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News Article | May 18, 2017
Site: www.PR.com

marcus evans: The Bridge Between Humans and Robots marcus evans Manufacturing Excellence forum has gathered the leading manufacturers from China and around the globe to bring innovation and collaboration to the industry to achieve real excellence. Delegates were exposed to the state-of-the-art automation, information and communication technologies in production methods for future adoption. Shanghai, China, May 18, 2017 --( Delegates delved into 8 case studies from various sectors and industries for the duration of the forum; 1) It’s All About Your People: Cultivating a Workforce that Embraces the Changes Industrial 4.0 Brings – How Ecolab Builds a High Performance Organisation (HPO); 2) Developing a Global Manufacturing Science & Techonology (MS&) Strategy for AstraZeneca; 3) Enabling Agile Manufacturing to Respond Quickly to Customer Demands and Market Changes whilst Balancing the Industrial Scale; 4) Are You on the Right Track to Manufacturing Excellence? Setting Smart Key Performance Indicators (KPIs) for Your Organisation; 5) Turning Marketplace Challenges into Advantages through Adopting Smart and Sustainable Automation Solutions – OPPLE Lighting’s Transformation Journey; 6) Enabling Lean Transformation in Your Organisation for Increased Overall Productivity and Profitability; 7) Building the Best in World through Application of Ford Production System: Increasing Manufacturing Flexibility to Reduce Downtime and Gain Better Control over Quality; and 8) Converting Data to Value via Manufacturing Science, Maximising Production Operation Efficiency and Turning Challenges and difficulties into opportunities. Delegates and speakers alike have the exclusive opportunity to network with top leading organisations within the manufacturing industry such as Foods Plastics Company, Hewlett-Packard, Semiconductor Manufacturing International Corporation (SMIC), AstraZeneca, Dongguan Hsu Fu Chi Food Co. Ltd. (Nestlé JV), Bristol-Myers Squibb, Ford Motor Company, Varian Medical Systems and many other influential organisations. How do organisations achieve optimal manufacturing excellence in today’s era? What is the reality check behind the employment of robotics in favour of factory workers? Solution provider, STAUFEN., a proud Silver Sponsor is prepared to aid organisations in achieving the best commercial outcomes. Shanghai, China, May 18, 2017 --( PR.com )-- The highly anticipated 2-day forum has finally been launched by distinguished Chairperson, Mr Sunil Chandiramani (Senior Director Global Business Operations in Consumer Ink Business, Hewlett-Packard, Singapore) at InterContinental Shanghai Pudong in China on the 11th of May.Delegates delved into 8 case studies from various sectors and industries for the duration of the forum; 1) It’s All About Your People: Cultivating a Workforce that Embraces the Changes Industrial 4.0 Brings – How Ecolab Builds a High Performance Organisation (HPO); 2) Developing a Global Manufacturing Science & Techonology (MS&) Strategy for AstraZeneca; 3) Enabling Agile Manufacturing to Respond Quickly to Customer Demands and Market Changes whilst Balancing the Industrial Scale; 4) Are You on the Right Track to Manufacturing Excellence? Setting Smart Key Performance Indicators (KPIs) for Your Organisation; 5) Turning Marketplace Challenges into Advantages through Adopting Smart and Sustainable Automation Solutions – OPPLE Lighting’s Transformation Journey; 6) Enabling Lean Transformation in Your Organisation for Increased Overall Productivity and Profitability; 7) Building the Best in World through Application of Ford Production System: Increasing Manufacturing Flexibility to Reduce Downtime and Gain Better Control over Quality; and 8) Converting Data to Value via Manufacturing Science, Maximising Production Operation Efficiency and Turning Challenges and difficulties into opportunities.Delegates and speakers alike have the exclusive opportunity to network with top leading organisations within the manufacturing industry such as Foods Plastics Company, Hewlett-Packard, Semiconductor Manufacturing International Corporation (SMIC), AstraZeneca, Dongguan Hsu Fu Chi Food Co. Ltd. (Nestlé JV), Bristol-Myers Squibb, Ford Motor Company, Varian Medical Systems and many other influential organisations.How do organisations achieve optimal manufacturing excellence in today’s era? What is the reality check behind the employment of robotics in favour of factory workers? Solution provider, STAUFEN., a proud Silver Sponsor is prepared to aid organisations in achieving the best commercial outcomes.


