Woburn, MA, United States
Woburn, MA, United States

Skyworks Solutions, Inc. is a semiconductor company headquartered in Woburn, Massachusetts.The company manufactures semiconductors for use in radio frequency and mobile communications systems. Its products include power amplifiers, front end modules and RF products for handsets and wireless infrastructure equipment. The Company's portfolio includes amplifiers, attenuators, circulators, demodulators, detectors, diodes, directional couplers, front-end modules, hybrids, infrastructure RF subsystems, isolators, lighting and display solutions, mixers, modulators, optocouplers, optoisolators, phase shifters, PLLsVCOs, power dividers/combiners, power management devices, receivers, switches and technical ceramics.During 2009 and 2010, Skyworks benefitted from industry moves towards higher-end mobile phones with multi-band communication, exiting fiscal year 2010 with revenue of $1,072 million. Although operating in a market dominated by big name companies, it doubled its share price in one year, and in March 2010 was tipped by the Forbes-owned Investopedia website as one of three "not-so-famous" stocks likely to give good capital returns in 2010.The company formed as a result of a merger of Alpha Industries and the wireless communications division of Conexant, which took effect on 26 June 2002. Headquartered in Woburn, Massachusetts, Skyworks has manufacturing facilities in Woburn, Newbury Park, California and Mexicali, Mexico and design centers in Irvine, California, Santa Rosa, California, Newbury Park, Woburn, Greensboro, North Carolina and Cedar Rapids, Iowa. The music video for The Postal Service's song "Such Great Heights" is set in the Newbury Park chip fabrication plant. According to its website, the company has design, engineering, manufacturing, marketing, sales and service facilities throughout North America, Europe, Japan and Asia.A Skyworks 2614B 315BB seem to be used in some hardware revisions of the PlayStation 4. Wikipedia.


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Embodiments disclosed herein include methods of modifying synthetic garnets used in RF applications to reduce or eliminate Yttrium or other rare earth metals in the garnets without adversely affecting the magnetic properties of the material. Some embodiments include substituting Bismuth for some of the Yttrium on the dodecahedral sites and introducing one or more high valency ions to the octahedral and tetrahedral sites. Calcium may also be added to the dodecahedral sites for valency compensation induced by the high valency ions, which could effectively displace all or most of the Yttrium (Y) in microwave device garnets. The modified synthetic garnets with substituted Yttrium (Y) can be used in various microwave magnetic devices such as circulators, isolators and resonators.


Patent
Skyworks Solutions | Date: 2016-11-16

Circuits and methods for controlling power amplifiers. In some embodiments, a power amplification system can include a first amplification stage configured to operate with a first bias signal, and a second amplification stage configured operate with a second bias signal. The power amplification system can further include a control circuit coupled to the first amplification stage and the second amplification stage. The control circuit can be configured to generate the first bias signal based on the second bias signal. Such a first bias signal can result in the first stage having a gain profile that compensates for either or both of a gain expansion and gain compression of the second amplification stage.


Provided herein are apparatus and methods for protecting radio frequency (RF) amplifiers from overdrive. In certain configurations, an RF amplification system includes a plurality of RF amplification stages including a first amplification stage and a second amplification stage subsequent to the first amplification stage in a signal path. The first amplification stage includes a first stage field-effect transistor (FET), and the second amplification stage includes a second stage FET and a gate-to-drain feedback circuit electrically connected between a gate and a drain of the second stage FET. The RF amplification system further includes an overdrive detection circuit that senses a drain current of the first stage FET to detect when an overdrive condition is present, and that decreases an impedance of the gate-to-drain feedback circuit in response to detection of the overdrive condition such that a gain of the second stage FET is reduced.


