Geneva, Switzerland
Geneva, Switzerland

STMicroelectronics is a French-Italian electronics and semiconductor manufacturer headquartered in Geneva, Switzerland. While STMicroelectronics corporate headquarters and the headquarters for EMEA region are based in Geneva, the holding company, STMicroelectronics N.V. is registered in Amsterdam, Netherlands. The company’s US headquarters is in Coppell, Texas. Headquarters for the Asia-Pacific region is in Singapore whilst Japan and Korea operations are headquartered in Tokyo. Wikipedia.


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Patent
STMicroelectronics | Date: 2017-04-19

A MEMS sensor device (41) provided with a sensing structure (20), having: a substrate (2) with a top surface (2a) extending in a horizontal plane (xy); an inertial mass (30), suspended over the substrate (2); elastic coupling elements (32), elastically connected to the inertial mass (30) so as to enable inertial movement thereof with respect to the substrate (2) as a function of a quantity to be detected along a sensing axis (x) belonging to the horizontal plane (xy); and sensing electrodes (35a, 35b), capacitively coupled to the inertial mass (30) so as to form at least one sensing capacitor (C_(1), C_(2)), a value of capacitance of which is indicative of the quantity to be detected. The sensing structure (20) moreover has a suspension structure (21), to which the sensing electrodes (35a, 35b) are rigidly coupled, and to which the inertial mass (30) is elastically coupled through the elastic coupling elements (32); the suspension structure (21) is connected to an anchorage structure (23), fixed with respect to the substrate (2), by means of elastic suspension elements (28).


Grant
Agency: Cordis | Branch: H2020 | Program: SGA-RIA | Phase: FETFLAGSHIP | Award Amount: 89.00M | Year: 2016

This project is the second in the series of EC-financed parts of the Graphene Flagship. The Graphene Flagship is a 10 year research and innovation endeavour with a total project cost of 1,000,000,000 euros, funded jointly by the European Commission and member states and associated countries. The first part of the Flagship was a 30-month Collaborative Project, Coordination and Support Action (CP-CSA) under the 7th framework program (2013-2016), while this and the following parts are implemented as Core Projects under the Horizon 2020 framework. The mission of the Graphene Flagship is to take graphene and related layered materials from a state of raw potential to a point where they can revolutionise multiple industries. This will bring a new dimension to future technology a faster, thinner, stronger, flexible, and broadband revolution. Our program will put Europe firmly at the heart of the process, with a manifold return on the EU investment, both in terms of technological innovation and economic growth. To realise this vision, we have brought together a larger European consortium with about 150 partners in 23 countries. The partners represent academia, research institutes and industries, which work closely together in 15 technical work packages and five supporting work packages covering the entire value chain from materials to components and systems. As time progresses, the centre of gravity of the Flagship moves towards applications, which is reflected in the increasing importance of the higher - system - levels of the value chain. In this first core project the main focus is on components and initial system level tasks. The first core project is divided into 4 divisions, which in turn comprise 3 to 5 work packages on related topics. A fifth, external division acts as a link to the parts of the Flagship that are funded by the member states and associated countries, or by other funding sources. This creates a collaborative framework for the entire Flagship.


Grant
Agency: Cordis | Branch: H2020 | Program: RIA | Phase: ICT-03-2016 | Award Amount: 4.57M | Year: 2017