LONDON--(BUSINESS WIRE)--According to the latest market study released by Technavio, the global semiconductor assembly equipment market is projected to grow to USD 5.04 billion by 2021, at a CAGR of nearly 4% over the forecast period. This research report titled ‘Global Semiconductor Assembly Equipment Market 2017-2021’ provides an in-depth analysis of the market in terms of revenue and emerging market trends. This market research report also includes up to date analysis and forecasts for various market segments and all geographical regions. Semiconductor chip assembly is a key component of the semiconductor supply chain. It is a part of the back-end process of chip formation. The high demand for polymer adhesive wafer bonding equipment due to the increasing adoption of advanced packaging techniques is a key factor driving the growth of the semiconductor assembly equipment market. This report is available at a USD 1,000 discount for a limited time only: View market snapshot before purchasing Buy 1 Technavio report and get the second for 50% off. Buy 2 Technavio reports and get the third for free. Based on equipment type, the report categorizes the global semiconductor assembly equipment market into the following segments: The top three revenue-generating equipment segments in the global semiconductor assembly equipment market are discussed below: “Die bonding equipment dominated the semiconductor assembly equipment market, and is expected to be worth USD 1.26 billion by the end of 2017,” says Chetan Mohan, a lead analyst at Technavio for semiconductor equipment research. The growing demand for semiconductor devices and components will ensure a continuous requirement for die bonding equipment in the market. The growth in the applications of semiconductor chips in industries such as energy, power, medical, green cars, automobile, and robotics will impact the market segment. The global semiconductor assembly equipment market by inspection and dicing equipment is expected to grow at a moderate rate over the forecast period, driven by the need to produce reliable and efficient products. To ensure high-quality products, semiconductor device manufacturers must ensure the high quality of the base products, flawless processing techniques, and defect-free equipment. The analysis of bare substrates and inspection of intermediate products are crucial and necessary steps in the manufacturing process, which create the need for semiconductor inspection systems. “The packaging equipment segment is expected to grow faster than the other segment of the semiconductor assembly equipment market, driven by high capital investments from leading chip manufacturers, such as SK Hynix, Samsung, and SMIC,” says Chetan. The growing demand for compact ICs from the consumer electronics market, particularly from the mobile phone and PC markets, is expected to drive the semiconductor assembly equipment by the packaging segment on a decent growth trajectory during the forecast period. The expected size reductions in the market will draw in more investments towards R&D of new and advanced packaging technologies. The top vendors highlighted by Technavio’s research analysts in this report are: Become a Technavio Insights member and access all three of these reports for a fraction of their original cost. As a Technavio Insights member, you will have immediate access to new reports as they’re published in addition to all 6,000+ existing reports covering segments like computing devices, displays, and embedded systems. This subscription nets you thousands in savings, while staying connected to Technavio’s constant transforming research library, helping you make informed business decisions more efficiently. Technavio is a leading global technology research and advisory company. The company develops over 2000 pieces of research every year, covering more than 500 technologies across 80 countries. Technavio has about 300 analysts globally who specialize in customized consulting and business research assignments across the latest leading edge technologies. Technavio analysts employ primary as well as secondary research techniques to ascertain the size and vendor landscape in a range of markets. Analysts obtain information using a combination of bottom-up and top-down approaches, besides using in-house market modeling tools and proprietary databases. They corroborate this data with the data obtained from various market participants and stakeholders across the value chain, including vendors, service providers, distributors, resellers, and end-users. If you are interested in more information, please contact our media team at media@technavio.com.


FinFET is a 3D transistor and is integral for the design and development of processors. FinFET technology is a nonplanar, double gate transistor, built on a silicon on insulator substrate. FinFET is a 3D structure that has subdivided resistance and capacitance when compared to a planar structure. FinFETs have better device optimization in comparison with planar technology. The Global Finfet-Technology Market to grow at a CAGR of 41.89% during the period 2017-2021. The report covers the present scenario and the growth prospects of the global FinFET-technology market for 2017-2021. To calculate the market size, the report considers the sales of FinFET technology process node in different sizes across applications. The market is divided into the following segments based on geography: Global FinFET-Technology Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market. Market driver Strategic collaborations and M&A For a full, detailed list, view our report Market challenge Fluctuations in foreign currency exchange rate For a full, detailed list, view our report Market trend Innovation in channel materials for development of 10nm and beyond FinFET chips For a full, detailed list, view our report Key questions answered in this report What will the market size be in 2021 and what will the growth rate be? What are the key market trends? What is driving this market? What are the challenges to market growth? Who are the key vendors in this market space? What are the market opportunities and threats faced by the key vendors? What are the strengths and weaknesses of the key vendors? Companies Mentioned: Intel, TSMC, Samsung, GlobalFoundries, SMIC, and Qualcomm. Other Prominent Vendors in the market are: ARM Holdings, MediaTek, Xilinx, and UMC. For more information, please visit http://www.orbisresearch.com/reports/index/global-finfet-technology-market-2017-2021


