Geneva, Switzerland

STMicroelectronics

www.st.com/
Geneva, Switzerland

STMicroelectronics is a French-Italian electronics and semiconductor manufacturer headquartered in Geneva, Switzerland. While STMicroelectronics corporate headquarters and the headquarters for EMEA region are based in Geneva, the holding company, STMicroelectronics N.V. is registered in Amsterdam, Netherlands. The company’s US headquarters is in Coppell, Texas. Headquarters for the Asia-Pacific region is in Singapore whilst Japan and Korea operations are headquartered in Tokyo. Wikipedia.

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Patent
STMicroelectronics | Date: 2016-05-31

A ranging device includes an array of photon detection devices that receive an optical signal reflected by an object in an image scene and first and second logic devices to respectively combine the outputs of first and second pluralities of the photon detection devices. First and second counter circuits are respectively coupled an output of the first and second logic devices and generate first and second count values respectively by counting the photon detection events generated by the first and second pluralities of photon detection devices. A range estimation circuit estimates the range of the object by estimating the timing of one or more pulses of said optical signal based on the first and second count values.


Process for manufacturing a semiconductor power device, wherein a trench is formed in a semiconductor body having a first conductivity type; the trench is annealed for shaping purpose; and the trench is filled with semiconductor material via epitaxial growth so as to obtain a first column having a second conductivity type. The epitaxial growth is performed by supplying a gas containing silicon and a gas containing dopant ions of the second conductivity type in presence of a halogenide gas and occurs with uniform distribution of the dopant ions. The flow of the gas containing dopant ions is varied according to a linear ramp during the epitaxial growth; in particular, in the case of selective growth of the semiconductor material in the presence of a hard mask, the flow decreases; in the case of non-selective growth, in the absence of hard mask, the flow increases.


An integrated circuit (IC) having a scan compression architecture includes decompression logic coupled between test access input and a block of IC elements (e.g. flip-flops) coupled together to define a plurality of scan paths. The block of IC elements includes an initial data selector at an initial position of each of the scan paths, and an additional data selector downstream within at least one of the scan paths and configured to reconfigure an order of the IC elements within the at least one scan path. Compression logic is coupled between the block of IC elements and a test access output.


A semiconductor device includes a quadrilateral package with a first pair of opposed sides and a second pair of opposed sides. Both sides of the first pair of opposed sides are provided with electrical contact leads. Only one side of the second pair of opposed sides is provided with electrical contact leads. The side of the second pair of opposed sides without electrical contact leads is a leadless side. That side is not a molded side of the package, but rather is defined by a cut surface.


A circuit (20) for reading a memory cell (3) of a nonvolatile memory device (1) provided with a memory array (2) with cells arranged in wordlines and bitlines, among which a first bitline (BL), associated to the memory cell, and a second bitline (BL), has: a first circuit branch (22) associated to the first bitline and a second circuit branch (22) associated to the second bitline, each with a local node (N_(1), N_(1)), coupled to which is a first dividing capacitor (30), and a global node (N_(g), N_(g)), coupled to which is a second dividing capacitor (32); a decoder stage (23, 25) for coupling the local node to the first or second bitlines and coupling the global node to the local node; and a differential comparator stage (36), which has inputs that are coupleable to the global node of the first circuit branch or second circuit branch, and supplies an output signal (S_(out)) indicative of the datum stored; a coupling stage (40, 41), for coupling the global nodes of the first and second circuit branches; and a control unit (21) for controlling the decoder stage, the coupling stage, and the differential comparator stage for generation of the output signal.


A micromechanical detection structure (20) comprises: a substrate (2) of semiconductor material; a driving-mass arrangement (4a-4c), coupled to a set of driving electrodes (7a-7c) and driven in a driving movement following upon biasing of the set of driving electrodes; a first anchorage unit (5a-5c, 6a-6c), coupled to the driving-mass arrangement for elastically coupling the driving-mass arrangement to the substrate (2) at first anchorages (5a-5c); a driven-mass arrangement (10, 30), elastically coupled to the driving-mass arrangement by a coupling unit (22a-22b) and designed to be driven by the driving movement; and a second anchorage unit (14, 34), coupled to the driven-mass arrangement for elastically coupling the driven-mass arrangement to the substrate (2) at second anchorages (17, 37). Following upon the driving movement, the resultant of the forces and of the torques exerted on the substrate (2) at the first and second anchorages is substantially zero.


Gate driver circuit for a half bridge or full bridge output driver stage, identifying a high side branch connected to one or more high side transistors (Mp) and a low side branch connected to one or more low side transistors (Mn), comprisinga high side gate driver (10; 21p) and a low side gate driver (10n; 21n) receiving input signals at a low voltage level (VDD) and operating with a high voltage level (VPP), outputting signals at a high voltage level as gate driving signals (Gp, Gn) for the high side transistors (Mp) and low side transistors (Mn) In the solution described the high side and the low side branches of the gate driver (11) include eacha set-reset latch (24p, 24n) which signal output (Qp, Qpn) is fed as gate signal to the corresponding transistor (Mp, Mn) of the half bridge or full bridge driver (11),a differential capacitive level shifter circuit (23p, 23n) receiving said input signals at a low voltage level and outputting high voltage signals to drive the set (S) and reset (R) inputs of the set-reset latch (24p, 24n).