The objective of INSPEX is to make obstacle detection capabilities that are currently only feasible on autonomous vehicles available as a personal portable/wearable multi-sensor, miniaturised, low power spatial exploration system. The INSPEX System will be used for real-time 3D detection, location and warning of obstacles under all environmental conditions in indoor and outdoor environments with static and mobile obstacles. Applications include navigation for the visually/mobility impaired, safer human navigation in reduced visibility conditions and small robot/drone obstacle avoidance. The partners bring state-of-the-art range sensors (LiDAR, UWB radar and MEMS ultrasound) to the project. INSPEX will miniaturise and reduce the power consumption of these sensors to facilitate systems integration. These will then be integrated with an IMU, environmental sensing, signal and data processing, wireless communications, power efficient data fusion and user interface, all in a miniature, low power system designed to operate within wider smart/IoT environments. The main INSPEX Demonstrator will embed the INSPEX System in a white cane for the visually impaired and provide 3D spatial audio feedback on obstacle location. INSPEX directly addresses: - ICT-3 Challenge to develop and manufacture smart objects and systems that closely integrate sensors, actuators, innovative MEMS, processing power, embedded memory and communication capabilities, all optimising the use of supply power that can easily be made interoperable within systems of systems - RIA aims to make technological breakthroughs and their validation in laboratory environments of the next generations of miniaturised smart integrated systems and industrial-relevant technological developments, modelling and validation that will enable solutions in particular for health and well-being safety and security manufacturing. INSPEX is taking reliability and ethical issues strongly into consideration.


Grant
Agency: Cordis | Branch: H2020 | Program: IA | Phase: IoT-01-2016 | Award Amount: 25.77M | Year: 2017

ACTIVAGE is a European Multi Centric Large Scale Pilot on Smart Living Environments. The main objective is to build the first European IoT ecosystem across 9 Deployment Sites (DS) in seven European countries, reusing and scaling up underlying open and proprietary IoT platforms, technologies and standards, and integrating new interfaces needed to provide interoperability across these heterogeneous platforms, that will enable the deployment and operation at large scale of Active & Healthy Ageing IoT based solutions and services, supporting and extending the independent living of older adults in their living environments, and responding to real needs of caregivers, service providers and public authorities. The project will deliver the ACTIVAGE IoT Ecosystem Suite (AIOTES), a set of Techniques, Tools and Methodologies for interoperability at different layers between heterogeneous IoT Platforms and an Open Framework for providing Semantic Interoperability of IoT Platforms for AHA, addressing trustworthiness, privacy, data protection and security. User-demand driven interoperable IoT-enabled Active & Healthy Ageing solutions will be deployed on top of the AIOTES in every DS, enhancing and scaling up existing services, for the promotion of independent living, the mitigation of frailty, and preservation of quality of life and autonomy. ACTIVAGE will assess the socio-economic impact, the benefits of IoT-based smart living environments in the quality of life and autonomy, and in the sustainability of the health and social care systems, demonstrating the seamless capacity of integration and interoperability of the IoT ecosystem, and validating new business, financial and organizational models for care delivery, ensuring the sustainability after the project end, and disseminating these results to a worldwide audience. The consortium comprises industries, research centres, SMEs, service providers, public authorities encompassing the whole value chain in every Deployment Site.


Grant
Agency: Cordis | Branch: H2020 | Program: IA | Phase: IoT-01-2016 | Award Amount: 25.43M | Year: 2017

Automated driving is expected to increase safety, provide more comfort and create many new business opportunities for mobility services. The market size is expected to grow gradually reaching 50% of the market in 2035. The IoT is about enabling connections between objects or things; its about connecting anything, anytime, anyplace, using any service over any network. There is little doubt that these vehicles will be part of the IoT revolution. Indeed, connectivity and IoT have the capacity for disruptive impacts on highly and fully automated driving along all value chains towards a global vision of Smart Anything Everywhere. In order to stay competitive, the European automotive industry is investing in connected and automated driving with cars becoming moving objects in an IoT ecosystem eventually participating in BigData for Mobility. AUTOPILOT brings IoT into the automotive world to transform connected vehicles into highly and fully automated vehicle. The well-balanced AUTOPILOT consortium represents all relevant areas of the IoT eco-system. IoT open vehicle platform and an IoT architecture will be developed based on the existing and forthcoming standards as well as open source and vendor solutions. Thanks to AUTOPILOT, the IoT eco-system will involve vehicles, road infrastructure and surrounding objects in the IoT, with a particular attention to safety critical aspects of automated driving. AUTOPILOT will develop new services on top of IoT to involve autonomous driving vehicles, like autonomous car sharing, automated parking, or enhanced digital dynamic maps to allow fully autonomous driving. AUTOPILOT IoT enabled autonomous driving cars will be tested, in real conditions, at four permanent large scale pilot sites in Finland, France, Netherlands and Italy, whose test results will allow multi-criteria evaluations (Technical, user, business, legal) of the IoT impact on pushing the level of autonomous driving.