News Article | June 13, 2017
Site: www.marketwired.com

SUNNYVALE, CA--(Marketwired - Jun 13, 2017) -  QuickLogic Corporation ( : QUIK), a developer of ultra-low power programmable sensor processing, embedded FPGA IP, display bridge and programmable logic solutions, today announced that it will be participating in several activities at the Design Automation Conference (DAC) in Austin, TX. The company will be exhibiting and demonstrating the performance of its newest ArcticPro™ eFPGA technology. The company's CTO, Dr. Tim Saxe, will participate in a panel discussion about low power and reliability. Additionally, QuickLogic will present on the game-changing benefits of the company's embedded Field Programmable Gate Array (eFPGA) IP initiative. Booth Demonstration When: Monday, June 19 - Wednesday, June 21, 10am - 6pm Where: QuickLogic booth number 2015 What: QuickLogic will demonstrate how its newest ArcticPro eFPGA technology is enabling developers to create SoC and ASIC platforms that can easily be tailored to serve multiple target applications. The company will also demonstrate how ultra-low power sensor fusion is implemented on an eFPGA to offload the CPU to maximize battery life and improve performance with standby current as low as 30uA and active power consumption of 125uA. Panel Who: Tim Saxe, QuickLogic's CTO Title: "Minimizing IC Power Consumption: Top Down or Bottom up Design Methodology. What is the Starting Point?" - http://www2.dac.com/events/eventdetails.aspx?id=223-9 When: Monday, June 19, 3:30pm - 5:00pm Where: Ballroom G Presentation Who: Mao Wang, eFPGA Product Marketing Director What: This presentation will outline the reasons why eFPGA IP is an ideal solution to address IoT and other fragmented markets. It's inherent post-fabrication flexibility delivers lower overall product costs, the ability to add or modify features and increase product differentiation. Where: SMIC Booth # 1713 For more information, conference program schedules and exhibit hours, please visit https://dac.com About QuickLogic QuickLogic Corporation ( : QUIK) enables OEMs to maximize battery life for highly differentiated, immersive user experiences with Smartphone, Wearable and IoT devices. QuickLogic delivers these benefits through industry leading ultra-low power customer programmable SoC semiconductor solutions, embedded software, and algorithms for always-on voice and sensor processing. The company's embedded FPGA initiative also enables SoC designers to easily implement post production changes, and increase revenue by providing hardware programmability to their end customers. For more information about QuickLogic, visit www.quicklogic.com. The QuickLogic logo and QuickLogic are registered trademarks of QuickLogic Corporation and ArcticPro is a trademark of QuickLogic. All other brands or trademarks are the property of their respective holders and should be treated as such.


News Article | June 5, 2017
Site: www.prnewswire.com

NEW YORK, June 5, 2017 /PRNewswire/ -- About FinFET-Technology FinFET is a 3D transistor and is integral for the design and development of processors. FinFET technology is a nonplanar, double gate transistor, built on a silicon on insulator substrate. FinFET is a 3D structure that has subdivided resistance and capacitance when compared to a planar structure. FinFETs have better device optimization in comparison with planar technology. Read the full report: http://www.reportlinker.com/p04933683/Global-FinFET-Technology-Market.html Technavio's analysts forecast the global FinFET-technology market to grow at a CAGR of 41.89% during the period 2017-2021. Covered in this report The report covers the present scenario and the growth prospects of the global FinFET-technology market for 2017-2021. To calculate the market size, the report considers the sales of FinFET technology process node in different sizes across applications. The market is divided into the following segments based on geography: • Americas • APAC • EMEA Technavio's report, Global FinFET-Technology Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market. Key vendors • Intel • TSMC • Samsung • GlobalFoundries • SMIC • Qualcomm Other prominent vendors • ARM Holdings • MediaTek • Xilinx • UMC Market driver • Strategic collaborations and M&A • For a full, detailed list, view our report Market challenge • Fluctuations in foreign currency exchange rate • For a full, detailed list, view our report Market trend • Innovation in channel materials for development of 10nm and beyond FinFET chips • For a full, detailed list, view our report Key questions answered in this report • What will the market size be in 2021 and what will the growth rate be? • What are the key market trends? • What is driving this market? • What are the challenges to market growth? • Who are the key vendors in this market space? • What are the market opportunities and threats faced by the key vendors? • What are the strengths and weaknesses of the key vendors? You can request one free hour of our analyst's time when you purchase this market report. Details are provided within the report. Read the full report: http://www.reportlinker.com/p04933683/Global-FinFET-Technology-Market.html About Reportlinker ReportLinker is an award-winning market research solution. Reportlinker finds and organizes the latest industry data so you get all the market research you need - instantly, in one place. http://www.reportlinker.com __________________________ Contact Clare: clare@reportlinker.com US: (339)-368-6001 Intl: +1 339-368-6001 To view the original version on PR Newswire, visit:http://www.prnewswire.com/news-releases/global-finfet-technology-market-2017-2021-300468993.html


