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Patent
SHINKO Electrical INDUSTRIES CO. | Date: 2016-10-04

A wiring substrate includes a first connection terminal and a protective insulation layer. The first connection terminal is electrically connected to a wiring layer by a via wiring and projects upward from an upper surface of an insulation layer. The protective insulation layer is located on the upper surface of the insulation layer to contact and cover a portion of a side surface of the first connection terminal. The first connection terminal includes a lower portion that is continuous with the via wiring and an upper portion that is continuous with the lower portion. The lower portion is smaller in crystal grain size than the upper portion. The lower portion and the upper portion are formed from the same metal material. The side surface of the lower portion has a higher roughness degree than the side surface of the upper portion.


Patent
SHINKO Electrical INDUSTRIES CO. | Date: 2016-10-11

A semiconductor device includes a leadframe, a semiconductor chip, and an encapsulation resin encapsulating the leadframe and the semiconductor chip. The leadframe includes a first surface and a second surface facing away from the first surface. The semiconductor chip is mounted on the first surface of the leadframe. A part of the second surface of the leadframe is depressed toward the first surface to foam a step surface. The step surface includes an uneven surface part where depressions are formed, and is covered with the encapsulation resin.


Patent
SHINKO Electrical INDUSTRIES CO. | Date: 2016-10-11

A semiconductor device includes a leadframe, a semiconductor chip mounted on the leadframe, and an encapsulation resin covering the leadframe and the semiconductor chip. The leadframe includes a terminal having a pillar shape. The terminal includes a first end surface, a second end surface facing away from the first end surface, and a side surface extending vertically between the first end surface and the second end surface. The side surface is stepped to form a step surface facing away from the second end surface and having an uneven surface part formed therein. A first portion of the terminal extending from the first end surface toward the second end surface and including the step surface is covered with the encapsulation resin. A second portion of the terminal extending from the first portion to the second end surface projects from the encapsulation resin.


Patent
SHINKO Electrical INDUSTRIES CO. | Date: 2016-10-19

A wiring substrate is provided with a wiring pattern including a pad and a circuit pattern. The pad is formed in a mounting region where an electronic component is mounted, and the circuit pattern extends in a planar direction from the pad. An insulation layer covers a lower surface of the wiring pattern and a side surface of the wiring pattern and partially exposes an upper surface of the wiring pattern. The insulation layer includes a covering portion that continuously covers an entire peripheral portion of the upper surface of the wiring pattern. The insulation layer includes an upper surface located upward from the upper surface of the wiring pattern.


Patent
SHINKO Electrical INDUSTRIES CO. | Date: 2016-08-23

A wiring board includes an insulating layer, a first wiring layer, and a second wiring layer. The first wiring layer is formed in a first surface of the insulating layer, and includes a pad on which a semiconductor chip is to be mounted and a wiring pattern. The second wiring layer is formed on a second surface of the insulating layer opposite to the first surface. The roughness of a surface of the first wiring layer exposed at the first surface of the insulating layer is smaller than the roughness of a surface of the second wiring layer exposed on the second surface of the insulating layer.


Patent
SHINKO Electrical INDUSTRIES CO. | Date: 2016-11-03

A wiring substrate including an insulation layer, a connection terminal projecting from an upper surface of the insulation layer, a protective insulation layer formed on the upper surface of the insulation layer covering a lower side surface of the connection terminal, and a cover layer covering an upper side surface and an upper surface of the connection terminal exposed from the protective insulation layer. The protective insulation layer includes an upper surface defining a protrusion bulged upward around the connection terminal. The protrusion includes a peak, a first slope inclined downward from the peak and extending toward the connection terminal, and a second slope inclined downward from the peak and extending away from the connection terminal. The cover layer further covers the first slope, the peak, and a part of the second slope.


Patent
SHINKO Electrical INDUSTRIES CO. | Date: 2016-10-20

A wiring substrate includes first through holes extending through an insulation layer, first via wirings formed in the first through holes, a conductive pattern connected to the first via wirings, recesses formed in the first via wirings, and a protective insulation layer covering the conductive pattern and the first via wirings. The first via wirings, the conductive pattern, the recesses, and the protective insulation layer form an identification mark identifiable as a particular shape including a character or a symbol. Each recess is defined by an upper surface of the corresponding first via wiring and includes a curved side wall and a bottom wall that is located at a lower position than an upper surface of the conductive pattern. The protective insulation layer is thicker over the first via wirings than over the conductive pattern.


Patent
SHINKO Electrical INDUSTRIES CO. and Japan Electronic Materials Corporation | Date: 2016-11-21

A probe guide plate includes: a silicon substrate including one surface and the other surface opposite to the one surface; a through hole formed through the silicon substrate to extend from the one surface of the silicon substrate to the other surface of the silicon substrate; a silicon oxide layer formed on the one surface of the silicon substrate, the other surface of the silicon substrate, and an inner wall surface of the through hole; and a protective insulating layer formed on the silicon oxide layer. The protective insulating layer is formed on at least one of the one surface and the other surface of the silicon substrate via the silicon oxide layer, and partially formed on the inner wall surface of the through hole via the silicon oxide layer.


Patent
SHINKO Electrical INDUSTRIES CO. | Date: 2016-11-18

A wiring substrate includes a first insulation layer covering a first wiring layer, a wiring pattern formed on an upper surface of the first insulation layer, and a via formed in a via hole of the first insulation layer to electrically connect the wiring pattern and the first wiring layer. The via includes a via seed layer and a filled portion filling the via hole. The wiring pattern includes a wiring seed layer formed on the upper surface of the first insulation layer and a pattern layer formed on the wiring seed layer. The via seed layer is formed from a metal acting to adsorb a plating enhancement agent, which enhances formation of the filled portion and the pattern layer in an electrolytic plating solution. The wiring seed layer is formed from a metal not acting to adsorb the plating enhancement agent as compared to the via seed layer.


Patent
SHINKO Electrical INDUSTRIES CO. and Nihon Kohden | Date: 2016-10-31

An adhesive plaster module which has an adhesive layer for adhering to an object includes a substrate having the adhesive layer, a switch mounted on a same side of the substrate as the adhesive layer, a battery mounted on an opposite side of the substrate from the adhesive layer, and an electronic component mounted on the opposite side of the substrate from the adhesive layer, and configured to operate with power supplied from the battery upon the switch becoming conductive, wherein the switch is configured to be nonconductive while the adhesive layer is not attached to the object, and configured to become conductive in response to attaching the adhesive layer to the object.

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