier of an analytics engine with its Watson product. There is enormous variety in the Internet of things markets. Bosch supplies industrial IoT sensor technology, acquiring data from the edge, providing device management. Scalability is achieved by the Bosch IoT Suite and ProSyst IoT middleware. The Vorto code generator enables M2M modelling. PTC supplies the Thingworx Application Enablement Platform (AEP), used for creating dashboards, widgets and other user interface elements. Intel provides the Moon Island Gateway used for data aggregation at the edge, as well as horizontal infrastructure in collaboration with HP. Hitachi analytics is used to diagnose manufacturing process. Hitachi uses its analytics platform to integrate production and sensor data outputs to help visualize, analyze and diagnose a manufacture polymer mixing problems. A polymer mixing process was said to be producing inconsistent output quality, with yields dipping to 50%. Hitachi addressed the scrapping of poor batches and huge costs by addressing ever-changing product specifications and variations in a range of production parameters. Using IoT and the analytics platform, production engineers were able to stabilize the process even as new product formulations were introduced. The Internet of Things (IoT) is the next Industrial Revolution. It will impact the way all businesses, governments, and consumers interact with the physical world. 1 Gbps and 10 Gbps speed has been used in data centers for years. The jump to 40 Gbps and 100 Gbps has come rapidly as a result of the need to increase the quantity of data managed inside the data center with more analytics and more applications. Many of the Cloud 2.0 mega data centers have moved to 100 Gbps, presaging the move to 400 Gbps. One reason for the increase in speed is the growth of data consumption, attributed to smartphones, social media, video streaming, Internet of Things (IoT), and big data. Big pipes are used to cope with the huge quantities of data that are being transferred. Users, partners, suppliers and other mega-datacenters communicate using digital systems that are automated and self-healing. The effect on the business is compelling, managers have much more responsibility to create maps of strategy and work with IT to see that developers tune the software to fit the current competitive environment. The explosion of data comes from smart phone apps and IoT digital onslaught of streaming data that needs to be processed in real time to look for anomalies, look for change, set alerts, and provide automated response to shifts. “Transparency is one of the benefits of IoT that sensors bring to digital controls. The benefits of digital manufacturing, farming, and automotive vehicles are higher productivity and more efficient use of resource. Transparency in is being asked for by consumers. Consumers want to know where their food came from, how much water and chemicals were used in food preparation, and when and how the food was harvested and transported. They want to know about consistent refrigeration during transport.” Use of IoT sensors and cameras represents a key milestone in provision of value to every industry. Customized cameras are used to take photos and videos with stunning representations. Digital controls will further automate flying and driving, making ease of use, flight stability, and automated cars a reality. New materials and new designs are bringing that transformation forward. By furthering innovation, IoT continued growth is assured. The worldwide market for Internet of Things (IoT) is $16.3 billion in 2016 anticipated to reach $185.9 billion by 2023. Sensors and software analytics platforms are implemented with connectivity capability for streaming data from endpoints and using analytics to process the data in a manner that generates alerts when appropriate. The complete report provides a comprehensive analysis of Internet of Things (IoT) in different categories, illustrating the diversity of uses for digital tracking devices in industry, healthcare and consumer markets. Analytics makes the images more cogent to everyone, farmers, doctors, machine operators, the uses of IoT are quite diverse. Letting people anticipate problems that only become visible to humans