SHANGHAI, May 10, 2017 /PRNewswire/ -- Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 0981.HK), China's largest and most advanced semiconductor foundry, today announces the appointment of Dr. Haijun Zhao as CEO replacing Dr. Tzu-Yin Chiu, who will continue to serve as Vice Chairman and Non-Executive Director of the Board and guide the Company's future strategic direction. In addition, Dr. Chiu will serve as a full-time advisor until June 30, 2017, working closely with Dr. Zhao to ensure a seamless transition of leadership responsibilities. Dr. Zhao joined SMIC in October 2010 and has moved quickly through the company's ranks. In April, 2013, he became Executive Vice President, Chief Operating Officer. In July, 2013, he also assumed the role of General Manager of SMNC, SMIC's joint venture in Beijing. Dr. Zhao received his B.S. and Ph.D. in Electronics Engineering from Tsinghua University, Beijing, and an MBA from the University of Chicago. He has more than 25 years of experience in semiconductor operations and technology development. Dr. Zhou Zixue, Chairman of the Board said, "We are pleased to have Dr. Zhao, as nominated by Dr. Chiu, as the Company's new CEO, to lead the Company forward. Also, I want to express my sincere appreciation to Dr. Chiu for his invaluable contributions to the Company. Dr. Chiu, in the past six years, has done an incredible job of turning around the Company, regaining the confidence of our stakeholders, and repositioning the Company as a leading player in the global foundry industry.  Due to personal family reasons, he has decided to step down at this time. SMIC will remain a global, professional and independent company. With the solid management team which Dr. Chiu has already put in place at SMIC, I am fully confident of the Company's future prospects." "It has been an honor to lead the team to transform SMIC over these past years," said Dr. Tzu-Yin Chiu. "The Board and I are confident that now is the right time to transition leadership responsibility, and Haijun is the right leader for SMIC's next chapter of growth. Since joining SMIC seven years ago, Haijun has been an invaluable leader and was a part of the executive team which brought about the transformation in these past few years. SMIC benefits from an outstanding management team with a diverse range of experienced leaders and thousands of dedicated employees. I would like to thank the Board and my SMIC colleagues for their support. I will continue to serve the Company as Vice-Chairman and Non-Executive Director on the Board and contribute to its continued growth and success." Dr. Haijun Zhao, SMIC CEO said, "I am greatly honored to have the opportunity to lead the SMIC team at this exciting moment in our history. I would like to thank Dr. Chiu for his guidance and mentorship, as well as the Board for their trust. I look forward to working with the Board and the management team as we continue to enhance our competitive position in the foundry markets.  As a global and independent foundry player, we are committed to deliver results benefitting our shareholders, customers and employees." Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981) is one of the leading semiconductor foundries in the world and the largest and most advanced foundry in mainland China. SMIC provides integrated circuit (IC) foundry and technology services on process nodes from 0.35 micron to 28 nanometers. Headquartered in Shanghai, China, SMIC has an international manufacturing and service base. In China, SMIC has a 300mm wafer fabrication facility (fab) and a 200mm mega-fab in Shanghai; a 300mm mega-fab and a majority-owned 300mm fab for advanced nodes in Beijing; 200mm fabs in Tianjin and Shenzhen; and a majority-owned joint-venture 300mm bumping facility in Jiangyin; additionally, in Italy SMIC has a majority-owned 200mm fab. SMIC also has marketing and customer service offices in the U.S., Europe, Japan, and Taiwan, and a representative office in Hong Kong. For more information, please visit www.smics.com. This document contains, in addition to historical information, "forward-looking statements" within the meaning of the "safe harbor" provisions of the U.S. Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on SMIC's current assumptions, expectations and projections about future events. SMIC uses words like "believe," "anticipate," "intend," "estimate," "expect," "project" and similar expressions to identify forward looking statements, although not all forward-looking statements contain these words. These forward-looking statements are necessarily estimates reflecting the best judgment of SMIC's senior management and involve significant risks, both known and unknown, uncertainties and other factors that may cause SMIC's actual performance, financial condition or results of operations to be materially different from those suggested by the forward-looking statements including, among others, risks associated with cyclicality and market conditions in the semiconductor industry, intense competition, timely wafer acceptance by SMIC's customers, timely introduction of new technologies, SMIC's ability to ramp new products into volume, supply and demand for semiconductor foundry services, industry overcapacity, shortages in equipment, components and raw materials, availability of manufacturing capacity, financial stability in end markets and intensive intellectual property litigation in high tech industry. In addition to the information contained in this document, you should also consider the information contained in our other filings with the SEC, including our annual report on Form 20-F filed with the SEC on April 27, 2017, especially in the "Risk Factors" section and such other documents that we may file with the SEC or SEHK from time to time, including on Form 6-K. Other unknown or unpredictable factors also could have material adverse effects on our future results, performance or achievements. In light of these risks, uncertainties, assumptions and factors, the forward-looking events discussed in this document may not occur. You are cautioned not to place undue reliance on these forward-looking statements, which speak only as of the date stated or, if no date is stated, as of the date of this document. SMIC has filed with the U.S. Securities and Exchange Commission its annual report on Form 20-F for the year ended December 31, 2016.  The annual report is available on our website at www.smics.com. In addition, all SMIC ADR holders have the ability, upon request, to receive a hard copy of our complete audited financials free of charge.