Grant
Agency: European Commission | Branch: H2020 | Program: IA | Phase: IoT-01-2016 | Award Amount: 25.43M | Year: 2017

Automated driving is expected to increase safety, provide more comfort and create many new business opportunities for mobility services. The market size is expected to grow gradually reaching 50% of the market in 2035. The IoT is about enabling connections between objects or things; its about connecting anything, anytime, anyplace, using any service over any network. There is little doubt that these vehicles will be part of the IoT revolution. Indeed, connectivity and IoT have the capacity for disruptive impacts on highly and fully automated driving along all value chains towards a global vision of Smart Anything Everywhere. In order to stay competitive, the European automotive industry is investing in connected and automated driving with cars becoming moving objects in an IoT ecosystem eventually participating in BigData for Mobility. AUTOPILOT brings IoT into the automotive world to transform connected vehicles into highly and fully automated vehicle. The well-balanced AUTOPILOT consortium represents all relevant areas of the IoT eco-system. IoT open vehicle platform and an IoT architecture will be developed based on the existing and forthcoming standards as well as open source and vendor solutions. Thanks to AUTOPILOT, the IoT eco-system will involve vehicles, road infrastructure and surrounding objects in the IoT, with a particular attention to safety critical aspects of automated driving. AUTOPILOT will develop new services on top of IoT to involve autonomous driving vehicles, like autonomous car sharing, automated parking, or enhanced digital dynamic maps to allow fully autonomous driving. AUTOPILOT IoT enabled autonomous driving cars will be tested, in real conditions, at four permanent large scale pilot sites in Finland, France, Netherlands and Italy, whose test results will allow multi-criteria evaluations (Technical, user, business, legal) of the IoT impact on pushing the level of autonomous driving.


Grant
Agency: European Commission | Branch: H2020 | Program: IA | Phase: IoT-01-2016 | Award Amount: 34.71M | Year: 2017

The IoF2020 project is dedicated to accelerate adoption of IoT for securing sufficient, safe and healthy food and to strengthen competitiveness of farming and food chains in Europe. It will consolidate Europes leading position in the global IoT industry by fostering a symbiotic ecosystem of farmers, food industry, technology providers and research institutes. The IoF2020 consortium of 73 partners, led by Wageningen UR and other core partners of previous key projects such as FIWARE and IoT-A, will leverage the ecosystem and architecture that was established in those projects. The heart of the project is formed by 19 use cases grouped in 5 trials with end users from the Arable, Dairy, Fruits, Vegetables and Meat verticals and IoT integrators that will demonstrate the business case of innovative IoT solutions for a large number of application areas. A lean multi-actor approach focusing on user acceptability, stakeholder engagement and sustainable business models will boost technology and market readiness levels and bring end user adoption to the next stage. This development will be enhanced by an open IoT architecture and infrastructure of reusable components based on existing standards and a security and privacy framework. Anticipating vast technological developments and emerging challenges for farming and food, the 4-year project stays agile through dynamic budgeting and adaptive decision-making by an implementation board of representatives from key user organizations. A 6 M mid-term open call will allow for testing intermediate results and extending the project with technical solutions and test sites. A coherent dissemination strategy for use case products and project learnings supported by leading user organizations will ensure a high market visibility and an increased learning curve. Thus IoF2020 will pave the way for data-driven farming, autonomous operations, virtual food chains and personalized nutrition for European citizens.


Grant
Agency: European Commission | Branch: H2020 | Program: IA | Phase: IoT-01-2016 | Award Amount: 25.77M | Year: 2017

ACTIVAGE is a European Multi Centric Large Scale Pilot on Smart Living Environments. The main objective is to build the first European IoT ecosystem across 9 Deployment Sites (DS) in seven European countries, reusing and scaling up underlying open and proprietary IoT platforms, technologies and standards, and integrating new interfaces needed to provide interoperability across these heterogeneous platforms, that will enable the deployment and operation at large scale of Active & Healthy Ageing IoT based solutions and services, supporting and extending the independent living of older adults in their living environments, and responding to real needs of caregivers, service providers and public authorities. The project will deliver the ACTIVAGE IoT Ecosystem Suite (AIOTES), a set of Techniques, Tools and Methodologies for interoperability at different layers between heterogeneous IoT Platforms and an Open Framework for providing Semantic Interoperability of IoT Platforms for AHA, addressing trustworthiness, privacy, data protection and security. User-demand driven interoperable IoT-enabled Active & Healthy Ageing solutions will be deployed on top of the AIOTES in every DS, enhancing and scaling up existing services, for the promotion of independent living, the mitigation of frailty, and preservation of quality of life and autonomy. ACTIVAGE will assess the socio-economic impact, the benefits of IoT-based smart living environments in the quality of life and autonomy, and in the sustainability of the health and social care systems, demonstrating the seamless capacity of integration and interoperability of the IoT ecosystem, and validating new business, financial and organizational models for care delivery, ensuring the sustainability after the project end, and disseminating these results to a worldwide audience. The consortium comprises industries, research centres, SMEs, service providers, public authorities encompassing the whole value chain in every Deployment Site.

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