SiliconFile Technologies Inc.

Gyeonggi Do, South Korea

SiliconFile Technologies Inc.

Gyeonggi Do, South Korea
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Patent
Siliconfile Technologies Inc. | Date: 2014-08-22

The present invention relates to an image sensor chip of which the efficiency such as sensitivity/quantum efficiency (QE) and the like can be improved by forming an antireflection film on a layer from which most reflection occurs in the image sensor chip, and image degradation can be additionally improved by preventing a ghost phenomenon and a flare phenomenon.


Patent
Siliconfile Technologies Inc. | Date: 2016-03-24

A 4-color image sensor may include a first unit pixel region having Gr, R, IR and B pixels on four divided regions; and a second unit pixel region having IR, R, Gb and B pixels on four divided regions, wherein the first unit pixel region and the second unit pixel regions are alternately arranged in a vertical direction and a horizontal direction, and the IR pixel is consecutively arranged along a diagonal line direction.


A 4-color pixel image sensor having a visible color noise reduction function in a near infrared ray (NIR) pixel may include an active pixel region having a plurality of photodiodes, a plurality of first metal layers, a plurality of color filters, a first NIR pixel and a micro-lens, which are stacked, wherein the plurality of photodiodes are arranged in series and the plurality of color filters are formed to be adjacent to each other in series; an NIR optical black pixel region having a plurality of photodiodes and a second NIR pixel, which are stacked, wherein the plurality of photodiodes are arranged in series; and a visible optical black pixel region having a plurality of photodiodes, a second metal layer, a plurality of color filters and a micro-lens, which are stacked, wherein the plurality of photodiodes are arranged in series, and the plurality of color filters are formed to be adjacent to each other in series, wherein the active pixel region, the NIR optical black pixel region and the visible optical black pixel region are arranged on a same substrate in series.


Patent
Siliconfile Technologies Inc. | Date: 2014-04-30

The present invention relates to a technology for simply performing a process of forming a pad on the rear surface of a via hole in a packing process in a process of forming a pad of a wafer. The present invention is characterized by a packing process in a process for manufacturing a wafer, the packing process comprising the steps of: attaching glass to the upper portion of a micro lens and then separating a handling wafer from an element wafer, thereby exposing metal layers formed on the element wafer to the outside; and forming pads for the metal layers.


A device for removing a noise on an image using a cross-kernel type median filter includes a target pixel determination unit configured to determine whether a target pixel is a noise or not; a peripheral pixel determination unit configured to determine degrees of the noise on a peripheral pixel information of a peripheral pixel of the target pixel; and a noise removing unit configured to remove the noise of the target pixel and corrects the image by applying a cross-kernel type median filter based on the peripheral pixel information.


Patent
Siliconfile Technologies Inc. | Date: 2014-11-27

The present invention provides an image processing package comprising: an image sensor for receiving an image of a subject, which is incident from the outside, in the form of light and converting the image of the subject into an image signal; and an image signal processor for processing the image signal which is output from the image sensor and reproducing the image of the subject, wherein the image processing package has a structure in which the image sensor is vertically stacked on the image signal processor.


Patent
Siliconfile Technologies Inc. | Date: 2014-05-12

A semiconductor memory is formed by stacking a plurality of substrates and memory cells on each substrate are connected by data dump lines. A switch may intervene between the memory cell and the data dump line. When data of each substrate is dumped by the data dump line, a problem of decrease in a speed and an increase in power consumption due to a parasitic component can be minimized. Further, a core circuit including the memory cell may be disposed on one substrate and a peripheral circuit unit may be disposed on the remaining substrates.


Patent
Siliconfile Technologies Inc. | Date: 2014-06-18

The present invention relates to an image sensor in which substrates are stacked, wherein a substrate-stacked image sensor according to the present invention is configured such that a first photodiode is formed on a first substrate, a second photodiode is formed on a second substrate, the two substrates are aligned with and bonded to each other to electrically couple the two photodiodes to each other, thereby forming a complete photodiode within one pixel.


Patent
SiliconFile Technologies Inc. | Date: 2014-09-02

Disclosed is a phase difference detection pixel using a microlens, which detects a phase difference without the loss of an input signal by modifying the shape of a microlens, which collects light incident into a photodiode, such that the light passes through only in a specific direction. In the phase difference detection pixel using a microlens, a signal reduction problem, which is a disadvantage of the existing phase difference detection pixel, is solved and a phase difference detection function is achieved in all areas of an image sensor. The phase difference detection pixel using a microlens is variously applied for distance measurement between objects or three-dimensional image capturing.


Patent
Siliconfile Technologies Inc. | Date: 2014-08-26

An image sensor cell is divided into two chips, and a capacitor for noise reduction is formed in a bottom wafer in correspondence with a unit pixel of a top wafer in a stack chip package image sensor having a coupling structure of the two chips, so that noise characteristics of the image sensor are improved. A stack chip package image sensor includes: a first semiconductor chip that includes a photodiode, a transmission transistor, and a first conductive pad and outputs image charge, which is output from the photodiode, through the first conductive pad; and a second semiconductor chip that includes a drive transistor, a selection transistor, a reset transistor, and a second conductive pad and supplies a corresponding pixel with an output voltage corresponding to the image charge received from the first semiconductor chip through the second conductive pad. The second semiconductor chip includes a capacitor for noise reduction.

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