Dr. Zhou Zixue, Chairman of the Board said, "We are pleased to have Dr. Zhao, as nominated by Dr. Chiu, as the Company's new CEO, to lead the Company forward. Also, I want to express my sincere appreciation to Dr. Chiu for his invaluable contributions to the Company. Dr. Chiu, in the past six years, has done an incredible job of turning around the Company, regaining the confidence of our stakeholders, and repositioning the Company as a leading player in the global foundry industry.  Due to personal family reasons, he has decided to step down at this time. SMIC will remain a global, professional and independent company. With the solid management team which Dr. Chiu has already put in place at SMIC, I am fully confident of the Company's future prospects." "It has been an honor to lead the team to transform SMIC over these past years," said Dr. Tzu-Yin Chiu. "The Board and I are confident that now is the right time to transition leadership responsibility, and Haijun is the right leader for SMIC's next chapter of growth. Since joining SMIC seven years ago, Haijun has been an invaluable leader and was a part of the executive team which brought about the transformation in these past few years. SMIC benefits from an outstanding management team with a diverse range of experienced leaders and thousands of dedicated employees. I would like to thank the Board and my SMIC colleagues for their support. I will continue to serve the Company as Vice-Chairman and Non-Executive Director on the Board and contribute to its continued growth and success." Dr. Haijun Zhao, SMIC CEO said, "I am greatly honored to have the opportunity to lead the SMIC team at this exciting moment in our history. I would like to thank Dr. Chiu for his guidance and mentorship, as well as the Board for their trust. I look forward to working with the Board and the management team as we continue to enhance our competitive position in the foundry markets.  As a global and independent foundry player, we are committed to deliver results benefitting our shareholders, customers and employees." Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981) is one of the leading semiconductor foundries in the world and the largest and most advanced foundry in mainland China. SMIC provides integrated circuit (IC) foundry and technology services on process nodes from 0.35 micron to 28 nanometers. Headquartered in Shanghai, China, SMIC has an international manufacturing and service base. In China, SMIC has a 300mm wafer fabrication facility (fab) and a 200mm mega-fab in Shanghai; a 300mm mega-fab and a majority-owned 300mm fab for advanced nodes in Beijing; 200mm fabs in Tianjin and Shenzhen; and a majority-owned joint-venture 300mm bumping facility in Jiangyin; additionally, in Italy SMIC has a majority-owned 200mm fab. SMIC also has marketing and customer service offices in the U.S., Europe, Japan, and Taiwan, and a representative office in Hong Kong. For more information, please visit www.smics.com. This document contains, in addition to historical information, "forward-looking statements" within the meaning of the "safe harbor" provisions of the U.S. Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on SMIC's current assumptions, expectations and projections about future events. SMIC uses words like "believe," "anticipate," "intend," "estimate," "expect," "project" and similar expressions to identify forward looking statements, although not all forward-looking statements contain these words. These forward-looking statements are necessarily estimates reflecting the best judgment of SMIC's senior management and involve significant risks, both known and unknown, uncertainties and other factors that may cause SMIC's actual performance, financial condition or results of operations to be materially different from those suggested by the forward-looking statements including, among others, risks associated with cyclicality and market conditions in the semiconductor industry, intense competition, timely wafer acceptance by SMIC's customers, timely introduction of new technologies, SMIC's ability to ramp new products into volume, supply and demand for semiconductor foundry services, industry overcapacity, shortages in equipment, components and raw materials, availability of manufacturing capacity, financial stability in end markets and intensive intellectual property litigation in high tech industry. In addition to the information contained in this document, you should also consider the information contained in our other filings with the SEC, including our annual report on Form 20-F filed with the SEC on April 27, 2017, especially in the "Risk Factors" section and such other documents that we may file with the SEC or SEHK from time to time, including on Form 6-K. Other unknown or unpredictable factors also could have material adverse effects on our future results, performance or achievements. In light of these risks, uncertainties, assumptions and factors, the forward-looking events discussed in this document may not occur. You are cautioned not to place undue reliance on these forward-looking statements, which speak only as of the date stated or, if no date is stated, as of the date of this document. SMIC has filed with the U.S. Securities and Exchange Commission its annual report on Form 20-F for the year ended December 31, 2016.  The annual report is available on our website at www.smics.com. In addition, all SMIC ADR holders have the ability, upon request, to receive a hard copy of our complete audited financials free of charge. To view the original version on PR Newswire, visit:http://www.prnewswire.com/news-releases/smic-transitions-ceo-responsibility-to-dr-haijun-zhao-while-dr-tzu-yin-chiu-stays-as-vice-chairman-and-non-executive-director-300455071.html


