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Patent
SHINKO Electrical INDUSTRIES CO. | Date: 2015-06-09

A wiring substrate includes a first wiring layer including a first wiring part having a first wiring interval and a second wiring part having a second wiring interval wider than the first wiring interval, a metal plane layer formed on a portion of a first insulation layer formed on the first wiring layer, the first wiring part being located below the portion, a second insulation layer formed on the first insulation layer and the metal plane layer and having a first via hole and a second via hole, a second wiring layer formed on the second insulation layer and connected to the first wiring layer via a first via conductor formed in the first via hole, and a third wiring layer formed on the second insulation layer and connected to the metal plane layer via a second via conductor formed in the second via hole.


Patent
SHINKO Electrical INDUSTRIES CO. | Date: 2015-04-10

A photovoltaic cell mounting substrate includes a substrate; and a plurality of grooves provided at one surface of the photovoltaic cell mounting substrate, the plurality of grooves including a first groove and a second groove that is placed at a circumferential side of the first groove, at the one surface of the substrate, the second groove being formed deeper than the first groove, with respect to the one surface of the substrate.


Patent
Shinko Electrical Industries Co. | Date: 2015-04-17

A wiring substrate includes a heat sink, an insulation layer, first and second wiring layers, first and second through wirings, and first and second pads. The insulation layer is arranged on the heat sink with an adhesive layer located in between. The insulation layer includes first and second through holes. The first and second wiring layers are arranged on a surface of the insulation layer in contact with the adhesive layer. The first and second wiring layers are embedded in the adhesive layer. The first through wiring formed in the first through hole is connected to the first wiring layer and thermally coupled to the semiconductor device. The second through wiring formed in the first through hole is connected to the second wiring layer and electrically connected to the semiconductor device. The pads cover exposed surfaces of the through wirings.


Patent
SHINKO Electrical INDUSTRIES CO. | Date: 2015-05-21

An electrostatic chuck includes a base plate including a penetration hole, a cylindrical insulating component inserted in the penetration hole, the cylindrical insulating component including a protruding portion protruding from an upper end of the penetration hole, a placing table arranged on the base plate, a dent portion formed in a lower face of the placing table, the dent portion in which the protruding portion of the cylindrical insulating component is fitted, a concave portion formed in the dent portion of the placing table, an electrode formed in the concave portion of the placing table, and a power feeding terminal arranged in an inner part of the cylindrical insulating component, the power feeding terminal connected to the electrode.


Patent
SHINKO Electrical INDUSTRIES CO. | Date: 2015-09-30

A semiconductor device includes a wiring substrate, a lower magnetic shield member, a semiconductor chip, and an upper magnetic shield member. The lower magnetic shield member is provided on the wiring substrate. The semiconductor chip is provided on the lower magnetic shield member. The semiconductor chip includes a magnetic memory element. The upper magnetic shield member is provided over the semiconductor chip. The semiconductor chip is disposed between the upper magnetic shield member and the lower magnetic shield member. The lower magnetic shield member and the upper magnetic shield member are in direct contact with each other.

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