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News Article | April 26, 2017
Site: en.prnasia.com

TAIPEI, Taiwan, April 26, 2017 /PRNewswire/ -- Advanced Semiconductor Engineering, Inc. (NYSE: ASX, TAIEX: 2311, "ASE" or the "Company"), announces that it has filed its annual report on Form 20-F for the year ended December 31, 2016 with the U.S. Securities and Exchange Commission.  The 2016 20-F is available on ASE's website at and on the website of the U.S. Securities and Exchange Commission at .  Hard copies of the audited financial statements included in the 2016 Form 20-F are available to shareholders upon request and free of charge.  To request a copy of the audited financial statements, please contact Citibank Shareholder Services at 1-877-CITI-ADR (248-4237). This press release contains "forward-looking statements" within the meaning of Section 27A of the United States Securities Act of 1933, as amended, and Section 21E of the United States Securities Exchange Act of 1934, as amended. Although these forward-looking statements, which may include statements regarding our future results of operations, financial condition or business prospects, are based on our own information and information from other sources we believe to be reliable, you should not place undue reliance on these forward-looking statements, which apply only as of the date of this press release. The words "anticipate," "believe," "estimate," "expect," "intend," "plan" and similar expressions, as they relate to us, are intended to identify these forward-looking statements in this press release. Our actual results of operations, financial condition or business prospects may differ materially from those expressed or implied in these forward-looking statements for a variety of reasons, including risks associated with cyclicality and market conditions in the semiconductor or electronic industry; changes in our regulatory environment, including our ability to comply with new or stricter environmental regulations and to resolve environmental liabilities; demand for the outsourced semiconductor packaging, testing and electronic manufacturing services we offer and for such outsourced services generally; the highly competitive semiconductor or manufacturing industry we are involved in; our ability to introduce new technologies in order to remain competitive; international business activities; our business strategy; our future expansion plans and capital expenditures; the uncertainties as to whether we can complete the share exchange contemplated under a share exchange agreement between SPIL and us; the strained relationship between the Republic of China and the People's Republic of China; general economic and political conditions; the recent global economic crisis; possible disruptions in commercial activities caused by natural or human-induced disasters; fluctuations in foreign currency exchange rates; and other factors.  For a discussion of these risks and other factors, please see the documents we file from time to time with the Securities and Exchange Commission, including our 2016 Annual Report on Form 20-F filed on April 21, 2017. To view the original version on PR Newswire, visit:http://www.prnewswire.com/news-releases/advanced-semiconductor-engineering-inc-files-2016-annual-report-on-form-20-f-300445921.html


News Article | April 26, 2017
Site: www.prnewswire.com

This press release contains "forward-looking statements" within the meaning of Section 27A of the United States Securities Act of 1933, as amended, and Section 21E of the United States Securities Exchange Act of 1934, as amended. Although these forward-looking statements, which may include statements regarding our future results of operations, financial condition or business prospects, are based on our own information and information from other sources we believe to be reliable, you should not place undue reliance on these forward-looking statements, which apply only as of the date of this press release. The words "anticipate," "believe," "estimate," "expect," "intend," "plan" and similar expressions, as they relate to us, are intended to identify these forward-looking statements in this press release. Our actual results of operations, financial condition or business prospects may differ materially from those expressed or implied in these forward-looking statements for a variety of reasons, including risks associated with cyclicality and market conditions in the semiconductor or electronic industry; changes in our regulatory environment, including our ability to comply with new or stricter environmental regulations and to resolve environmental liabilities; demand for the outsourced semiconductor packaging, testing and electronic manufacturing services we offer and for such outsourced services generally; the highly competitive semiconductor or manufacturing industry we are involved in; our ability to introduce new technologies in order to remain competitive; international business activities; our business strategy; our future expansion plans and capital expenditures; the uncertainties as to whether we can complete the share exchange contemplated under a share exchange agreement between SPIL and us; the strained relationship between the Republic of China and the People's Republic of China; general economic and political conditions; the recent global economic crisis; possible disruptions in commercial activities caused by natural or human-induced disasters; fluctuations in foreign currency exchange rates; and other factors.  For a discussion of these risks and other factors, please see the documents we file from time to time with the Securities and Exchange Commission, including our 2016 Annual Report on Form 20-F filed on April 21, 2017. To view the original version on PR Newswire, visit:http://www.prnewswire.com/news-releases/advanced-semiconductor-engineering-inc-files-2016-annual-report-on-form-20-f-300445921.html