Grant
Agency: Cordis | Branch: H2020 | Program: IA | Phase: IoT-01-2016 | Award Amount: 34.71M | Year: 2017

The IoF2020 project is dedicated to accelerate adoption of IoT for securing sufficient, safe and healthy food and to strengthen competitiveness of farming and food chains in Europe. It will consolidate Europes leading position in the global IoT industry by fostering a symbiotic ecosystem of farmers, food industry, technology providers and research institutes. The IoF2020 consortium of 73 partners, led by Wageningen UR and other core partners of previous key projects such as FIWARE and IoT-A, will leverage the ecosystem and architecture that was established in those projects. The heart of the project is formed by 19 use cases grouped in 5 trials with end users from the Arable, Dairy, Fruits, Vegetables and Meat verticals and IoT integrators that will demonstrate the business case of innovative IoT solutions for a large number of application areas. A lean multi-actor approach focusing on user acceptability, stakeholder engagement and sustainable business models will boost technology and market readiness levels and bring end user adoption to the next stage. This development will be enhanced by an open IoT architecture and infrastructure of reusable components based on existing standards and a security and privacy framework. Anticipating vast technological developments and emerging challenges for farming and food, the 4-year project stays agile through dynamic budgeting and adaptive decision-making by an implementation board of representatives from key user organizations. A 6 M mid-term open call will allow for testing intermediate results and extending the project with technical solutions and test sites. A coherent dissemination strategy for use case products and project learnings supported by leading user organizations will ensure a high market visibility and an increased learning curve. Thus IoF2020 will pave the way for data-driven farming, autonomous operations, virtual food chains and personalized nutrition for European citizens.


Grant
Agency: Cordis | Branch: H2020 | Program: RIA | Phase: NMBP-02-2016 | Award Amount: 8.05M | Year: 2017

Silicon carbide presents a high breakdown field (2-4 MV/cm) and a high energy band gap (2.33.2 eV), largely higher than for silicon. Within this frame, the cubic polytype of SiC (3C-SiC) is the only one that can be grown on a host substrate with the huge opportunity to grow only the silicon carbide thickness required for the targeted application. The possible growth on silicon substrate has remained for long period a real advantage in terms of scalability regarding the reduced diameter of hexagonal SiC wafer commercially available. Even the relatively narrow band-gap of 3C-SiC (2.3eV), which is often regarded as detrimental in comparison with other polytypes, can in fact be an advantage. The lowering of the conduction band minimum brings about a reduced density of states at the SiO2/3C-SiC interface and MOSFET on 3C-SiC has demonstrated the highest channel mobility of above 300 cm2/(Vxs) ever achieved on SiC crystals, prompting a remarkable reduction in the power consumption of these power switching devices. The electrical activity of extended defects in 3C SiC is a major concern for electronic device functioning. To achieve viable commercial yields the mechanisms of defects must be understood and methods for their reduction developed.. In this project new approaches for the reduction of defects will be used, working on new compliance substrates that can help to reduce the stress and the defect density at the same time. This growth process will be driven by numerical simulations of the growth and simulations of the stress reduction. The structure of the final devices will be simulated using the appropriated numerical tools where new numerical model will be introduced to take into account the properties of the new material. Thanks to these simulations tools and the new material with low defect density, several devices that can work at high power and with low power consumption will be realized inside the project.


