SHT Smart High. - Technology AB
SHT Smart High. - Technology AB
SHT Smart High. - Technology AB | Date: 2014-04-24
There is provided a method for manufacturing a flexible film comprising carbon nanotube interconnects, the method comprising: providing a first substrate; forming and patterning a catalyst layer on the substrate; forming vertically aligned electrically conducting carbon nanotube bundles from the catalyst; providing a second substrate opposite the first substrate and in contact with the carbon nanotube bundles such that a gap is formed between the first and second substrates; providing a flowing curable polymer in the gap between the first substrate and the second substrate such that the gap is filled by the polymer; curing the polymer to form a flexible solid; and removing the first substrate and the second substrate to provide a flexible polymer film comprising carbon nanotube interconnects connectable on respective sides of the film.
Agency: European Commission | Branch: FP7 | Program: CP | Phase: ICT-2011.3.1 | Award Amount: 6.25M | Year: 2012
From the strategic agendas of ENIAC,EPoSS and ITRS it is evident that wirelessapplications are gaining more and more importance that results to new requirements in terms of miniaturization and increased complexity.The limitations of Moores Law in term of physics but also in terms of manufacturability, flexibility and multi-functionality has motivated research and development to implement new technologiesand new wireless architectures identified as Beyond CMOS and More than Moore.Carbon nanotubes are featuring very attractive intrinsic multi-physic properties. These properties coupled with CMOS compatibility offer promise for a new generation of smart miniaturised systems for wireless communications.Graphene also exhibits impressive electrical and mechanical properties.CMOS compatible microwave graphene devices, still at their infancy, hold promise for extremely low noise and high speed communications.The coordinator (TRT) is one of the major world players in civilian & professional electronics.TAS is N1in Europe and N3 worldwide for civil and military aerospace products. One key area for their products is T/R front-end systems for applications like radars for which long term solutions are continuously sought after.The main concept of NANO-RF is the development of CNT&graphene based advanced component technologies for the implementation of miniaturised electronic systems for 2020 and beyond wirelesscommunications and radars.The major objectives of NANO-RF are the development of: Active components from CNTs&graphene Passive components from CNTs& grapheneCapacitive RF NEMS from CNTsCNTs based vertical interconnectsCNTs & graphene based ICsThe developed components and technologies will be implemented in the following demonstratorsReflect array antennae for wake vortex and weather radars and Graphene receiver moduleThe demonstrators will exhibit the reconfigurability, systemability, integratability and manufacturability of thedevelopedtechnologies and unify advanced
Agency: European Commission | Branch: FP7 | Program: CP | Phase: ICT-2011.3.2 | Award Amount: 9.71M | Year: 2011
RF communication and remote sensing (radar/radiometric) systems are facing the demands ofincreasing complexity/number of frequency bands, increased bandwidths and higher frequencies forhigher data throughput, while at the same time the power consumption, the form factor of the systems,and the overall system costs need to be reduced. Smart micro-/mm-wave systems will have to achieveself-reconfigurable operations for real-time efficient self-optimization of their performance. For suchadaptive systems, high-performance tuning components and strategies for buildingmonolithically integrated miniaturised reconfigurable RF circuits/front-ends are highly needed.The NANOTEC project aims to generate innovative approaches towards novel RF/mm-wave systemswith increased functionality and potentially lower cost addressing future needs of European industry.NANOTEC will develop 3 Demonstrators (1: 10-24 GHz reflect arrays for aerospace, 2: 94 GHz highsensitivity front-ends for passive imaging and 3: 140 GHz radar front-ends for active imaging) with advanced functionalities based on enabling technologies and via monolithic integration of highperformance RF-MEMS switches in GaN/SiGe IC foundry processes. NANOTEC will aim toimprove reliability of RF-MEMS by using NANO structured materials and to demonstrate addedvalueby employing the proposed GaN/SiGe MEMS-ICs for 10-140 GHz applications. Theemergence of European sources (SiGe/GaN MEMS-IC foundries) will play a key role towardsincreasing the availability of RF-MEMS TEChnology and related products (thus shortening the timeto-market). If successful, NANOTEC will also lead to improved safety/security thus creating novel business opportunities/jobs for existing/new companies in Europe. The NANOTEC consortiumconsists of 17 partners (7 countries) including European stakeholders in the field of communications,avionics, space and security.