TAICHUNG, Taiwan, July 25, 2017 /PRNewswire/ -- Siliconware Precision Industries Co., Ltd. ("SPIL" or the "Company") (Taiwan Stock Exchange: 2325, NASDAQ: SPIL) today announced that its consolidated sales revenues for the second quarter of 2017 were NT$ 20,425 million, which represented a 4.5% growth in revenues compared to the first quarter of 2017 and a 5.8% decline in revenues compared to the second quarter of 2016. SPIL reported a net income of NT$ 2,158 million for the second quarter of 2017, compared with a net income of NT$ 997 million and a net income of NT$ 2,809 million for the first quarter of 2017 and the second quarter of 2016, respectively. Basic earnings per share for this quarter was NT$ 0.69, and diluted earnings per ordinary share was NT$ 0.49. Basic earnings per ADS for this quarter was US$ 0.11, and diluted earnings per ADS was US$ 0.08. All figures were prepared in accordance with T-IFRS on a consolidated basis. For more information, please visit: https://photos.prnasia.com/prnk/20170725/1906086-1 Siliconware Precision Industries Ltd. ("SPIL")(NASDAQ:SPIL, Taiwan Stock Exchange:2325) is a leading provider of comprehensive semiconductor assembly and test services. SPIL is dedicated to meeting all of its customers' integrated circuit packaging and testing requirements, with turnkey solutions that range from design consultations, modeling and simulations, wafer bumping, wafer probe and sort, package assembly, final test, burn-in, to shipment. Products include advanced leadframe, substrate packages, wafer bumping and FCBGA, which are widely used in personal computers, communications, Internet appliances, cellular phones, digital cameras, cable modems, personal digital assistants and LCD monitors. SPIL supplies services and support to fabless design houses, integrated device manufacturers and wafer foundries globally. For further information, visit SPIL's web site at The information herein contains forward-looking statements within the meaning of Section 27A of the U.S. Securities Act of 1933 and Section 21E of the U.S. Securities Exchange Act of 1934. We have based these forward-looking statements on our current expectation and projections about future events. Such forward-looking statements are inherently subject to known and unknown risks, uncertainties, assumptions about us and other factors that may cause the actual performance, financial condition or results of operations of SPIL to be materially different from what may be implied by such forward-looking statements. Investors are cautioned that actual events and results could differ materially from those statements as a result of a number of factors, including, among other things: The words "anticipate," "believe," "estimate," "expect," "intend," "plan" and similar expressions, as they relate to us, are intended to identify a number of these forward-looking statements. We undertake no obligation to update or revise any forward-looking statements whether as a result of new information, future events or otherwise. In light of these risks, uncertainties and assumptions, the forward-looking events discussed herein might not occur and our actual results could differ materially from those anticipated in these forward-looking statements. All financial figures discussed herein are prepared pursuant to TIFRS on a consolidated basis. The investment gains or losses of our company for the three months ended June 30, 2017 reflect our gains or losses attributable to the second quarter of 2017 unaudited financial results of several of our investees which are evaluated under the equity method. Neither the consolidated financial data for our company for the three months ended June 30, 2017, nor the consolidated financial data for our company for the six months ended June 30, 2017 is necessarily indicative of the results that may be expected for any period thereafter.


Basic earnings per share for this quarter was NT$ 0.69, and diluted earnings per ordinary share was NT$ 0.49. Basic earnings per ADS for this quarter was US$ 0.11, and diluted earnings per ADS was US$ 0.08. All figures were prepared in accordance with T-IFRS on a consolidated basis. For more information, please visit: https://photos.prnasia.com/prnk/20170725/1906086-1 Siliconware Precision Industries Ltd. ("SPIL")(NASDAQ: SPIL, Taiwan Stock Exchange:2325) is a leading provider of comprehensive semiconductor assembly and test services. SPIL is dedicated to meeting all of its customers' integrated circuit packaging and testing requirements, with turnkey solutions that range from design consultations, modeling and simulations, wafer bumping, wafer probe and sort, package assembly, final test, burn-in, to shipment. Products include advanced leadframe, substrate packages, wafer bumping and FCBGA, which are widely used in personal computers, communications, Internet appliances, cellular phones, digital cameras, cable modems, personal digital assistants and LCD monitors. SPIL supplies services and support to fabless design houses, integrated device manufacturers and wafer foundries globally. For further information, visit SPIL's web site at The information herein contains forward-looking statements within the meaning of Section 27A of the U.S. Securities Act of 1933 and Section 21E of the U.S. Securities Exchange Act of 1934. We have based these forward-looking statements on our current expectation and projections about future events. Such forward-looking statements are inherently subject to known and unknown risks, uncertainties, assumptions about us and other factors that may cause the actual performance, financial condition or results of operations of SPIL to be materially different from what may be implied by such forward-looking statements. Investors are cautioned that actual events and results could differ materially from those statements as a result of a number of factors, including, among other things: The words "anticipate," "believe," "estimate," "expect," "intend," "plan" and similar expressions, as they relate to us, are intended to identify a number of these forward-looking statements. We undertake no obligation to update or revise any forward-looking statements whether as a result of new information, future events or otherwise. In light of these risks, uncertainties and assumptions, the forward-looking events discussed herein might not occur and our actual results could differ materially from those anticipated in these forward-looking statements. All financial figures discussed herein are prepared pursuant to TIFRS on a consolidated basis. The investment gains or losses of our company for the three months ended June 30, 2017 reflect our gains or losses attributable to the second quarter of 2017 unaudited financial results of several of our investees which are evaluated under the equity method. Neither the consolidated financial data for our company for the three months ended June 30, 2017, nor the consolidated financial data for our company for the six months ended June 30, 2017 is necessarily indicative of the results that may be expected for any period thereafter.


