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Patent
Nihon Kohden and Shinko Electrical Industries Co. | Date: 2016-07-26

A sensor includes: a base layer; first and second conduction paths supported by the base layer; a first adhesive layer covering a first portion of the first conduction path; a second adhesive layer covering the second conduction path; an insulation sheet including: a first protecting portion covering the second adhesive laver; a second protecting portion disposed between a second portion of the first conduction path, and a part of the second conduction path; and a third protecting portion covering the first adhesive layer; a detecting section; a wireless transmitter; and a power source. When the insulation sheet is peeled off, the second portion of the first conduction path, and the part of the second conduction path are caused to be in contact with each other, and an electric power is supplied from the power source to the detecting section and the wireless transmitter.


Patent
SHINKO Electrical INDUSTRIES CO. | Date: 2016-08-25

An electronic component device includes: a lower wiring substrate; an electronic component on the lower wiring substrate; an upper wiring substrate disposed above the lower wiring substrate and the electronic component; a bump conductor disposed between the lower wiring substrate and the upper wiring substrate to electrically connect the lower wiring substrate and the upper wiring substrate; and a sealing resin provided between the lower wiring substrate and the upper wiring substrate to seal the electronic component and the bump conductor. The upper wiring substrate includes: a first wiring layer directly connected to the bump conductor; and a first insulating layer having an opening portion through which the first wiring layer is exposed and disposed to cover the first wiring layer. The first wiring layer and the first insulating layer are not opposed to the electronic component in a thickness direction of the electronic component device.


Patent
SHINKO Electrical INDUSTRIES CO. and Shinshu University | Date: 2016-08-31

A heat transfer device includes a base material and a composite plating layer formed on the base material, wherein the composite plating layer includes metal and graphene particles dispersed in the metal.


Patent
SHINKO Electrical INDUSTRIES CO. | Date: 2016-08-04

A wiring board includes: an insulating layer; and a wiring layer including: an upper surface; a lower surface opposite to the upper surface; and a side surface between the upper surface and the lower surface, wherein the upper surface of the wiring layer is exposed from the insulating layer, and the side surface and the lower surface of the wiring layer are embedded in the insulating layer. A recess portion is formed in an outer edge portion of the upper surface of the wiring layer; and the recess portion is filled with the insulating layer.


Patent
SHINKO Electrical INDUSTRIES CO. | Date: 2016-07-28

A lead frame includes a dam bar and leads connected by the dam bar. Each lead includes an inner lead, which is located at one side of the dam bar, and an outer lead, which is located at the other side of the dam bar and formed integrally with the inner lead. Each inner lead includes a basal portion located at a side closer to the dam bar, a distal portion located at the opposite side of the basal portion, and an intermediate portion connecting the distal and basal portions and having a width that differs from the distal portion. A plating layer covers an upper surface and a side surface of the distal portion and at least part of a side surface of the intermediate portion. Side surfaces of the basal portion and the dam bar are entirely located outside the plating layer.


Patent
SHINKO Electrical INDUSTRIES CO. | Date: 2016-08-26

An electrostatic chuck device includes a base plate, an electrostatic chuck plate coupled to an upper surface of the base plate and including a mount region on which an attraction subject is mounted, an electrostatic electrode embedded in the chuck plate, a focus ring that is located on the upper surface of the base plate and covers an outer side surface and a portion of an upper surface of the chuck plate. A groove is located in the upper surface of the chuck plate at a portion that corresponds to a region between the focus ring and the mount region in a plan view. The groove is filled with a protective layer. The groove is located at a position separated from the electrostatic electrode in a plan view. The protective layer is formed from a material having a higher plasma resistance than a material forming the chuck plate.


Patent
SHINKO Electrical INDUSTRIES CO. | Date: 2016-07-06

A packaging structure includes a first substrate including a first metal terminal and a first protruding resin portion formed at a first surface; a second substrate including a second metal terminal and a second protruding resin portion formed at a second surface, the second metal terminal being made of the same kind of metal as the first metal terminal; and a sealing portion filled between the first surface of the first substrate and the second surface of the second substrate, the first metal terminal and the second metal terminal being directly bonded with each other, the first protruding resin portion and the second protruding resin portion being directly bonded with each other, each of the first protruding resin portion and the second protruding resin portion being made of a resin material that does not include fillers, and the sealing portion being made of a resin material including fillers.


An electronic part embedded substrate is disclosed. The electronic part embedded substrate includes a first substrate, a second substrate, an electronic part, an electrically connecting member, and a sealing member. A method of producing an electronic part embedded substrate is also disclosed. The method includes mounting an electronic part onto a first substrate, laminating a second substrate on the first substrate through an electrically connecting member; and filling a space between the first substrate and the second substrate with a sealing member to seal the electronic part.


Patent
SHINKO Electrical INDUSTRIES CO. | Date: 2016-06-15

A wiring substrate includes a first reinforcement pattern stacked on a lower surface of a first insulation layer at a peripheral region located at an outer side of a wiring formation region. A first reinforcement via extends through a second insulation layer in the thickness-wise direction and contacts the first reinforcement pattern. A second reinforcement pattern is stacked on a lower surface of the second insulation layer and connected to the first reinforcement pattern by the first reinforcement via. The first reinforcement via includes a top that partially extends into the first insulation layer.


Patent
SHINKO Electrical INDUSTRIES CO. | Date: 2016-06-23

A semiconductor device includes a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip in a stacking direction. The first semiconductor chip includes a through electrode and a pad on an end face of the through electrode, facing toward the second semiconductor chip. The second semiconductor chip includes a connection terminal at a surface thereof facing toward the first semiconductor chip. The end face of the through electrode and a surface of the connection terminal, facing toward the first semiconductor chip, do not overlap each other when viewed in the stacking direction. The pad and the connection terminal are electrically connected by a bonding part.

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