News Article | May 10, 2017
Site: en.prnasia.com

All currency figures stated in this report are in US Dollars unless stated otherwise. The consolidated financial statements are prepared in accordance with International Financial Reporting Standards ("IFRS"). SHANGHAI, May 10, 2017 /PRNewswire/ -- Semiconductor Manufacturing International Corporation (NYSE: SMI; SEHK: 981) ("SMIC" or the "Company"), one of the leading semiconductor foundries in the world, today announced its consolidated results of operations for the three months ended March 31, 2017. The following statements are forward looking statements based on current expectations and involved risks and uncertainties, some of which are set forth under "Safe Harbor Statements" below. The Company expects: Dr. Haijun Zhao, SMIC's Chief Executive Officer, commented, "Our team delivered a good quarter with year-on-year growth, improved operating income, and strong EBITDA in Q1 2017. Revenue grew 25.0% year over year, representing a sequential decline of 2.7%. Operating profit grew 17.0% YoY and 57.9% QoQ. EBITDA was a record high of $312.4 million, an increase of 42.8% YoY and 13.9% QoQ and representing an EBITDA margin of 39.4%. In the first half of 2017, we are confronting the challenges of customer changes in market positioning, seasonal inventory adjustments, and overall muted handset market growth in China; however, we have actively pursued new incremental revenue from a variety of customers and markets to mitigate the impact of such headwinds. We believe we are in a great position, both strategically and financially to weather this cyclical downturn and are positioned to benefit from some exciting future trends, including automotive, industrial, internet of things, and others. Our 28nm is ramping up and reached 5.0% of wafer revenue in Q1, representing a growth of 39.0% QoQ. We continue to work with our customers on 28nm new tape outs for a diverse set of applications. 55nm wafer revenue sequentially grew 29.1% YoY and 9.1% QoQ. We continue to ramp 28nm, 55nm and numerous products on 8-inch; and from a device-perspective, we are pursuing growth in areas in which we are seeing meaningful demand such as NOR flash, RF/connectivity, Power IC, and others." For the complete version of SMIC's 2017 First Quarter results including financial tables, please see: http://www.smics.com/eng/investors/ir_filings.php Date: May 11, 2017 Time: 8:30 a.m. Shanghai time Dial-in numbers and pass code: The call will be webcast live with audio at http://www.smics.com/eng/investors/ir_presentations.php or http://edge.media-server.com/m/p/z3d2exzc. An archived version of the webcast, along with an electronic copy of this news release will be available on the SMIC website for a period of 12 months following the webcast. SMIC has filed with the U.S. Securities and Exchange Commission its annual report on Form 20-F for the year ended December 31, 2016. The annual report is available on our website at www.smics.com. In addition, all SMIC ADR holders have the ability, upon request, to receive a hard copy of our complete audited financials free of charge. Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981) is one of the leading semiconductor foundries in the world and the largest and most advanced foundry in mainland China. SMIC provides integrated circuit (IC) foundry and technology services on process nodes from 0.35 micron to 28 nanometer. Headquartered in Shanghai, China, SMIC has an international manufacturing and service base. In China, SMIC has a 300mm wafer fabrication facility (fab) and a 200mm fab in Shanghai; a 300mm fab and a majority-owned 300mm fab for advanced nodes in Beijing; 200mm fabs in Tianjin and Shenzhen; and a majority-owned joint-venture 300mm bumping facility in Jiangyin; additionally, in Italy SMIC has a majority-owned 200mm fab. SMIC also has marketing and customer service offices in the U.S., Europe, Japan, and Taiwan, and a representative office in Hong Kong. For more information, please visit www.smics.com. This press release contains, in addition to historical information, "forward-looking statements" within the meaning of the "safe harbor" provisions of the U.S. Private Securities Litigation Reform Act of 1995. These forward-looking statements, including statements under "Second Quarter 2017 Guidance", "CapEx Summary" and the statements contained in the quotes of our CEO are based on SMIC's current assumptions, expectations and projections about future events. SMIC uses words like "believe," "anticipate," "intend," "estimate," "expect," "project," "target" and similar expressions to identify forward looking statements, although not all forward-looking statements contain these words. These forward-looking statements are necessarily estimates reflecting the best judgment of SMIC's senior management and involve significant risks, both known and unknown, uncertainties and other factors that may cause SMIC's actual performance, financial condition or results of operations to be materially different from those suggested by the forward-looking statements including, among others, risks associated with cyclicality and market conditions in the semiconductor industry, intense competition in the semiconductor industry, SMIC's reliance on a small number of customers, timely wafer acceptance by SMIC's customers, timely introduction of new technologies, SMIC's ability to ramp new products into volume, supply and demand for semiconductor foundry services, industry overcapacity, shortages in equipment, components and raw materials, availability of manufacturing capacity, financial stability in end markets, orders or judgments from pending litigation, intensive intellectual property litigation in semiconductor industry, general economic conditions and fluctuations in currency exchange rates. In addition to the information contained in this press release, you should also consider the information contained in our other filings with the SEC, including our annual report on Form 20-F filed with the SEC on April 27, 2017, especially in the "Risk Factors" section and such other documents that we may file with the SEC or The Hong Kong Stock Exchange Limited ("SEHK") from time to time, including current reports on Form 6-K. Other unknown or unpredictable factors also could have material adverse effects on our future results, performance or achievements. In light of these risks, uncertainties, assumptions and factors, the forward-looking events discussed in this press release may not occur. You are cautioned not to place undue reliance on these forward-looking statements, which speak only as of the date stated or, if no date is stated, as of the date of this press release. Except as may be required by law, SMIC undertakes no obligation and does not intend to update any forward-looking statement, whether as a result of new information, future events or otherwise. To supplement SMIC's consolidated financial results presented in accordance with IFRS, SMIC uses in this press release non-GAAP measures of operating results that are adjusted to exclude finance cost, depreciation and amortization, income tax benefits and expenses, the effect of employee bonus accrual, government funding and gain from the disposal of living quarters. This earnings release also includes second quarter 2017 guidance for non-GAAP operating expenses. The presentation of non-GAAP financial measures is not intended to be considered in isolation or as a substitute for the financial information prepared and presented in accordance with IFRS. This earnings release includes EBITDA, EBITDA margin and non-GAAP operating expenses which consist of total operating expenses as adjusted to exclude the effect of employee bonus accrual, government funding and gain from the disposal of living quarters. These non-GAAP financial measures are not calculated or presented in accordance with, and are not alternatives or substitutes for financial measures prepared in accordance with IFRS, and should be read only in conjunction with the Group's financial measures prepared in accordance with IFRS. The Group's non-GAAP financial measures may be different from similarly-titled non-GAAP financial measures used by other companies. SMIC believes that use of these non-GAAP financial measures facilitates investors' and management's comparisons to SMIC's historical performance. The Group's management regularly uses these non-GAAP financial measures to understand, manage and evaluate the Group's business and make financial and operational decisions. The accompanying table has more information and reconciliations of each non-GAAP financial measure to its most directly comparable GAAP financial measure. A reconciliation of non-GAAP guidance measures to corresponding GAAP measures is not available on a forward-looking basis because the effect of these adjustment items excluded for the purpose of non-GAAP operating expenses guidance are subject to some unpredictable conditions that cannot be estimated with reasonable certainty.