News Article | November 7, 2016
Site: www.newsmaker.com.au

MarketStudyReport.com adds “Global Semiconductor Packaging Market by Manufacturers, Regions, Type and Application, Forecast to 2021” new report to its research database. The report spread across 102 pages with table and figures in it. Scope of the Report: This report focuses on the Semiconductor Packaging in Global market, especially in North America, Europe and Asia-Pacific, Latin America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application. Browse full table of contents and data tables at https://www.marketstudyreport.com/reports/global-semiconductor-packaging-market-by-manufacturers-regions-type-and-application-forecast-to-2021/ Market Segment by Manufacturers, this report covers ASE, Amkor, SPIL, Stats Chippac, PTI, JCET, J-Devices, UTAC, Chipmos, Chipbond , STS, Huatian, NFM, Carsem, Walton, Unisem, OSE, AOI, Formosa, NEPES. Market Segment by Regions, regional analysis covers North America (USA, Canada and Mexico) Europe (Germany, France, UK, Russia and Italy) Asia-Pacific (China, Japan, Korea, India and Southeast Asia) Latin America, Middle East and Africa Market Segment by Type, covers DIP QFP SiP BGA CSP Others Market Segment by Applications, can be divided into Analog & Mixed Signal Wireless Connectivity Optoelectronic MEMS & Sensor Misc Logic and Memory There are 13 Chapters to deeply display the global Semiconductor Packaging market. Chapter 1, to describe Semiconductor Packaging Introduction, product scope, market overview, market opportunities, market risk, market driving force; Chapter 2, to analyze the top manufacturers of Semiconductor Packaging, with sales, revenue, and price of Semiconductor Packaging, in 2015 and 2016; Chapter 3, to display the competitive situation among the top manufacturers, with sales, revenue and market share in 2015 and 2016; Chapter 4, to show the global market by regions, with sales, revenue and market share of Semiconductor Packaging, for each region, from 2011 to 2016; Chapter 5, 6, 7 and 8, to analyze the key regions, with sales, revenue and market share by key countries in these regions; Chapter 9 and 10, to show the market by type and application, with sales market share and growth rate by type, application, from 2011 to 2016; Chapter 11, Semiconductor Packaging market forecast, by regions, type and application, with sales and revenue, from 2016 to 2021; Chapter 12 and 13, to describe Semiconductor Packaging sales channel, distributors, traders, dealers, appendix and data source. To receive personalized assistance write to us @ [email protected] with the report title in the subject line along with your questions or call us at +1 866-764-2150


