Sun W.,Institute of Microelectronics, Singapore |
Sun T.,Institute of Microelectronics, Singapore |
Lim K.,Institute of Microelectronics, Singapore |
Ding M.,Institute of Microelectronics, Singapore |
And 4 more authors.
Proceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012 | Year: 2012
We report a simple yet effective approach to interconnect pairs of orthogonally aligned out-of-plane bond-pads that are separated at wide gaps of about 100 μm. The developed method can effectively bridge interconnections between a MEMS micromirror device chip (width × height × thickness: 1.9 × 2.2 × 0.5 mm) on a mini PCB bench (width × length × thickness: 1.6 × 12 × 0.4 mm) with just a few standard procedural steps. The measured average interconnection resistance is about 0.6 Ω. The packaged system is currently target for optical coherence tomography (OCT) applications and the concept can be applied to many other miniaturized medical device packaging situations that require orthogonally aligned out-of-plane interconnections. © 2012 IEEE. Source