Singapore, Singapore
Singapore, Singapore

Time filter

Source Type

Yuan H.H.,Agency for Science, Technology and Research Singapore | Jaafar N.,Agency for Science, Technology and Research Singapore | Velez S.D.,Agency for Science, Technology and Research Singapore | Bum L.J.,Agency for Science, Technology and Research Singapore | And 2 more authors.
Proceedings of the Electronic Packaging Technology Conference, EPTC | Year: 2016

While leadframe has come a long way as a cost effective substrate, there is still limitation over its design rule. In this article, the authors have developed and put to test a SiC based PQFN using 70μm single metal layer substrates, allowing further miniaturization and complex design of PQFN. New high temperature EMC with a Tg of 241°C and lead free bismuth silver solder are adopted. Reliability tests and RDS,on results showed that the materials adopted in the development does not degrade the MOSFET's functionality and all samples passed reliability and power cycling tests. © 2015 IEEE.

Loading Linxens Singapore Pte Ltd collaborators
Loading Linxens Singapore Pte Ltd collaborators