News Article | November 2, 2016
Site: www.newsmaker.com.au

Scope of the Report:  This report focuses on the Semiconductor Packaging in Global market, especially in North America, Europe and Asia-Pacific, Latin America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application. Market Segment by Regions, regional analysis covers  North America (USA, Canada and Mexico)  Europe (Germany, France, UK, Russia and Italy)  Asia-Pacific (China, Japan, Korea, India and Southeast Asia)  Latin America, Middle East and Africa Market Segment by Applications, can be divided into  Analog & Mixed Signal  Wireless Connectivity  Optoelectronic  MEMS & Sensor  Misc Logic and Memory There are 13 Chapters to deeply display the global Semiconductor Packaging market. Chapter 2, to analyze the top manufacturers of Semiconductor Packaging, with sales, revenue, and price of Semiconductor Packaging, in 2015 and 2016; Chapter 3, to display the competitive situation among the top manufacturers, with sales, revenue and market share in 2015 and 2016; Chapter 4, to show the global market by regions, with sales, revenue and market share of Semiconductor Packaging, for each region, from 2011 to 2016; Chapter 5, 6, 7 and 8, to analyze the key regions, with sales, revenue and market share by key countries in these regions; Chapter 9 and 10, to show the market by type and application, with sales market share and growth rate by type, application, from 2011 to 2016; Chapter 11, Semiconductor Packaging market forecast, by regions, type and application, with sales and revenue, from 2016 to 2021; Chapter 12 and 13, to describe Semiconductor Packaging sales channel, distributors, traders, dealers, appendix and data source. 1 Market Overview      1.1 Semiconductor Packaging Introduction      1.2 Market Analysis by Type        1.2.1 DIP        1.2.2 QFP        1.2.3 SiP        1.2.4 BGA        1.2.5 CSP      1.3 Market Analysis by Applications        1.3.1 Analog & Mixed Signal        1.3.2 Wireless Connectivity        1.3.3 Optoelectronic        1.3.4 MEMS & Sensor        1.3.5 Misc Logic and Memory      1.4 Market Analysis by Regions        1.4.1 North America (USA, Canada and Mexico)            1.4.1.1 USA            1.4.1.2 Canada            1.4.1.3 Mexico        1.4.2 Europe (Germany, France, UK, Russia and Italy)            1.4.2.1 Germany            1.4.2.2 France            1.4.2.3 UK            1.4.2.4 Russia            1.4.2.5 Italy        1.4.3 Asia-Pacific (China, Japan, Korea, India and Southeast Asia)            1.4.3.1 China            1.4.3.2 Japan            1.4.3.3 Korea            1.4.3.4 India            1.4.3.5 Southeast Asia        1.4.4 Latin America, Middle East and Africa            1.4.4.1 Brazil            1.4.4.2 Egypt            1.4.4.3 Saudi Arabia            1.4.4.4 South Africa            1.4.4.5 Nigeria      1.5 Market Dynamics        1.5.1 Market Opportunities        1.5.2 Market Risk        1.5.3 Market Driving Force  2 Manufacturers Profiles      2.1 ASE        2.1.1 Business Overview        2.1.2 Semiconductor Packaging Type and Applications            2.1.2.1 Type 1            2.1.2.2 Type 2        2.1.3 ASE Semiconductor Packaging Sales, Price, Revenue, Gross Margin and Market Share      2.2 Amkor        2.2.1 Business Overview        2.2.2 Semiconductor Packaging Type and Applications            2.2.2.1 Type 1            2.2.2.2 Type 2        2.2.3 Amkor Semiconductor Packaging Sales, Price, Revenue, Gross Margin and Market Share      2.3 SPIL        2.3.1 Business Overview        2.3.2 Semiconductor Packaging Type and Applications            2.3.2.1 Type 1            2.3.2.2 Type 2        2.3.3 SPIL Semiconductor Packaging Sales, Price, Revenue, Gross Margin and Market Share      2.4 Stats Chippac        2.4.1 Business Overview        2.4.2 Semiconductor Packaging Type and Applications            2.4.2.1 Type 1            2.4.2.2 Type 2        2.4.3 Stats Chippac Semiconductor Packaging Sales, Price, Revenue, Gross Margin and Market Share      2.5 PTI        2.5.1 Business Overview        2.5.2 Semiconductor Packaging Type and Applications            2.5.2.1 Type 1            2.5.2.2 Type 2        2.5.3 PTI Semiconductor Packaging Sales, Price, Revenue, Gross Margin and Market Share      2.6 JCET        2.6.1 Business Overview        2.6.2 Semiconductor Packaging Type and Applications            2.6.2.1 Type 1            2.6.2.2 Type 2        2.6.3 JCET Semiconductor Packaging Sales, Price, Revenue, Gross Margin and Market Share      2.7 J-Devices        2.7.1 Business Overview        2.7.2 Semiconductor Packaging Type and Applications            2.7.2.1 Type 1            2.7.2.2 Type 2        2.7.3 J-Devices Semiconductor Packaging Sales, Price, Revenue, Gross Margin and Market Share      2.8 UTAC        2.8.1 Business Overview        2.8.2 Semiconductor Packaging Type and Applications            2.8.2.1 Type 1            2.8.2.2 Type 2        2.8.3 UTAC Semiconductor Packaging Sales, Price, Revenue, Gross Margin and Market Share      2.9 Chipmos        2.9.1 Business Overview        2.9.2 Semiconductor Packaging Type and Applications            2.9.2.1 Type 1            2.9.2.2 Type 2        2.9.3 Chipmos Semiconductor Packaging Sales, Price, Revenue, Gross Margin and Market Share      2.10 Chipbond        2.10.1 Business Overview        2.10.2 Semiconductor Packaging Type and Applications            2.10.2.1 Type 1            2.10.2.2 Type 2        2.10.3 Chipbond Semiconductor Packaging Sales, Price, Revenue, Gross Margin and Market Share      2.11 STS        2.11.1 Business Overview        2.11.2 Semiconductor Packaging Type and Applications            2.11.2.1 Type 1            2.11.2.2 Type 2        2.11.3 STS Semiconductor Packaging Sales, Price, Revenue, Gross Margin and Market Share      2.12 Huatian        2.12.1 Business Overview        2.12.2 Semiconductor Packaging Type and Applications            2.12.2.1 Type 1            2.12.2.2 Type 2        2.12.3 Huatian Semiconductor Packaging Sales, Price, Revenue, Gross Margin and Market Share      2.13 NFM        2.13.1 Business Overview        2.13.2 Semiconductor Packaging Type and Applications            2.13.2.1 Type 1            2.13.2.2 Type 2        2.13.3 NFM Semiconductor Packaging Sales, Price, Revenue, Gross Margin and Market Share      2.14 Carsem        2.14.1 Business Overview        2.14.2 Semiconductor Packaging Type and Applications            2.14.2.1 Type 1            2.14.2.2 Type 2        2.14.3 Carsem Semiconductor Packaging Sales, Price, Revenue, Gross Margin and Market Share      2.15 Walton        2.15.1 Business Overview        2.15.2 Semiconductor Packaging Type and Applications            2.15.2.1 Type 1            2.15.2.2 Type 2        2.15.3 Walton Semiconductor Packaging Sales, Price, Revenue, Gross Margin and Market Share      2.16 Unisem        2.16.1 