Pares G.,CEA Grenoble |
Karoui C.,STMicroelectronics |
Zaid A.,STMicroelectronics |
Dosseul F.,STMicroelectronics |
And 8 more authors.
Proceedings - Electronic Components and Technology Conference | Year: 2013
This work aims at answering to the 3D mega trend of silicon based platform and 3D wafer level packaging (3D-WLSiP). We focus on the development of architectures compliant with high volume markets for applications like mobile telecommunication. In this market, the silicon material will remain the key platform for 3D integration and has to offer the vertical interconnection as well as ultra-thin packages to fit into very slim electronic devices. We have designed both a mechanical demonstrator with daisy chains and a fully functional product based on a silicon interposer, focusing on forward and backward compatibility between Front-End and 3D packaging and the development of a complete set of advanced technological modules: - Thru-silicon-via interconnections (TSV) with copper via-mid technologies. - Ultra-thin (20 and 35 μm) chips fabrication using dicing before grinding (DBG) with 45° beveled edge and plasma stress release technology. - Thin chips stack on the TSV interposer before processing the back side (stacking first) with two different approaches. The first one is a flip chip integration based on Cu/SAC μ-bumps while the second is the Back-to-Face (B2F) way based on high topology RDL after permanent bonding of the chips face up on the interposer. Chip bonding is done with several materials either on die side with die attach film (DAF) or on interposer side using wafer level spin coated polymers. - Thin wafer handling using advanced temporary bonding process to handle the thin silicon interposer wafers during the integration based on BSI product from Brewer Science and ZoneBOND™ technology. Moreover different strategies of handling have been investigated involving high topology temporary bonding as well as carrier flip-flop approaches. - Thin wafer level packaging (TWLP) has been implemented sequentially on front side and back side of the thin resulting in a fully 3D-WLSiP module. Thermo-mechanical FEM simulation and first reliability assessment using mechanical demonstrator have been carried out and support the good mechanical behaviour of the integration. Electrical tests have been also completed that allows comparing the performances of F2F and B2F interconnection schemes in terms of resistances and yield at front side level but also at back side level after TSV exposure, RDL and bumps. Successful results of development loops have led to start processing a full functional product benefiting of the best process flow. © 2013 IEEE.
Hassen E.M.J.,CEA Grenoble |
Hassen E.M.J.,CNRS Spintronics and Technology of Components |
Viala B.,CEA Grenoble |
Cyrille M.C.,CEA Grenoble |
And 7 more authors.
Journal of Applied Physics | Year: 2012
Room temperature transport properties are reported in polycrystalline SrTiO 3-based magnetic tunnel junctions deposited by ion beam sputtering. The junctions comprise CoFeB electrodes and the SrTiO 3 barrier with thickness varied between 0.9 and 1.9 nm. Resistance area product values between 3 ω.m 2 and 22 ωμk.m 2 have been measured with a tunnel magnetoresistance ratio ranging from 3.1 to 13 at room temperature. At low barrier thickness (1.2 nm), ferromagnetic coupling between electrodes is observed, indicating the presence of defects in the structure. A post-oxidation step was found to improve transport properties at lower barrier thickness. © 2012 American Institute of Physics.
Djomeni L.,CEA Grenoble |
Mourier T.,CEA Grenoble |
Minoret S.,CEA Grenoble |
Fadloun S.,SPTS SAS |
And 6 more authors.
ECS Transactions | Year: 2014
This article is related to the development of a protocol for the characterization of the behavior of high aspect ratio through silicon via (TSV) during advanced three dimension (3D) integration. The time-of-flight (TOF)-SIMS profile measurement along the sidewall of the TSV with advanced samples preparations is described. This technique allows studying the efficiency of a low temperature, 200°C metallorganic chemical vapor deposition (MOCVD) titanium nitride (TiN) film as a barrier to copper diffusion into silicon. Then the thermo-mechanical stresses induced by the TSV in the surrounding silicon were studied by micro-Raman spectroscopy. Different TiN films were studied according to subsequent plasma treatments and compared with a reference deposited by ionized physical vapor deposition (i-PVD). The thermal stress in the silicon was found to decrease as a function of distance from an isolated TSV. The iPVD and MOCVD TiN barrier involved a more compressive stress than non-plasma treated MOCVD TiN. © 2014 by The Electrochemical Society. Copyright © 2014 by The Electrochemical Society.