days or weeks after the sensors and images detect issues is a fundamental aspect of IoT, along with generating apocopate levels of alerts. Not too many and not too few. Aerialtronics Adobe Amazon Apple AutoDesk AutoDesk CAD-in-the-Cloud Bosch Cisco Systems Digi Inter national Cybus Enevo Oy Technologies Essence General Electric GE GE Wireless Sensor Networks Google Google / Nest Learning Thermostat Google Chromecast Health Slam -IoT Slam Huawei Huawei Partners with China Telecom, Shenzhen Gas On Smart Utility IBM Corporation Infineon Technologies AG Infineon Chip Card & Security Intel Corporation Intel Acquires Mobileye Internet of Things Community KT Microsoft Microsoft Microsoft / Mojang AB Minecraft Microsoft / Skype / GroupMe Free Group Messaging MuleSoft Nokia oneM2M Panoramic Power Oracle PTC Qualcomm Samsung Samsung Agreed to Buy Harman Harman International Industries (ADITI TECHNOLOGIES) SAP Schaeffler Sierra Wireless Business and Innovation Development Sigfox Softbank Softbank “IBM Watson” Softbank Sprint Softbank Yahoo Fukuoka SoftBank HAWKS Spirent STMicroelectronics Symantec / Norton Symantec Creating Trusted Interactions Online Schneider Electric Software, Llc. Uber UIB Zebra ZTE Internet of Things (IoT) IoT Endpoints Universal IoT Platform IoT Suite Web Services Blockchain Networks Wireless Sensor Networks Security and Energy Management Healthcare Transportation Self Driving Cars Agriculture IoT Weather IoT Financial IoT Industrial IoT Manufacturing IoT Security IoT Energy Management Internet of Things IoT Security Healthcare IoT Wearable Technology Self-Driving Cars Connected Cars Rail Transportation IoT Sensor and Computing Configurations Agricultural and Weather IoT IoT chipsets …CONTINUED For more information, please visit http://www.wiseguyreports.com
News Article | April 26, 2017
Dublin, April 26, 2017 (GLOBE NEWSWIRE) -- Research and Markets has announced the addition of Wintergreen Research, Inc's new report " Internet of Things (IoT) Market Shares, Strategies, and Forecasts 2017 to 2023" to their offering. The study is designed to give a comprehensive overview of the Internet of Things (IoT): market segment. Research represents a selection from the mountains of data available of the most relevant and cogent market materials, with selections made by the most senior analysts. Worldwide Internet of Things (IoT) markets are poised to achieve significant growth with the use of sensors, cameras, and platforms that are used to help implement precision digital control and send alerts for all manner or management of devices and machinery. Visualization and digitization let people better control any device or mechanical thing. Providers of Industrial IoT aim to implement asset efficiency solutions. Designing the asset efficiency solution, developing the application, adapting advanced engineering knowledge for the use cases, and supplying the information platform is the composite task of the analytics engine. IBM is a premier supplier of an analytics engine with its Watson product. There is enormous variety in the Internet of things markets. Bosch supplies industrial IoT sensor technology, acquiring data from the edge, providing device management. Scalability is achieved by the Bosch IoT Suite and ProSyst IoT middleware. The Vorto code generator enables M2M modelling. PTC supplies the Thingworx Application Enablement Platform (AEP), used for creating dashboards, widgets and other user interface elements. Intel provides the Moon Island Gateway used for data aggregation at the edge, as well as horizontal infrastructure in collaboration with HP. Key Topics Covered: INTERNET OF THINGS (IOT) EXECUTIVE SUMMARY - Internet of Things (IoT) Market Driving Forces - IoT Technology Market Driving Forces - IoT Technology Market Challenges - Internet of Things (IoT) Market Shares - Internet of Things (IoT) Market Forecasts - IoT Market Opportunity Huge 1. INTERNET OF THINGS (IOT): MARKET DESCRIPTION AND MARKET DYNAMICS 1.1 IoT Sensor Types 1.2 Internet of Things (IoT) Based on Standards 1.3 With IoT, APIs Are Used for Everything 1.4 Internet of Things Revolution Dramatically Alters the Economy 2. INTERNET OF THINGS (IOT) MARKET SHARES AND FORECASTS 2.1 Internet of Things (IoT) Market Driving Forces 2.2 