Business Overview        2.16.2 Semiconductor Packaging Type and Applications            2.16.2.1 Type 1            2.16.2.2 Type 2        2.16.3 Unisem Semiconductor Packaging Sales, Price, Revenue, Gross Margin and Market Share      2.17 OSE        2.17.1 Business Overview        2.17.2 Semiconductor Packaging Type and Applications            2.17.2.1 Type 1            2.17.2.2 Type 2        2.17.3 OSE Semiconductor Packaging Sales, Price, Revenue, Gross Margin and Market Share      2.18 AOI        2.18.1 Business Overview        2.18.2 Semiconductor Packaging Type and Applications            2.18.2.1 Type 1            2.18.2.2 Type 2        2.18.3 AOI Semiconductor Packaging Sales, Price, Revenue, Gross Margin and Market Share      2.19 Formosa        2.19.1 Business Overview        2.19.2 Semiconductor Packaging Type and Applications            2.19.2.1 Type 1            2.19.2.2 Type 2        2.19.3 Formosa Semiconductor Packaging Sales, Price, Revenue, Gross Margin and Market Share      2.20 NEPES        2.20.1 Business Overview        2.20.2 Semiconductor Packaging Type and Applications            2.20.2.1 Type 1            2.20.2.2 Type 2        2.20.3 NEPES Semiconductor Packaging Sales, Price, Revenue, Gross Margin and Market Share  3 Global Semiconductor Packaging Market Competition, by Manufacturer      3.1 Global Semiconductor Packaging Sales and Market Share by Manufacturer      3.2 Global Semiconductor Packaging Revenue and Market Share by Manufacturer      3.3 Market Concentration Rate        3.3.1 Top 3 Semiconductor Packaging Manufacturer Market Share        3.3.2 Top 6 Semiconductor Packaging Manufacturer Market Share      3.4 Market Competition Trend  4 Global Semiconductor Packaging Market Analysis by Regions      4.1 Global Semiconductor Packaging Sales, Revenue and Market Share by Regions        4.1.1 Global Semiconductor Packaging Sales by Regions (2011-2016)        4.1.2 Global Semiconductor Packaging Revenue by Regions (2011-2016)      4.2 North America Semiconductor Packaging Sales and Growth (2011-2016)      4.3 Europe Semiconductor Packaging Sales and Growth (2011-2016)      4.4 Asia-Pacific Semiconductor Packaging Sales and Growth (2011-2016)      4.5 Latin America Semiconductor Packaging Sales and Growth (2011-2016)      4.6 Middle East and Africa Semiconductor Packaging Sales and Growth (2011-2016)  5 North America Semiconductor Packaging by Countries      5.1 North America Semiconductor Packaging Sales, Revenue and Market Share by Countries        5.1.1 North America Semiconductor Packaging Sales by Countries (2011-2016)        5.1.2 North America Semiconductor Packaging Revenue by Countries (2011-2016)      5.2 USA Semiconductor Packaging Sales and Growth (2011-2016)      5.3 Canada Semiconductor Packaging Sales and Growth (2011-2016)      5.4 Mexico Semiconductor Packaging Sales and Growth (2011-2016)  6 Europe Semiconductor Packaging by Countries      6.1 Europe Semiconductor Packaging Sales, Revenue and Market Share by Countries        6.1.1 Europe Semiconductor Packaging Sales by Countries (2011-2016)        6.1.2 Europe Semiconductor Packaging Revenue by Countries (2011-2016)      6.2 Germany Semiconductor Packaging Sales and Growth (2011-2016)      6.3 UK Semiconductor Packaging Sales and Growth (2011-2016)      6.4 France Semiconductor Packaging Sales and Growth (2011-2016)      6.5 Russia Semiconductor Packaging Sales and Growth (2011-2016)      6.6 Italy Semiconductor Packaging Sales and Growth (2011-2016)  7 Asia-Pacific Semiconductor Packaging by Countries      7.1 Asia-Pacific Semiconductor Packaging Sales, Revenue and Market Share by Countries        7.1.1 Asia-Pacific Semiconductor Packaging Sales by Countries (2011-2016)        7.1.2 Asia-Pacific Semiconductor Packaging Revenue by Countries (2011-2016)      7.2 China Semiconductor Packaging Sales and Growth (2011-2016)      7.3 Japan Semiconductor Packaging Sales and Growth (2011-2016)      7.4 Korea Semiconductor Packaging Sales and Growth (2011-2016)      7.5 India Semiconductor Packaging Sales and Growth (2011-2016)      7.6 Southeast Asia Semiconductor Packaging Sales and Growth (2011-2016)  8 Latin America, Middle East and Africa Semiconductor Packaging by Countries      8.1 Latin America, Middle East and Africa Semiconductor Packaging Sales, Revenue and Market Share by Countries        8.1.1 Latin America, Middle East and Africa Semiconductor Packaging Sales by Countries (2011-2016)        8.1.2 Latin America, Middle East and Africa Semiconductor Packaging Revenue by Countries (2011-2016)      8.2 Brazil Semiconductor Packaging Sales and Growth (2011-2016)      8.3 Saudi Arabia Semiconductor Packaging Sales and Growth (2011-2016)      8.4 Egypt Semiconductor Packaging Sales and Growth (2011-2016)      8.5 Nigeria Semiconductor Packaging Sales and Growth (2011-2016)      8.6 South Africa Semiconductor Packaging Sales and Growth (2011-2016)  9 Semiconductor Packaging Market Segment by Type      9.1 Global Semiconductor Packaging Sales, Revenue and Market Share by Type (2011-2016)        9.1.1 Global Semiconductor Packaging Sales and Market Share by Type (2011-2016)        9.1.2 Global Semiconductor Packaging Revenue and Market Share by Type (2011-2016)      9.2 DIP Sales Growth and Price        9.2.1 Global DIP Sales Growth (2011-2016)        9.2.2 Global DIP Price (2011-2016)      9.3 QFP Sales Growth and Price        9.3.1 Global QFP Sales Growth (2011-2016)        9.3.2 Global QFP Price (2011-2016)      9.4 SiP Sales Growth and Price        9.4.1 Global SiP Sales Growth (2011-2016)        9.4.2 Global SiP Price (2011-2016)      9.5 BGA Sales Growth and Price        9.5.1 Global BGA Sales Growth (2011-2016)        9.5.2 Global BGA Price (2011-2016)  10 Semiconductor Packaging Market Segment by Application      10.1 Global Semiconductor Packaging Sales Market Share by Application (2011-2016)      10.2 Analog & Mixed Signal Sales Growth (2011-2016)      10.3 Wireless Connectivity Sales Growth (2011-2016)      10.4 Optoelectronic Sales Growth (2011-2016)      10.5 MEMS & Sensor Sales Growth (2011-2016)      10.6 Misc Logic and Memory Sales Growth (2011-2016)  11 Semiconductor Packaging Market Forecast (2016-2021)      11.1 Global Semiconductor Packaging Sales, Revenue and Growth Rate (2016-2021)      11.2 Semiconductor Packaging Market Forecast by Regions (2016-2021)      11.3 Semiconductor Packaging Market Forecast by Type (2016-2021)      11.4 Semiconductor Packaging Market Forecast by Application (2016-2021)  12 Sales Channel, Distributors, Traders and Dealers      12.1 Sales Channel        12.1.1 Direct Marketing        12.1.2 Indirect Marketing        12.1.3 Marketing Channel Future Trend      12.2 Distributors, Traders and Dealers  13 Appendix      13.1 Methodology      13.2 Analyst Introduction      13.3 Data SourceList of Tables and Figures