Djomeni L.,CEA Grenoble |
Djomeni L.,University of Strasbourg |
Mourier T.,CEA Grenoble |
Minoret S.,CEA Grenoble |
And 8 more authors.
Microelectronic Engineering | Year: 2014
This article is related to the development of a new low temperature CVD titanium nitride deposition process for the formation of a copper diffusion barrier in 3D TSV integration, using a metalorganic precursor and NH 3. The physicochemical properties of the film are studied on 300 mm silicon wafers deposited using a SPTS Technologies Sigma300 fxP™ deposition equipment. A design of experiments (DoEs) was carried out at 200 °C to check the influence of parameters such as reactor pressure, spacing (distance between the showerhead and the wafer), precursor/NH3 flow rate during deposition and NH3 flow rate during a subsequent densification plasma treatment. Responses including resistivity, uniformity, deposition rate and stress were measured. From this DoE, two process points are chosen according to expected material specifications requested from applications: a low resistivity process and a median conditions process. Then microstructure, the composition and stoichiometry of the film deposited with these process points are studied. Finally, the step coverage and continuity of the barrier in a high aspect ratio "through silicon via" (8:1, 10 μm diameter etched in 80 μm silicon) are measured and compared with a reference I-PVD process. © 2014 Published by Elsevier B.V.
News Article | November 29, 2016
The Evidence In Motion family of companies, including International Spine and Pain Institute (ISPI), KinetaCore, and NeuroRecovery Training Institute (NeuroRTI), will have a large presence at this year’s Sports Physical Therapy Sections (SPTS) Team Concept Conference, which will take place December 1-3 at Planet Hollywood in Las Vegas, NV. Throughout the course of the conference EIM, ISPI, and NeuroRTI (Booth #26) and Kinetacore (Booth #27) will offer attendees the opportunity to learn about programs and register for prizes like Yetis, 50% off a KinetaCore course, and a free SCS Test Prep Course. The Team Concept Conference’s 2016 theme is “Return to Play”. This intensive three-day course will feature a golf medicine symposium, hands-on labs, and themed sessions. Attendees are encouraged to come early for a charity golf tournament or to certify or renew certification as an emergency medical responder during the EMR course. Those interested in attending the 2016 PPS Conference & Exhibition can register online. The conference costs $465 for SPTS members and $550 for APTA members. To learn more about EIM’s programs and the EIM family of companies, please visit http://www.evidenceinmotion.com. About Evidence In Motion (EIM): Evidence In Motion (EIM) is an education and consultation company that exists to elevate the role of physical and occupational therapists in health care delivery by providing premiere entry-level and post-professional education programs for rehabilitation professionals. They emphasize flexible educational offerings that feature the perfect blend of online and hands-on training from world-renowned educators with extensive experience in teaching, research, and business. EIM offers Continuing Education, Residency (Orthopaedic, Sports, and Neurologic), Orthopaedic Manual Physical Therapy Fellowship, Postprofessional Doctorate in Physical and Occupational Therapy and Certificate training programs (Manual PT, Sports PT, Pain Specialist, Geriatric, Industrial Health, Pelvic Health, Balance and Falls, Concussion Management, Hand, Cardiac, Stroke and Pediatric and Executive Program in Practice Management). For more information, please visit EvidenceInMotion.com. You can also find EIM on Facebook, Instagram, LinkedIn, and Twitter, @EIMTeam. EIM is in proud partnership with International Spine and Pain Institute, KinetaCore, and NeuroRecovery Training Institute.
