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Tan C.M.,Nanyang Technological University | Baudot C.,Nanyang Technological University | Baudot C.,ST Microelectronics Asia Pacific Pte Ltd | Han Y.,Tianjin University | Jing H.,Tianjin University
Nanoscale Research Letters | Year: 2012

Thermal management of integrated circuit chip is an increasing important challenge faced today. Heat dissipation of the chip is generally achieved through the die attach material and solders. With the temperature gradients in these materials, high thermo-mechanical stress will be developed in them, and thus they must also be mechanically strong so as to provide a good mechanical support to the chip. The use of multi-walled carbon nanotube to enhance the thermal conductivity, and the mechanical strength of die attach epoxy and Pb-free solder is demonstrated in this work. © 2012 Tan et al.


Kurniawati E.,ST Microelectronics Asia Pacific Pte Ltd | George S.,ST Microelectronics Asia Pacific Pte Ltd
Proceedings of the Annual Conference of the International Speech Communication Association, INTERSPEECH | Year: 2013

In this paper, we present a new method for isolated keyword detection that is meant to activate a personal device from standby state. Instead of using the common method for speech recognition such as Hidden Markov Model (HMM) or Dynamic Time Warping (DTW), we modify a GMM-UBM (Gaussian Mixture Model - Universal Background Model) scheme that is better known in speaker recognition field. Since only one adapted Gaussian mixture is used to represent the keyword, a second layer of check is employed to ensure the right sequence of occurrence within the keyword. This is done by comparing it with the Longest Common Subsequence (LCS) of the highest performing GMM component obtained during the registration phase. Results for a subset of the SpeechDat-Car database are presented to validate the benefit of this modeling against moderate noise level. Copyright © 2013 ISCA.


Tang M.,Institute of Microelectronics, Singapore | Liao E.,Taiwan Semiconductor Manufacturing Company | Cheng C.K.,Institute of Microelectronics, Singapore | Lee D.,Institute of Microelectronics, Singapore | And 6 more authors.
Journal of Microelectromechanical Systems | Year: 2010

A passive magnetostatic microelectromechanical systems (MEMS) switch using only one electroplated soft magnetic layer of nickeliron (Ni80Fe 20) alloy was designed, fabricated, and characterized. The switch is composed of an electroplated Ni80Fe20 plate supported by a pair of torsion bars from two sides. The Ni80Fe20 plate is patterned into long and narrow strips to improve the sensitivity. The switch is actuated by bringing an external magnet closer to the switch. Therefore, no internal electrical power is consumed by the device for actuation. The magnetic field required to turn on the switch is 4.8 mT, and the initial contact resistance is 0.5 Ω with gold contacts. The switch has been tested to pass more than 34 million hot-switching cycles at 2-mA current at room temperature when packaged at the wafer level with SU-8 sealing. The die size is 2.1 × 1.94 × 1.1 mm3. The magnetic switch of this paper has the potential to replace the conventional reed switch in portable electronics such as laptops, cellular phones, personal data assistants, pacemakers, and hearing aids. © 2006 IEEE.


Tang M.,Institute of Microelectronics, Singapore | Lee Y.H.,Institute of Microelectronics, Singapore | Kumar R.,Institute of Microelectronics, Singapore | Kumar R.,Globalfoundries | And 3 more authors.
Journal of Microelectromechanical Systems | Year: 2011

This paper presents design, fabrication, and characterization of a novel microelectromechanical microreed switch, which consists of two Ni 80Fe20 magnetic plates as microreeds. One is embedded in a silicon trench. The other is suspended above the substrate and supported by a pair of crab-leg flexures from the two sides. Both Ni80Fe 20 plates are split into two long, narrow strips to improve the sensitivity. The switch is actuated by bringing an external magnet closer to the switch. The magnetic field required to turn on the switch can be as low as 0.5 mT and the initial contact resistance is < 10 Ω with gold contacts. The switch has been tested to pass more than 40 million hot switching cycles at 2 mA current at room temperature when packaged at wafer level with SU-8 sealing. The die size is 1.7 × 1.8 × 1.1mm3. The proposed microreed switch can be used as the proximity sensor to sense the magnetic field. It also has the potential to replace the conventional reed switch in portable electronics, such as cellular phones, hearing aids, and laptops, where conserving battery power and device size is critical. © 2006 IEEE.


Tang M.,Institute of Microelectronics, Singapore | Lee Y.H.,Institute of Microelectronics, Singapore | Kumar R.,Institute of Microelectronics, Singapore | Shankar R.,ST Microelectronics Asia Pacific Pte Ltd | Neel O.L.,ST Microelectronics Asia Pacific Pte Ltd
2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11 | Year: 2011

This paper presents the design, the fabrication and the characterization of a novel MEMS micro-reed switch, which consists of two Ni80Fe 20 magnetic plates as micro-reeds. One is embedded in a silicon trench. The other is suspended above the substrate and supported by a pair of crab-leg flexures from the two sides. Both Ni80Fe20 plates are split into two long, narrow strips to improve the sensitivity. The switch is actuated by bringing an external magnet closer to the switch. The magnetic field required to turn on the switch can be as low as 1 mT. The contact force is estimated to ∼20 μN and the initial contact-resistance is < 10 ω with gold contacts. The switch has been tested to pass more than 40 million hot switching cycles at 2 mA current at room temperature when packaged at wafer level with SU-8 sealing. The die size is 1.7×1.8×1.1 mm3. The proposed micro-reed switch can be used as the proximity sensor to sense the magnetic field. It also has the potential to replace the conventional reed switch in portable electronics, such as cellular phones, hearing aids and laptops, where conserving battery power and device size is critical. © 2011 IEEE.

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