News Article | November 11, 2016
Site: www.newsmaker.com.au

Notes:  Sales, means the sales volume of Advanced Packaging  Revenue, means the sales value of Advanced Packaging This report studies sales (consumption) of Advanced Packaging in Global market, especially in United States, China, Europe, Japan, focuses on top players in these regions/countries, with sales, price, revenue and market share for each player in these regions, covering  ASE  Amkor Technology  SPIL  Stats Chippac  Powertech Technology  Jiangsu Changjiang Electronics Technology  J-Devices  UTAC  Chipmos Technologies  Chipbond Technology  STS Semiconductor  Tianshui Huatian Technology  Nantong Fujitsu Microelectronics  Carsem Semiconductor  Walton Advanced Engineering  Unisem  Orient Semiconductor Electronics  AOI Electronics  Formosa Advanced Technologies  NEPES  Market Segment by Regions, this report splits Global into several key Regions, with sales (consumption), revenue, market share and growth rate of Advanced Packaging in these regions, from 2011 to 2021 (forecast), like  United States  China  Europe  Japan  Split by product Types, with sales, revenue, price and gross margin, market share and growth rate of each type, can be divided into  Type I  Type II  Type III  Split by applications, this report focuses on sales, market share and growth rate of Advanced Packaging in each application, can be divided into  Application 1  Application 2  Application 3 Global Advanced Packaging Sales Market Report 2016  1 Advanced Packaging Overview  1.1 Product Overview and Scope of Advanced Packaging  1.2 Classification of Advanced Packaging  1.2.1 Type I  1.2.2 Type II  1.2.3 Type III  1.3 Application of Advanced Packaging  1.3.1 Application 1  1.3.2 Application 2  1.3.3 Application 3  1.4 Advanced Packaging Market by Regions  1.4.1 United States Status and Prospect (2011-2021)  1.4.2 China Status and Prospect (2011-2021)  1.4.3 Europe Status and Prospect (2011-2021)  1.4.4 Japan Status and Prospect (2011-2021)  1.5 Global Market Size (Value and Volume) of Advanced Packaging (2011-2021)  1.5.1 Global Advanced Packaging Sales and Growth Rate (2011-2021)  1.5.2 Global Advanced Packaging Revenue and Growth Rate (2011-2021) 2 Global Advanced Packaging Competition by Manufacturers, Type and Application  2.1 Global Advanced Packaging Market Competition by Manufacturers  2.1.1 Global Advanced Packaging Sales and Market Share of Key Manufacturers (2011-2016)  2.1.2 Global Advanced Packaging Revenue and Share by Manufacturers (2011-2016)  2.2 Global Advanced Packaging (Volume and Value) by Type  2.2.1 Global Advanced Packaging Sales and Market Share by Type (2011-2016)  2.2.2 Global Advanced Packaging Revenue and Market Share by Type (2011-2016) Figure Picture of Advanced Packaging  Table Classification of Advanced Packaging  Figure Global Sales Market Share of Advanced Packaging by Type in 2015  Figure Type I Picture  Figure Type II Picture  Table Applications of Advanced Packaging  Figure Global Sales Market Share of Advanced Packaging by Application in 2015  Figure Application 1 Examples  Figure Application 2 Examples  Figure United States Advanced Packaging Revenue and Growth Rate (2011-2021)  Figure China Advanced Packaging Revenue and Growth Rate (2011-2021)  Figure Europe Advanced Packaging Revenue and Growth Rate (2011-2021)  Figure Japan Advanced Packaging Revenue and Growth Rate (2011-2021)  Figure Global Advanced Packaging Sales and Growth Rate (2011-2021)  Figure Global Advanced Packaging Revenue and Growth Rate (2011-2021)  Table Global Advanced Packaging Sales of Key Manufacturers (2011-2016)  Table Global Advanced Packaging Sales Share by Manufacturers (2011-2016)  Figure 2015 Advanced Packaging Sales Share by Manufacturers  Figure 2016 Advanced Packaging Sales Share by Manufacturers  Table Global Advanced Packaging Revenue by Manufacturers (2011-2016)  Table Global Advanced Packaging Revenue Share by Manufacturers (2011-2016)  Table 2015 Global Advanced Packaging Revenue Share by Manufacturers  Table 2016 Global Advanced Packaging Revenue Share by Manufacturers  Table Global Advanced Packaging Sales and Market Share by Type (2011-2016)  Table Global Advanced Packaging Sales Share by Type (2011-2016)  Figure Sales Market Share of Advanced Packaging by Type (2011-2016)  Figure Global Advanced Packaging Sales Growth Rate by Type (2011-2016)  Table Global Advanced Packaging Revenue and Market Share by Type (2011-2016) FOR ANY QUERY, REACH US @ https://www.wiseguyreports.com/enquiry/736131-global-advanced-packaging-sales-market-report-2016