Internet of Things (IoT) Market Shares 2.3 Internet of Things (IoT) Market Forecasts 2.4 Internet of Things Market Segments: Security and Energy Management, Healthcare, Transportation and Self Driving Cars, Agriculture and Weather, Financial, Industrial and Manufacturing 2.5 Security and Energy Management Internet of Things Market 2.6 Healthcare 2.7 Self Driving Cars / Connected Cars / Transportation 2.8 Agricultural and Weather IoT 2.9 Industrial IoT 2.10 Financial Internet of Things Market Segment 2.11 IoT chipsets 2.12 IoT Data Use Forecasts 2.13 Mid IR Sensor Market Forecasts 2.14 Internet of Things (IoT) Regional Analysis 3. INTERNET OF THINGS IOT PRODUCT DESCRIPTION 3.1 IBM 3.2 Intel 3.3 Microsoft IoT 3.4 Hewlett HP IoT 3.5 Apple 3.6 Google 3.7 Cisco 3.8 Samsung 3.9 AutoDesk 3.10 Zebra 3.11 SAP 3.12 Siemens 3.13 Bosch Software Innovation 3.14 Huawei Technologies 3.15 Harman International Industries (ADITI Technologies) 3.16 Enevo Oy Technologies 3.17 Infineon Technologies 3.18 Symantec Corporation 3.19 Schneider Electric Software, Llc. 3.20 Apple IoT 3.21 AT&T 3.22 Softbank 3.23 Uber 3.24 oneM2M 3.25 Symantec / Norton Core Router 3.26 Kaptivo 3.27 Oracle 3.28 Schlage IoT Devices 3.29 AGCO 3.30 Alibaba Group in Shanghai 3.31 Essence 4. INTERNET OF THINGS (IOT) RESEARCH AND TECHNOLOGY 4.1 Internet of Things (IoT) Research and Technology 4.2 IoT Common Standards 4.3 Edge Computing 4.4 European Union Research & Innovation 4.5 Wearable Technology 4.6 Blockchain 4.7 Connected Home Camera Technology 4.8 IFTTT 4.9 Wireless Communication Standards 4.10 IBM and Texas Instruments Collaboratively Develop Lifecycle-Management for IoT Devices 5. INTERNET OF THINGS (IOT) COMPANY PROFILES 5.1 Aerialtronics 5.2 Adobe 5.3 Amazon 5.4 Apple 5.5 AutoDesk 5.6 Bosch 5.7 Cisco Systems 5.8 Digi International 5.9 Cybus 5.10 Enevo Oy Technologies 5.11 Essence 5.12 General Electric 5.13 Google 5.14 Health Slam - IoT Slam 5.15 Huawei 5.16 IBM Corporation 5.17 Infineon Technologies AG 5.18 Intel Corporation 5.19 Internet of Things Community 5.20 KT 5.21 Microsoft 5.22 Microsoft 5.23 MuleSoft 5.24 Nokia 5.25 oneM2M 5.26 Panoramic Power 5.27 Oracle 5.28 PTC 5.29 Qualcomm 5.30 Samsung 5.31 SAP 5.32 Schaeffler 5.33 Sierra Wireless Business and Innovation Development 5.34 Sigfox 5.35 Softbank 5.36 Spirent 5.37 STMicroelectronics 5.38 Symantec 5.39 Schneider Electric Software, Llc. 5.40 Uber 5.41 UIB 5.42 Zebra 5.43 ZTE 5.44 Appendix A: Selected IoT Market Participants For more information about this report visit http://www.researchandmarkets.com/research/35xb8h/internet_of
Agency: European Commission | Branch: FP7 | Program: JTI-CP-ARTEMIS | Phase: SP1-JTI-ARTEMIS-2012-AIPP6;SP1-JTI-ARTEMIS-2012-AIPP4 | Award Amount: 67.54M | Year: 2013
Our society is facing both energy and competitiveness challenges. These challenges are tightly linked and require new dynamic interactions between energy producers and energy consumers, between machines, between systems, between people and systems, etc. Cooperative automation is the key for these dynamic interactions and is enabled by the technology developed around the Internet of Things and Service Oriented Architectures. The objective of the Arrowhead project is to address the technical and applicative challenges associated to cooperative automation: -Provide a technical framework adapted in terms of functions and performances, -Propose solutions for integration with legacy systems, -Implement and evaluate the cooperative automation through real experimentations in applicative domains: electro-mobility, smart buildings, infrastructures and smart cities, industrial production, energy production and energy virtual market, -Point out the accessible innovations thanks to new services, -Lead the way to further standardization work. The strategy adopted in the project has four major dimensions: -An innovation strategy based on business and technology gap analysis paired with a market implementation strategy based on end users priorities and long term technology strategies -Application pilots where technology demonstrations in real working environments will be made -A technology framework enabling collaborative automation and closing innovation critical technology gaps -An innovation coordination methodology for complex innovation orchestration Date of approval by the ECSEL JU: 23/07/2015