Agency: European Commission | Branch: FP7 | Program: CP-FP | Phase: NMP-2008-2.1-2;NMP-2008-2.5-2 | Award Amount: 3.47M | Year: 2010
To overcome the difficulties in the contemporary thermal management of Si components and packages made of ceramics and organic laminates, in this project we propose novel and scaleable cooling technologies that utilize carbon nanotubes and their architectures integrated on various electrical components to achieve cooling efficiency of 100 W/m2 on large area Si chips, 10 W/cm2 on ceramics/polymer packages and 1 kW/cm2 on micro hot spots. Our efforts in the project are focused on generating specifically tailored nanostructured carbon based materials that are crucial for the successful development of new thermal management technologies in current and future electronics. The technologies we are developing will enable direct integration of carbon nanotube architectures in electrical components and make a feasible protocol for upscaling for industrial use. As carbon nanotubes will be directly grown (and in some cases post-mounted) on Si chips/wafers and ceramic/plastic packages the process will be made compatible with conventional Si fabrication and micromodule packaging technologies, i.e. the technology would provide a ready protocol for large scale production of such components. Because of the compatibility with current technologies, the nanotube based cooling devices and production technologies will be cost effective and easy to commercialize. Since thermal management is the most crucial issue in todays high performance electrical devices (processors, power transistors) the market potential of our innovation is enormous exceeding several billion total sales every year.
Agency: European Commission | Branch: FP7 | Program: CP | Phase: ICT-2011.3.2 | Award Amount: 7.37M | Year: 2011
For industrial motor-drive, UPS and solar inverters applications and aerospace or telecom RF applications, new emerging power semiconductor technologies, respectively SiC and GaN, have demonstrated their higher performances than the actual technologies (Si and GaAs) in terms of reduction of losses, increase of efficiency and power handling. But to increase the efficiency of the power modules and in the same time reduce their size and make them more cost effective, these SiC and GaN technologies still have to be associated with new efficient cooling and packaging solutions. The goal of SMARTPOWER is to carry out the packaging and thermal management developments required to achieve the efficient and cost-effective implementation of SiC- and GaN-based power modules respectively into industrial power inverters and RF transmitters systems. This main objective is supported in the project by two routes of research:\n- The developments of key enabling technologies required to the integration of the power modules into viable systems: efficient and reliable thermal interface materials and electrical interconnect, highly efficient thermoelectric modules andintegrated temperature sensor.\n- The development of new 3D packaging techniques and the associated thermal architectures that will allow to integrate the core chips, together with the enabling technologies, in a viable and cost effective manner.\nThe RTD developments will be demonstrated into the realisation of two high power modules: (i) SiC-based inverter for UPS, solar and motor-drive applications (ii) GaN-based RF transmitter for aerospace and telecom applications. The SMARTPOWER consortium (15 partners from 7 European States) gathers all the competences required to achieve these objectives. It is well balanced and involves all the supply chain partners in order to anticipate the cost-effective introduction of these new technologies and future products on the market.
Agency: European Commission | Branch: FP7 | Program: CP | Phase: ICT-2011.3.1 | Award Amount: 9.51M | Year: 2012
Future electronic power devices and packages will need to demonstrate more performance and functionality at reduced cost, size, weight, energy consumption and thermal budget. Further, increasing reliability demands have also to be met by industry to be competitive in this growing multi-billion Euro market of heterogeneously integrated systems.To respond to these challenges, new innovative nano- and micro-technologies and materials, both of which are key enablers for advanced thermal and mechanical interfaces, have to be developed and compatibly integrated to obtain higher electrical, thermal and reliability performance under harsh environmental conditions.Nanotherms objective is to take up these challenges in design, technology and test:Novel approaches to thermal technologies with superior electrical, thermal and thermo-mechanical properties will be developed in the project and demonstrated on automotive, avionics, solid-state lighting and industrial applications. Parallel routes will be followed addressing nano-sinter-adhesive bonding, phonon-coupled VACNT joining, nano-functionalised nano-filled adhesive die attach and graphene-enhanced surfaces. The main principle common to all technologies is the exploitation of nano-effects to obtain outstanding interconnect properties by especially developed processes.In parallel, a multi-scale and multi-domain modelling framework will furnish guidelines for materials design by various approaches from ab-inito up to continuum modelling and verified by corresponding experimental techniques.The consortium, composed of 18 partners from industry, SME and academia out of 8 European countries, embodies the necessary excellence and interdisciplinarity to address these tasks successfully. We are convinced that Nanotherms results will enable the next generation of heterogeneously integrated power packages, cut down thermal interface resistance at least by 50% and impact also on other power system-in-package configurations.