News Article | May 10, 2017
Site: www.prnewswire.com

SHANGHAI, May 10, 2017 /PRNewswire/ -- Semiconductor Manufacturing International Corporation (NYSE: SMI; SEHK: 981) ("SMIC" or the "Company"), one of the leading semiconductor foundries in the world, today announced its consolidated results of operations for the three months ended March 31, 2017. The following statements are forward looking statements based on current expectations and involved risks and uncertainties, some of which are set forth under "Safe Harbor Statements" below. The Company expects: Dr. Haijun Zhao, SMIC's Chief Executive Officer, commented, "Our team delivered a good quarter with year-on-year growth, improved operating income, and strong EBITDA in Q1 2017. Revenue grew 25.0% year over year, representing a sequential decline of 2.7%. Operating profit grew 17.0% YoY and 57.9% QoQ. EBITDA was a record high of $312.4 million, an increase of 42.8% YoY and 13.9% QoQ and representing an EBITDA margin of 39.4%. In the first half of 2017, we are confronting the challenges of customer changes in market positioning, seasonal inventory adjustments, and overall muted handset market growth in China; however, we have actively pursued new incremental revenue from a variety of customers and markets to mitigate the impact of such headwinds. We believe we are in a great position, both strategically and financially to weather this cyclical downturn and are positioned to benefit from some exciting future trends, including automotive, industrial, internet of things, and others. Our 28nm is ramping up and reached 5.0% of wafer revenue in Q1, representing a growth of 39.0% QoQ. We continue to work with our customers on 28nm new tape outs for a diverse set of applications. 55nm wafer revenue sequentially grew 29.1% YoY and 9.1% QoQ. We continue to ramp 28nm, 55nm and numerous products on 8-inch; and from a device-perspective, we are pursuing growth in areas in which we are seeing meaningful demand such as NOR flash, RF/connectivity, Power IC, and others." For the complete version of SMIC's 2017 First Quarter results including financial tables, please see: http://www.smics.com/eng/investors/ir_filings.php Date: May 11, 2017 Time: 8:30 a.m. Shanghai time Dial-in numbers and pass code: The call will be webcast live with audio at http://www.smics.com/eng/investors/ir_presentations.php or http://edge.media-server.com/m/p/z3d2exzc. An archived version of the webcast, along with an electronic copy of this news release will be available on the SMIC website for a period of 12 months following the webcast. SMIC has filed with the U.S. Securities and Exchange Commission its annual report on Form 20-F for the year ended December 31, 2016. The annual report is available on our website at www.smics.com. In addition, all SMIC ADR holders have the ability, upon request, to receive a hard copy of our complete audited financials free of charge. Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981) is one of the leading semiconductor foundries in the world and the largest and most advanced foundry in mainland China. SMIC provides integrated circuit (IC) foundry and technology services on process nodes from 0.35 micron to 28 nanometer. Headquartered in Shanghai, China, SMIC has an international manufacturing and service base. In China, SMIC has a 300mm wafer fabrication facility (fab) and a 200mm fab in Shanghai; a 300mm fab and a majority-owned 300mm fab for advanced nodes in Beijing; 200mm fabs in Tianjin and Shenzhen; and a majority-owned joint-venture 300mm bumping facility in Jiangyin; additionally, in Italy SMIC has a majority-owned 200mm fab. SMIC also has marketing and customer service offices in the U.S., Europe, Japan, and Taiwan, and a representative office in Hong Kong. For more information, please visit www.smics.com. This press release contains, in addition to historical information, "forward-looking statements" within the meaning of the "safe harbor" provisions of the U.S. Private Securities Litigation Reform Act of 1995. These forward-looking statements, including statements under "Second Quarter 2017 Guidance", "CapEx Summary" and the statements contained in the quotes of our CEO are based on SMIC's current assumptions, expectations and projections about future events. SMIC uses words like "believe," "anticipate," "intend," "estimate," "expect," "project," "target" and similar expressions to identify forward looking statements, although not all forward-looking statements contain these words. These forward-looking statements are necessarily estimates reflecting the best judgment of SMIC's senior management and involve significant risks, both known and unknown, uncertainties and other factors that may cause SMIC's actual performance, financial condition or results of operations to be materially different from those suggested by the forward-looking statements including, among others, risks associated with