Agency: European Commission | Branch: H2020 | Program: ECSEL-IA | Phase: ECSEL-02-2014 | Award Amount: 139.30M | Year: 2015
The proposed pilot line project WAYTOGO FAST objective is to leverage Europe leadership in Fully Depleted Silicon on Insulator technology (FDSOI) so as to compete in leading edge technology at node 14nm and beyond preparing as well the following node transistor architecture. Europe is at the root of this breakthrough technology in More Moore law. The project aims at establishing a distributed pilot line between 2 companies: - Soitec for the fabrication of advanced engineered substrates (UTBB: Ultra Thin Body and BOx (buried oxide)) without and with strained silicon top film. - STMicroelectronics for the development and industrialization of state of the art FDSOI technology platform at 14nm and beyond with an industry competitive Power-Performance-Area-Cost (PPAC) trade-off. The project represents the first phase of a 2 phase program aiming at establishing a 10nm FDSOI technology for 2018-19. A strong added value network is created across this project to enhance a competitive European value chain on a European breakthrough and prepare next big wave of electronic devices. The consortium gathers a large group of partners: academics/institutes, equipment and substrate providers, semiconductor companies, a foundry, EDA providers, IP providers, fabless design houses, and a system manufacturer. E&M will contribute to the objective of installing a pilot line capable of manufacturing both advanced SOI substrates and FDSOI CMOS integrated circuits at 14nm and beyond. Design houses and electronics system manufacturer will provide demonstrator and enabling IP, to spread the FDSOI technology and establish it as a standard in term of leading edge energy efficient CMOS technology for a wide range of applications battery operated (consumer , healthcare, Internet of things) or not. Close collaboration between the design activities and the technology definition will tailor the PPAC trade-off of the next generation of technology to the applications needs.
Agency: European Commission | Branch: H2020 | Program: ECSEL-IA | Phase: ECSEL-18-2015 | Award Amount: 82.27M | Year: 2016
The goal of EnSO is to develop and consolidate a unique European ecosystem in the field of autonomous micro energy sources (AMES) supporting Electronic European industry to develop innovative products, in particular in IoT markets. In summary, EnSO multi-KET objectives are: Objective 1: demonstrate the competitiveness of EnSO energy solutions of the targeted Smart Society, Smart Health, and Smart Energy key applications Objective 2: disseminate EnSO energy solutions to foster the take-up of emerging markets. Objective 3: develop high reliability assembly technologies of shapeable micro batteries, energy harvester and power management building blocks Objective 4: Develop and demonstrate high density, low profile, shapeable, long life time, rechargeable micro battery product family. Objective 5: develop customizable smart recharge and energy harvesting enabling technologies for Autonomous Micro Energy Source AMES. Objective 6: demonstrate EnSO Pilot Line capability and investigate and assess the upscale of AMES manufacturing for competitive very high volume production. EnSO will bring to market innovative energy solutions inducing definitive differentiation to the electronic smart systems. Generic building block technologies will be customizable. EnSO manufacturing challenges will develop high throughput processes. The ENSo ecosystem will involve all the value chain from key materials and tools to many demonstrators in different fields of application. EnSO work scope addresses the market replication, demonstration and technological introduction activities of ECSEL Innovation Action work program. EnSO relates to several of the Strategic Thrusts of ECSEL MASP. EnSO innovations in terms of advanced materials, advanced equipment and multi-physics co-design of heterogeneous smart systems will contribute to the Semiconductor Process, Equipment and Materials thrust. The AMES will be a key enabling technology of Smart Energy key applications.