News Article | December 5, 2016
the InterNational Electrical Testing Association offers an extensive selection of online training to help electrical power professionals not only continue their learning, but also meet the requirements for NETA certifications and other electrical industry certifications and credentials. A commitment to continuing educational requirements is important because it helps ensure that electrical power industry professionals perform at their best throughout their careers. NETA’s learning opportunities appeal to NETA Certified Technicians as well as electrical power systems professionals at large because the training focuses on the core competencies of quality, safety, and reliability. NETA requires the continuing education of its Level III and Level IV Certified Technicians, who are responsible for testing in accordance with ANSI/NETA standards. Each technician is required to earn 48 continuing technical development (CTD) credits by December 31, every three years, to maintain certification. This continuing education requirement helps assure that NETA Certified Technicians stay current with emerging technologies, new editions of industry standards, and best practices. Taking NETA Self-Paced Technical Seminars (SPTS) is a convenient way for technicians to earn these CTD credits. Technicians with certification numbers beginning with 00 and prior, as well as 01, 04, 07, 10, and 13, must earn 48 CTDs by December 31, 2016, to maintain their certification. In addition, the benefit of NETA training courses extends beyond the NETA Certified Technician because electrical power systems professionals who complete a NETA online course successfully can submit their results for continuing education credits for other electrical-related certifications or credentials needed to satisfy their profession’s requirements. Participants can access SPTS courses online at their convenience and complete them at their own pace. Each four-hour seminar includes a seminar DVD, a printed copy of the presentation, and one attempt at the course proficiency exam. The following is a list of SPTS training courses available in the NETA Bookstore. Each offers the potential for electrical power industry professionals to earn four hours of training (four NETA CTD credits for NETA Certified Technicians) or four hours of continuing educational credits: Electrical power systems professionals can also take advantage of ANSI/NETA Acceptance Testing Online Courses to advance their development and earn educational credits. Developed by the NETA Training Committee and approved by the NETA Standards Review Council, these training courses cover specific sections of ANSI/NETA, Standard for Acceptance Testing Specifications for Electrical Power Equipment and Systems (ANSI/NETA-ATS). The following is a list of ANSI/NETA Acceptance Testing Training Courses available for order. Each course contains interactive elements designed to keep the technician engaged in the learning process as well as to give instant feedback on whether the information is being learned correctly: Please contact the NETA office at 888-300-6382 with questions regarding training or the CTD program. ABOUT NETA NETA is an ANSI Accredited Standards Developing Organization that creates and maintains standards on electrical testing for electrical power equipment and systems. NETA is an association of leading electrical testing companies comprised of visionaries committed to advancing the industry standards for power system installation and maintenance to ensure the highest level of reliability and safety.
News Article | November 28, 2016
Vancouver telecommunications company, Novus Entertainment Inc., recently launched its Ericsson Mediaroom-powered end-to-end IPTV service and selected Inca Networks’ high-density 4430 series modular MPEG-4 transcoders to provide video transcoding, processing, and monitoring for the full channel line-up. With a powerful and extensible architecture, the 4430 protects Novus’ investment with the ability to add 4K and next-generation HEVC codec support. Available in 2017, a forthcoming module for the 4430 transcoder chassis will deliver HEVC compression and new ultra-high-definition (UHD) 4K support. The deep visibility and extensive monitoring provided by the Inca VidiOS management platform, included in all Inca products, enables Novus to launch their new IPTV service while improving system visibility, lowering operating expenses, and lowering engineering costs. Novus leverages Inca’s class-leading density and low power consumption to transcode and process up to 36 HD or 90 SD channels in one rack unit of space. The 4430 also supports Mediaroom picture-in-picture (PIP) requirements and high-density audio transcoding. As a member of the Canadian Cable Systems Alliance, Novus has been one of the driving forces behind regulatory changes in Canada, to provide more affordable and flexible television options to the Canadian consumer. Their new IPTV service will continue to allow them to compete with larger Canadian telecommunications companies - with a focus on customer