News Article | November 18, 2016
Site: www.prnewswire.com

TAIPEI, Taiwan, Nov. 18, 2016 /PRNewswire/ -- Advanced Semiconductor Engineering, Inc. ( TWSE code: 2311, NYSE code: ASX; "ASE") and Siliconware Precision Industries Co., Ltd. (TWSE code: 2325, NASDAQ code: SPIL; "SPIL") jointly announced today that on November 16, 2016, the Taiwan Fair...


News Article | November 18, 2016
Site: en.prnasia.com

TAIPEI, Taiwan, Nov 18, 2016 /PRNewswire/ -- Advanced Semiconductor Engineering, Inc. ( TWSE code: 2311, NYSE code: ASX; "ASE") and Siliconware Precision Industries Co., Ltd. (TWSE code: 2325, NASDAQ code: SPIL; "SPIL") jointly announced today that on November 16, 2016, the Taiwan Fair Trade Commission (the "TFTC") resolved to give clearance to the notification submitted by ASE on July 29, 2016, in respect of the merger participated by ASE and SPIL as well as a new holding company established through share exchange (the "Share Exchange") between the two companies based on the joint share exchange agreement between ASE and SPIL dated June 30, 2016 (the "Joint Share Exchange"). ASE and SPIL respectfully agree with the TFTC's press release, which indicates, among other things, that "the overall economic benefits outweigh the disadvantages resulting from competition restrictions from the Share Exchange", "most of the respondents think the dual-brand independent operation model will reduce the impacts of adjusting the price", "the Share Exchange has not caused obvious restrictive effects on competition in the global semiconductor packaging and testing market" and "the Share Exchange will also stimulate the development of technology for related industry supply chain." ASE and SPIL firmly believe the completion of the Share Exchange will help improve their strategic position and create new opportunities for the future development and sustainable operations of the semiconductor industry, and will allow both companies to provide customers with better-quality, more efficient and wider -spectrum of packaging and testing services. According to the Joint Share Exchange Agreement, the Share Exchange is subject to approval, consent or a decision not to prohibit the transaction by the antitrust law enforcement authorities of relevant countries or regions and approval by the shareholders' meetings of each of ASE and SPIL. ASE and SPIL will continue to obtain necessary approvals for the Share Exchange in accordance with the Joint Share Exchange Agreement and relevant laws and regulations. This press release contains "forward-looking statements" within the meaning of Section 27A of the United States Securities Act of 1933, as amended, and Section 21E of the United States Securities Exchange Act of 1934, as amended, including statements regarding ASE's or HoldCo's future results of operations and business prospects. Although these forward-looking statements, which may include statements regarding ASE's or HoldCo's (if established) future results of operations, financial condition or business prospects, are based on ASE's or HoldCo's (if established) own information and information from other sources we believe to be reliable, you should not place undue reliance on these forward-looking statements, which apply only as of the date of this press release. The words "anticipate," "believe," "estimate," "expect," "intend," "plan" and similar expressions, as they relate to ASE or HoldCo (if established), are intended to identify these forward-looking statements in this press release. These statements discuss future expectations, identify strategies, contain projections of results of operations of ASE's or HoldCo's (if established) financial condition, or state other forward-looking information. Known and unknown risks, uncertainties and other factors could cause the actual results to differ materially from those contained in any forward-looking statement. ASE cannot promise that its expectations expressed in these forward-looking statements will turn out to be correct. ASE's or HoldCo's (if established) actual results could be materially different from and worse than those expectations. For a discussion of important risks and factors that could cause ASE's or HoldCo's (if established) actual results to be materially different from its expectations, please see the documents we file from time to time with the U.S. Securities and Exchange Commission ("U.S. SEC"), including ASE's 2015 Annual Report on Form 20-F filed on April 29, 2016. This press release is not an offering of securities for sale in any jurisdiction: ASE may file a registration statement on Form F-4 with the U.S. SEC in connection with the proposed Joint Share Exchange. The Form F-4 (if filed) will contain a prospectus and other documents. The Form F-4 (if filed) and prospectus, as they may be amended from time to time, will contain important information about ASE, SPIL, the Joint Share Exchange and related matters. U.S. shareholders of ASE are urged to read the Form F-4 (if filed), the prospectus and the other documents, as they may be amended from time to time, that may be filed with the U.S. SEC in connection with the Joint Share Exchange carefully before they make any decision at any shareholders' meeting of ASE with respect to the Joint Share Exchange. The Form F-4 (if filed), the prospectus and all other documents filed with the U.S. SEC in connection with the Joint Share Exchange will be available when filed, free of charge, on the U.S. SEC's website at www.sec.gov . In addition, the Form F-4 (if filed), the prospectus and all other documents filed with the U.S. SEC in connection with the Joint Share Exchange will be made available, free of charge, to U.S. shareholders of ASE who make a written request to ir@aseglobal.com. To view the original version on PR Newswire, visit:http://www.prnewswire.com/news-releases/joint-announcement-by-ase-and-spil-300365817.html