Agency: European Commission | Branch: H2020 | Program: RIA | Phase: ICT-25-2015 | Award Amount: 4.54M | Year: 2016
REMINDER aims to develop an embedded DRAM solution optimized for ultra-low-power consumption and variability immunity, specifically focused on Internet of Things cut-edge devices. The objectives of REMINDER are: i) Investigation (concept, design, characterization, simulation, modelling), selection and optimization of a Floating-Body memory bit cell in terms of low power and low voltage, high reliability, robustness (variability), speed, reduced footprint and cost. ii) Design and fabrication in FDSOI 28nm (FD28) and FDSOI 14nm (FD14) technology nodes of a memory matrix based on the optimized bit-cells developed. Matrix memory subcircuits, blocks and architectures will be carefully analysed from the power-consumption point of view. In addition variability tolerant design techniques underpinned by variability analysis and statistical simulation technology will be considered. iii) Demonstration of a system on chip application using the developed memory solution and benchmarking with alternative embedded memory blocks. The eventual replacement of Si by strained Si/SiGe and III-V materials in future CMOS circuits would also require the redesign of different applications, including memory cells, and therefore we also propose the evaluation of the optimized bit cells developed in FD28 and FD14 technology nodes using these alternative materials. The fulfilment of the objectives above will also imply the development of: i) New techniques for the electrical characterization of ultimate CMOS nanometric devices. This will allow us to improve the CMOS technology by boosting device performance. ii) New behavioural models, incorporating variability effects, to reach a deep understanding of nanoelectronics devices iii) Advanced simulation tools for nanoelectronic devices for state of the art, and emerging devices. iv) Extreme low power solutions The consortium supporting this proposal is ideally balanced with 2 industrial partners, 2 SMEs, 2 research centers and 3 universities.
Agency: European Commission | Branch: H2020 | Program: ECSEL-RIA | Phase: ECSEL-06-2015 | Award Amount: 38.85M | Year: 2015
The goal of the PRIME project is to establish an open Ultra Low Power (ULP) Technology Platform containing all necessary design and architecture blocks and components which could enable the European industry to increase and strengthen their competitive and leading eco-system and benefit from market opportunities created by the Internet of Things (IoT) revolution. Over 3 years the project will develop and demonstrate the key building blocks of IoT ULP systems driven by the applications in the medical, agricultural, domestics and security domains. This will include development of high performance, energy efficient and cost effective technology platform, flexible design ecosystem (including IP and design flow), changes in architectural and power management to reduced energy consumption, security blocks based on PUF and finally the System of Chip and System in Package memory banks and processing implementations for IoT sensor node systems. Developped advanced as 22nm FDSOI low power technologies with logic, analog, RF and embedded new memory components (STT RAM and RRAM) together with innovative design and system architecture solutions will be used to build macros and demonstrate functionality and power reduction advantage of the new IoT device components. The PRIME project will realize several demonstrators of IoT system building blocks to show the proposed low power wireless solutions, functionality and performance of delivered design and technology blocks. The consortium semiconductor ecosystem (IDMs, design houses, R&D, tools & wafer suppliers, foundries, system/product providers) covers complementarily all desired areas of expertise to achieve the project goals. The project will enable an increase in Europes innovation capability in the area of ULP Technology, design and applications, creation of a competitive European eco-system and help to identify market leadership opportunities in security, mobility, healthcare and smart cost competitive manufacturing.