Grant
Agency: Cordis | Branch: H2020 | Program: ECSEL-IA | Phase: ECSEL-18-2015 | Award Amount: 82.27M | Year: 2016

The goal of EnSO is to develop and consolidate a unique European ecosystem in the field of autonomous micro energy sources (AMES) supporting Electronic European industry to develop innovative products, in particular in IoT markets. In summary, EnSO multi-KET objectives are: Objective 1: demonstrate the competitiveness of EnSO energy solutions of the targeted Smart Society, Smart Health, and Smart Energy key applications Objective 2: disseminate EnSO energy solutions to foster the take-up of emerging markets. Objective 3: develop high reliability assembly technologies of shapeable micro batteries, energy harvester and power management building blocks Objective 4: Develop and demonstrate high density, low profile, shapeable, long life time, rechargeable micro battery product family. Objective 5: develop customizable smart recharge and energy harvesting enabling technologies for Autonomous Micro Energy Source AMES. Objective 6: demonstrate EnSO Pilot Line capability and investigate and assess the upscale of AMES manufacturing for competitive very high volume production. EnSO will bring to market innovative energy solutions inducing definitive differentiation to the electronic smart systems. Generic building block technologies will be customizable. EnSO manufacturing challenges will develop high throughput processes. The ENSo ecosystem will involve all the value chain from key materials and tools to many demonstrators in different fields of application. EnSO work scope addresses the market replication, demonstration and technological introduction activities of ECSEL Innovation Action work program. EnSO relates to several of the Strategic Thrusts of ECSEL MASP. EnSO innovations in terms of advanced materials, advanced equipment and multi-physics co-design of heterogeneous smart systems will contribute to the Semiconductor Process, Equipment and Materials thrust. The AMES will be a key enabling technology of Smart Energy key applications.


Grant
Agency: Cordis | Branch: H2020 | Program: RIA | Phase: FETPROACT-01-2016 | Award Amount: 10.00M | Year: 2017

The hybrid optomechanical technologies (HOT) consortium will lay the foundation for a new generation of devices, which connect, or indeed contain, several platforms at the nanoscale in a single hybrid system. As hybrid interfaces they will allow to harness the unique advantages of each subsystem within a nano-scale footprint, while as integrated hybrid devices they will enable entirely novel functionalities. A particular focus will be on nano-optomechanical devices that comprise electrical, microwave or optical systems with micro- and nano-mechanical systems. Research in the past decade, in particular by European groups, has shown the significant technological potential that such nano-optomechanical systems can offer, in particular by establishing a new way in which optical, radio-frequency and microwave signals can be interfaced. The present consortium includes leading academic groups and industrial partners to explore the potential of these hybrid-nano-optomechanical systems. It will explore hybrid opto- and electro-mechanical devices operating at the physical limit for conversion, synthesis, processing, sensing and measurement of EM fields, comprising radio, microwave frequencies to the terahertz domain. These spectral domains open realistic applications in the existing application domains of medical (e.g. MRI imaging), security (e.g. Radar and THz monitoring), positioning, timing and navigations (Oscillators) and for future quantum technology. The research aims at specific technological application, with realistic operating conditions and seeks to develop actual system demonstrators. In addition, it will explore how these hybrid transducers can be fabricated within standard CMOS processing, and thereby be made compatible with current manufacturing methods. The HOT devices will thereby impact todays technology and likewise address potential future need for the manipulation of quantum signals.


Grant
Agency: Cordis | Branch: H2020 | Program: RIA | Phase: COMPET-1-2016 | Award Amount: 4.25M | Year: 2017

We propose the development of a Very High Performance microprocessor System on Chip (SoC) based on STM European 28nm FDSOI technology with multi-core ARM processors for real-time applications, eFPGA for flexibility and key European IPs, enabling faster and cost-efficient development of products for multiple space application domains. The performance is expected to be 20 to 40 times the performance of the existing SoC for space and more than 2 times the performance of the future quad core LEON4 chip. This performance level, combined with a large set of integrated peripherals including dedicated on-chip functions for GNSS, TM and TC support, will enable key space applications to be executed within the same microprocessor significantly reducing cost and mass and boosting competitiveness of future European space equipments. With the highest cumulative number of European satellites and electronics equipments successfully operating in orbit, Airbus and TAS represent together the indisputable best positioned companies in Europe to ensure the maximum relevance of the DAHLIA SoC for its future use by the whole European Space community. Beyond Space applications, the adoption of the ARM processor will enable the convergence with terrestrial applications benefiting from the strong ARM ecosystem while the new SoC will ensure European strategic non dependence for the most critical component on board.

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