MarketStudyReport.com adds “2017-2022 Global Top Countries Advanced Packaging Market Report” new report to its research database. The report spread across 113 pages with table and figures in it. This report studies Advanced Packaging in Global market, especially in United States, Canada, Mexico, Germany, France, UK, Italy, Russia, China, Japan, India, Korea, Southeast Asia, Australia, Brazil, Middle East and Africa, focuses on the top Manufacturers in each country, covering Browse full table of contents and data tables at https://www.marketstudyreport.com/reports/2017-2022-global-top-countries-advanced-packaging-market-report/ Market Segment by Countries, this report splits Global into several key Countries, with sales, revenue, market share of top 5 players in these Countries, from 2012 to 2017 (forecast), like Split by Product Types, with sales, revenue, price, market share of each type, can be divided into Split by applications, this report focuses on sales, market share and growth rate of Advanced Packaging in each application, can be divided into 4 Global Advanced Packaging Manufacturers Profiles/Analysis 4.1 ASE 4.1.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors 4.1.2 Advanced Packaging Product Types, Application and Specification 4.1.3 ASE Advanced Packaging Sales, Revenue, Price and Gross Margin (2015 and 2016) 4.1.4 Main Business/Business Overview 4.1.5 ASE News 4.2 Amkor 4.2.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors 4.2.2 Advanced Packaging Product Types, Application and Specification 4.2.3 Amkor Advanced Packaging Sales, Revenue, Price and Gross Margin (2012-2017) 4.2.4 Main Business/Business Overview 4.2.5 Amkor News 4.3 SPIL 4.3.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors 4.3.2 Advanced Packaging Product Types, Application and Specification 4.3.3 SPIL Advanced Packaging Sales, Revenue, Price and Gross Margin (2012-2017) 4.3.4 Main Business/Business Overview 4.3.5 SPIL News 4.4 Stats Chippac 4.4.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors 4.4.2 Advanced Packaging Product Types, Application and Specification 4.4.3 Stats Chippac Advanced Packaging Sales, Revenue, Price and Gross Margin (2012-2017) 4.4.4 Main Business/Business Overview 4.4.5 Stats Chippac News 4.5 PTI 4.5.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors 4.5.2 Advanced Packaging Product Types, Application and Specification 4.5.3 PTI Advanced Packaging Sales, Revenue, Price and Gross Margin (2012-2017) 4.5.4 Main Business/Business Overview 4.5.5 PTI News 4.6 JCET 4.6.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors 4.6.2 Advanced Packaging Product Types, Application and Specification 4.6.3 JCET Advanced Packaging Sales, Revenue, Price and Gross Margin (2015 and 2016) 4.6.4 Main Business/Business Overview 4.6.5 JCET News 4.7 J-Devices 4.7.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors 4.7.2 Advanced Packaging Product Types, Application and Specification 4.7.3 J-Devices Advanced Packaging Sales, Revenue, Price and Gross Margin (2012-2017) 4.7.4 Main Business/Business Overview 4.7.5 J-Devices News 4.8 UTAC 4.8.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors 4.8.2 Advanced Packaging Product Types, Application and Specification 4.8.3 UTAC Advanced Packaging Sales, Revenue, Price and Gross Margin (2012-2017) 4.8.4 Main Business/Business Overview 4.8.5 UTAC News To receive personalized assistance write to us @ [email protected] with the report title in the subject line along with your questions or call us at +1 866-764-2150

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