service. “We understand that video is a complex business for independent telecom operators. At Inca, we believe that head-end equipment should do more than just process video,” says Jeff Campbell, CEO of Inca Networks. “Transcoders should provide a deep and powerful set of tools to help independent operators run their video business and save money on a day-to-day basis. Deeper visibility and better control are the cornerstones of our VidiOS powered Intelligent Video Delivery solutions.” One of the key factors in Novus choosing Inca was the tight VidiOS integration between the Inca 4430 transcoder of the Inca 5420 All Seeing Eye (ASE) monitoring and management platform. The All Seeing Eye provides Novus with an innovative mosaic and visual monitoring of all IP video streams in their headend by leveraging the embedded monitoring capabilities present in every Inca product. The ASE also supports the monitoring of streams generated by other vendor’s equipment, to provide a true network-wide view of all video streams. Using the ASE allows any member of the Novus team to monitor the network using a simple web browser. The system also sends out email notifications when alarms are reported and when issues are resolved. With the launch of their new IPTV service, Novus is bringing Metro Vancouver residents a new, user-friendly interface for their entertainment experience. Novus Co-Presidents Doug Holman and Donna Robertson say: “Novus’ pure fiber optic network, combined with its metro Ethernet method of delivering the Internet, is ideal for offering an IP-based TV service. The transition to IPTV will enable Novus to deliver an innovative and personalized HD viewing experience. Novus chose the Inca 4430 transcoder and All Seeing Eye due to the high quality of the management tools, great video quality and the knowledgeable support we’ve experienced both over the phone and in person. These things, combined with our pure fiber optic network, enable the best quality HD digital video for Novus customers.” This new Mediaroom-based TV platform enables Novus to provide a more personal and engaging user experience for residents within multi-dwelling condominium and apartment unit buildings across the Metro Vancouver area. With the ability to deliver high-quality live or on-demand video, Novus customers will be able to continue to customize their television services to suit their needs. To learn more about the Inca 4430 transcoder and 5420 All Seeing Eye product lines, visit: http://www.incanetworks.com About Inca Networks Inca Networks, a WISI company, is reinventing the future of multiscreen video delivery. Inca offers industry-leading Intelligent Video Delivery™, a revolutionary software-centric solution for intelligent, real-time processing of linear and multiscreen television content. At its core is VidiOS™, an advanced software processing and monitoring engine that provides deep visibility and control of all video flows, combined with powerful, modular hardware. Inca’s IP video solutions address all aspects of next-generation video, including high-density MPEG-4 and MPEG-2 HD and SD transcoder modules for linear and multiscreen adaptive bit-rate (ABR) and HTTP live streaming (HLS) services; demultiplexing and remapping of MPTS video from satellite and off-air sources to SPTS streams in digital cable, DSL and fiber to the home (FTTH) IPTV networks; multi-viewer mosaic and status monitoring software, digital music service demuxing, and modular ASI to IP conversion. In July 2015, the Wilhelm Sihn jr. (WISI) company of Germany acquired Vancouver’s Inca Networks Inc. Founded in 1926, WISI is one of the world’s pioneers in broadband reception and distribution technology. Today, WISI’s field of business is the development, production and distribution of products and solutions in the following areas: automotive antenna and cabling, components for broadband networks, fiber optics for broadband, digital signal reception, processing and modulation for TV and radio, in-house multimedia. Inca Networks sells and distributes WISI’s Tangram and Chameleon platforms to the North American, Caribbean and Latin American markets. Video providers around the globe use Inca to easily and affordably deliver content to any screen on any network, all with a superior customer viewing experience and a second-to-none view of the network. http://www.incanetworks.com. Founded in 1996, Novus Entertainment Inc. is a privately owned and operated company providing high-speed Internet, TV, and digital phone services to residents in multi-dwelling units and business customers in Metro Vancouver. Novus continues to expand its fibre optic network throughout Metro Vancouver to offer customers the very best in entertainment and communications technology. The network provides virtually unlimited bandwidth to provide one gigabit per second connectivity and beyond, with the capability to meet future demands, particularly for high-definition and 4K programming. For more information on Novus, go to http://www.novusnow.ca. For more information please contact Rosalinda Thorleifson, Tel. +1-604-418-9715