cyclicality and market conditions in the semiconductor industry, intense competition in the semiconductor industry, SMIC's reliance on a small number of customers, timely wafer acceptance by SMIC's customers, timely introduction of new technologies, SMIC's ability to ramp new products into volume, supply and demand for semiconductor foundry services, industry overcapacity, shortages in equipment, components and raw materials, availability of manufacturing capacity, financial stability in end markets, orders or judgments from pending litigation, intensive intellectual property litigation in semiconductor industry, general economic conditions and fluctuations in currency exchange rates. In addition to the information contained in this press release, you should also consider the information contained in our other filings with the SEC, including our annual report on Form 20-F filed with the SEC on April 27, 2017, especially in the "Risk Factors" section and such other documents that we may file with the SEC or The Hong Kong Stock Exchange Limited ("SEHK") from time to time, including current reports on Form 6-K. Other unknown or unpredictable factors also could have material adverse effects on our future results, performance or achievements. In light of these risks, uncertainties, assumptions and factors, the forward-looking events discussed in this press release may not occur. You are cautioned not to place undue reliance on these forward-looking statements, which speak only as of the date stated or, if no date is stated, as of the date of this press release. Except as may be required by law, SMIC undertakes no obligation and does not intend to update any forward-looking statement, whether as a result of new information, future events or otherwise. To supplement SMIC's consolidated financial results presented in accordance with IFRS, SMIC uses in this press release non-GAAP measures of operating results that are adjusted to exclude finance cost, depreciation and amortization, income tax benefits and expenses, the effect of employee bonus accrual, government funding and gain from the disposal of living quarters. This earnings release also includes second quarter 2017 guidance for non-GAAP operating expenses. The presentation of non-GAAP financial measures is not intended to be considered in isolation or as a substitute for the financial information prepared and presented in accordance with IFRS. This earnings release includes EBITDA, EBITDA margin and non-GAAP operating expenses which consist of total operating expenses as adjusted to exclude the effect of employee bonus accrual, government funding and gain from the disposal of living quarters. These non-GAAP financial measures are not calculated or presented in accordance with, and are not alternatives or substitutes for financial measures prepared in accordance with IFRS, and should be read only in conjunction with the Group's financial measures prepared in accordance with IFRS. The Group's non-GAAP financial measures may be different from similarly-titled non-GAAP financial measures used by other companies. SMIC believes that use of these non-GAAP financial measures facilitates investors' and management's comparisons to SMIC's historical performance. The Group's management regularly uses these non-GAAP financial measures to understand, manage and evaluate the Group's business and make financial and operational decisions. The accompanying table has more information and reconciliations of each non-GAAP financial measure to its most directly comparable GAAP financial measure. A reconciliation of non-GAAP guidance measures to corresponding GAAP measures is not available on a forward-looking basis because the effect of these adjustment items excluded for the purpose of non-GAAP operating expenses guidance are subject to some unpredictable conditions that cannot be estimated with reasonable certainty. To view the original version on PR Newswire, visit:http://www.prnewswire.com/news-releases/smic-reports-2017-first-quarter-results-300455078.html


Patent
Smic | Date: 2015-11-06

The Safety Manhole Industrial Cover (SMIC) is a lightweight temporary safety manhole cover with a hinged access door made with aluminium or a strong nonferrous composite used when sewerage, storm water, water maintenance or inspections are required. It is a temporary self-ventilating design manhole grate to be used whenever the manhole cover is removed when operations are in progress around the manhole. The slots allow for natural light and airflow and it allows workers below ground to see through to the persons above; and vice versa. The safety manhole cover is designed to eliminate the risk of falling from heights regulations requirement whilst works are carried out near or over sewer openings by allowing the operators to walk freely above ground without having a harness to secure themselves.

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