STATSChipPACKorea

Incheon, South Korea

STATSChipPACKorea

Incheon, South Korea
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Choi M.-R.,Korea Basic Science Institute | Kim H.-G.,Korea Institute of Industrial Technology | Lee T.-W.,Kangwon National University | Jeon Y.-J.,Kangwon National University | And 10 more authors.
Microelectronics Reliability | Year: 2015

We found the failure mechanisms in Ag wire bonded to Al pads during the high-temperature-storage lifetime test (HTST) and the unbiased highly-accelerated temperature and humidity storage test (uHAST). The native oxide layer on the Al pads caused a ball lift. The moisture and the thermal energy during uHAST along with the Cl- ion in epoxy molding compounds (EMCs) induced repetitive oxidation and reduction reactions of the Ag-Al intermetallic compounds (IMCs) with the Al pads. These repetitive reactions formed H2 gas as a by-product causing the formation of a micro-crack. In addition, the alumina layer acted as a resistive layer in the Ag-Al IMCs. The phases of the Ag-Al IMCs were identified as Ag2Al and Ag3Al, and the growth rates of those IMCs were measured at 150 and 175°C for 2000h. © 2015 Elsevier Ltd.

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