Agency: European Commission | Branch: H2020 | Program: IA | Phase: FTIPilot-1-2015 | Award Amount: 3.97M | Year: 2016
The global economy is benefiting from the fast evolution of the semiconductor industry. The primary driving force of the semiconductor industry is the increasing integration density, which has lead not only to higher transistor density but also to increasing power density. Power density is expected to increase up to 135 W/cm2 in 2024 for single chip packages. This puts significant stress on thermal management technology. Obviously, there is a need for improved thermal management within the field, and innovative TIMs constitutes a key component in reaching this goal. TIMs with dispersion of CNTs in polymer matrices for improved thermal conductivity have been reported. However, the thermal conductivity in these composites is insufficient and fundamental limitations stem from the huge interfacial contact resistance between the CNTs and the contact resistance between the CNT ends and target surfaces. Therefore, SMARTHERM project is initiated aiming to build up a pilot production line for high-performance TIMs based on functionalized CNTs. The utilization of vertically aligned CNT structure eliminated the CNT-CNT contacts along the heat transfer path and the functionalization at the CNT ends dramatically decreased the contact resistance. The main outcomes of the SMARTHERM project are two types of CNT based TIMs manufactured in a roll-to-roll manner which allows large scale production at industrial level. The TIMs will be demonstrated by two demonstrators proposed by TRT. The consortium consists of 5 partners from 3 European countries and integrates competence from 2 big companies, 2 SMEs and 1 university. TRT and SHT have been funded by the FP7 framework programme NANOPACK and SMARTPOWER, in which SHT and TRT have obtained great amount of knowledge on CNT based TIMs. Therefore, SMARTHERM project will make use of the previous research results and push the material a big leap forward to the market.
SHT Smart High. - Technology AB | Date: 2014-04-17
A method for autocatalytic plating of nanoparticles on a carbon nanomaterial, the method including: providing a nanomaterial in a solution including an oxidizing agent, the solution being maintained within a first temperature range and stirring the solution for a first predetermined time period; heating the solution to reach a second temperature range, higher than the first temperature range, and stirring the solution for a second predetermined time period, shorter than the first time period, while maintaining the solution within the second temperature range; filtering and rinsing the nanomaterial; dispersing the nanomaterial in an aqueous solution including a sensitizing agent; immersing the nanomaterial in a mixture including seed particles adhering to the nanomaterial; collecting the nanomaterial; plating the nanomaterial by immersing in a plating solution including an aqueous metal source and a first aqueous reducing agent such that a metallic layer is grown on the nanomaterial from the seed particles.
Agency: GTR | Branch: Innovate UK | Program: | Phase: Innovation Voucher | Award Amount: 5.00K | Year: 2013
In this project we will evaluate the performance of a biodegradable synthetic polymer, as an alternative growth medium for plant tissue culture. This will help in our quest to realise the benefits of the polymer in additional horticultural applications and access to new UK and international Markets.
Agency: GTR | Branch: Innovate UK | Program: | Phase: Feasibility Study | Award Amount: 25.00K | Year: 2012
Smart tech are currently involved in cutting edge technologies in the efficient growing of crops. These efficiencies are mostly concerned with simplifying the growing systems, the setting up of the said systems, maintenance cost and skills required to grow specific crops. By performing these tasks correctly, growing crops efficiently with less pollution will become more available to a wider range of customers in a wider range of sites, some of which sites cannot be accessed by conventional means. By achieving these goals future food supplies will be more efficient and more adaptable to changes in the food growing industries. The technologies involved will be the monitoring and control of the efficient delivery of water and feeding to various crops in differing growing conditions, using with simpler monitoring and control mechanisms, specifically ones that do not require electricity to power them. Also more advanced growing media, media that can be reused many times, is easier to transport and increases the crop yields. (1,039). Developing World The reliance of electricity in current based systems is also severely limiting in the places that would allow. Many third world customers who should be growing crops are not. due to the considerable saving to be made especially in water currently cannot, this is due to the lack of a reliable 24/7 power supply. If they had access to a non-electric powered system they could grow food, fodder and cash crop, this could substantially improve their standards of living. “The only resource that does not have a substitute is water”.