Patent
Skyworks Solutions | Date: 2016-11-10

A radio-frequency module includes a switching device having first and second switch arms and a common pole node connected to both the first and second switch arms, a first shunt arm connected to the first switch arm, and a first transmission line disposed in the first switch arm between the common pole node and the first shunt arm, the first transmission line being configured to present a substantially open circuit looking into the first switch arm from the common pole node at a fundamental frequency of a signal transmitting on the second switch arm when the first switch arm is in an OFF-state and the first shunt arm is in an ON-state


Patent
Skyworks Solutions | Date: 2016-11-23

A radio-frequency (RF) module includes a first transistor having a base, a collector, and an emitter, a radio-frequency output transmit path coupled to the collector of the first transistor at a first end and to a radio-frequency output port at a second end, and an output matching network disposed in the radio-frequency output transmit path, the output matching network including a shunt arm coupled to ground, the shunt arm including a switch that is controllable to modify an impedance of the output matching network.


Devices and methods related to packaging of radio-frequency (RF) devices on ceramic substrates. In some embodiments, a packaged electronic device can include a ceramic substrate configured to receive one or more components. The ceramic substrate can include a conductive layer in electrical contact with a ground plane. The packaged electronic device can further include a die having an integrated circuit and mounted on a surface of the ceramic substrate. The packaged electronic device can further include a conformal conductive coating implemented over the die to provide shielding functionality. The packaged electronic device can further include an electrical connection between the conformal conductive coating and the conductive layer.


Patent
Skyworks Solutions | Date: 2017-03-02

Apparatus and methods for envelope shaping in a mobile device are provided. In certain implementations, a mobile device includes an envelope tracker configured to control a voltage level of a power amplifier supply voltage based on a shaped envelope signal, a power amplifier configured to receive the power amplifier supply voltage and to provide amplification to a radio frequency signal, and a transceiver including a modulator configured to generate the radio frequency signal and an envelope shaping circuit configured to generate the shaped envelope signal by shaping an envelope of the radio frequency signal. The envelope shaping circuit includes a shaping table configured to maintain a substantially constant distortion in a transmit band of the mobile device across a range of the envelope of the radio frequency signal.


Patent
Skyworks Solutions | Date: 2017-02-28

In one implementation, a voltage boost assembly including a boost converter having a capacitive element arranged at an output, and an inductive element connectable to an electrical supply. The voltage boost assembly also includes a sensor assembly provided to generate a quick-start enable signal in response to detecting that an electrical condition relative to an electrical output of the boost converter has breached a first threshold. The voltage boost assembly further includes a quick-start module responsive to the quick-start enable signal, and configured to drive the boost converter at a relatively high duty-cycle and so that the boost converter delivers an output current that satisfies a second threshold in order to charge the capacitive element arranged at the output.


Patent
Skyworks Solutions | Date: 2017-02-09

Apparatus and methods for power amplifier biasing are disclosed herein. In certain implementations, a power amplifier system includes a power amplifier bias circuit and a power amplifier. The power amplifier bias circuit includes a reference current source that generates a reference current, a bipolar reference transistor, and a transimpedance amplifier that amplifies a difference between a collector current of the bipolar reference transistor and the reference current, and that provides a base bias voltage to a base of the bipolar reference transistor. The power amplifier generates a radio frequency output signal at an output based on amplifying a radio frequency input signal received at an input. The power amplifier includes a bipolar power amplifier transistor including a base biased by the base bias voltage such that the power amplifier has a substantially flat gain response versus time.


Patent
Skyworks Solutions | Date: 2017-02-09

Diversity modules for mobile devices are provided herein. In certain configurations, a diversity module includes a first antenna-side multi-throw switch, a second antenna-side multi-throw switch, a first transceiver-side multi-throw switch, a second transceiver-side multi-throw switch, a low band signal path between the first antenna-side multi-throw switch and the first transceiver-side multi-throw switch and configured to output a low band receive signal, a mid band signal path between the second antenna-side multi-throw switch and the second transceiver-side multi-throw switch and configured to output a mid band receive signal of higher frequency content than the low band receive signal, and a high band signal path between the second antenna-side multi-throw switch and the first transceiver-side multi-throw switch and configured to output a high band receive signal of higher frequency content than the mid band receive signal.

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