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Patent
Shindengen Electric Manufacturing | Date: 2017-04-05

Provided is a power conversion device that can suppress a surge to be generated when a load, such as a battery, is disconnected from an output of an AC generator. A rectifier circuit connected between an output portion of the AC generator and a first load rectifies the output of the AC generator and supplies the rectified output to the first load. A switch circuit connected between the output portion of the AC generator and the second load rectifies the output of the AC generator and supplies the rectified output to the second load, on condition that a drive signal is in a first signal state indicating permission of a power supply from the AC generator to the second load. Additionally, the switch circuit transitions from a conductive state to a non-conductive state in response to the output of the AC generator, on condition that the drive signal is in a second signal state indicating prohibition of the power supply from the AC generator to the second load. A driver circuit generates the drive signal and supplies the generated drive signal to a control terminal of the switch circuit.


Patent
Shindengen Electric Manufacturing | Date: 2016-10-26

A controlling part of an LED driver circuit controls a first switch element with a first on-duty ratio if a first terminal voltage is lower than a preset first upper limit value, controls the first switch element with a second on-duty ratio smaller than the first on-duty ratio if the first terminal voltage reaches the first upper limit value, controls a second switch element with a third on-duty ratio if a second terminal voltage is lower than a preset second upper limit value, and controls the second switch element with a fourth on-duty ratio smaller than the third on-duty ratio if the second terminal voltage reaches the second upper limit value.


Patent
Shindengen Electric Manufacturing | Date: 2016-10-05

A storage (80) stores a first drooping characteristic of a rated current Ioc1, and a second drooping characteristic of an allowable current value Ico2 that is greater than the rated current value Ioc1. A controller (70) is configured to select a drooping characteristic stored in the storage (80) in accordance with the current value detected by an output current detector (50) and a mask condition, and perform droop control.


Patent
Shindengen Electric Manufacturing | Date: 2016-12-14

Semiconductor module (100) has a first member (10), a second member (20), a conductor column (31) extending in the vertical direction between the first member (10) and the second member (20) and a sealing resin (80) covering a first conductor layer (12) and a first power device (13) of the first member (10), a second conductor layer (22) and a second power device (23) of the second member (20) and the conductor column (31). Positions of the first power device (13) and the second power device (23) on the horizontal plane are shifted, the second conductor layer (22) is not provided in the vertical direction from a first connection part (46) connected to the first power device (13), and the first conductor layer (12) is not provided in the vertical direction from a second connection part (56), connected to the second power device (23), of the second power device (23).


Patent
Shindengen Electric Manufacturing | Date: 2016-02-10

An ignition control apparatus (100) according to one embodiment of the present invention is an ignition control apparatus which generates, in an ignition coil, a voltage to be supplied to a spark plug that is provided in an internal combustion engine on the basis of a pulse signal induced in the ignition coil of the internal combustion engine, wherein the ignition control apparatus comprises at least a switch element (160) for passing current through and discharge the ignition coil, and a controlling unit (140) that acquires the timing for discharge the ignition coil in response to a first pulse of the pulse signal, and controls the switch element so that a current flows through the ignition coil in response to a second pulse that follows the first pulse and the ignition coil is opened on the basis of the discharge timing acquired in response to the first pulse.


Patent
Shindengen Electric Manufacturing | Date: 2016-04-20

A method of manufacturing a semiconductor device includes the steps of: forming a semiconductor layer on a first main surface of a semiconductor substrate made of crystals having a wide band gap; forming lattice defects on a second main surface on a side opposite to the first main surface of the semiconductor substrate; and emitting a laser beam having a longer wavelength than an absorption edge wavelength which is a wavelength of a light having the lowest energy which the crystals absorb, to a lower surface of the semiconductor substrate after the step of forming the lattice defects; and forming an electrode on the second main surface of the semiconductor substrate after the step of emitting the laser beam.


Provided is a glass composition for protecting a semiconductor junction for forming a glass layer which protects a pn junction, wherein the glass composition for protecting a semiconductor junction is made of fine glass particles prepared from a material in a molten state obtained by melting a glass raw material which contains at least ZnO, SiO_(2), B_(2)O_(3), Al_(2)O_(3) and at least two oxides of alkaline earth metals selected from a group consisting of BaO, CaO and MgO and substantially contains none of Pb, As, Sb, Li, Na and K, the glass composition for protecting a semiconductor junction containing no filler. According to the present invention, it is possible to manufacture a semiconductor device having high reliability using a glass material containing no lead. Further, a baking temperature at which a layer made of the glass composition for protecting a semiconductor junction is baked can be set further lower than a baking temperature at which a layer made of a conventional glass material containing lead silicate as a main component is baked so that a semiconductor device having an excellent switching characteristic can be manufactured.


Provided is a glass composition for protecting a semiconductor junction which contains at least SiC_(2), B_(2)O_(3), Al_(2)O_(3), ZnO and at least two oxides of alkaline earth metals selected from a group consisting of CaO, MgO and BaO, and substantially contains none of Pb, As, Sb, Li, Na and K, wherein an average linear expansion coefficient within a temperature range of 50 C. to 550 C. falls within a range of 3.3310^(6 )to 4.1310^(6). A semiconductor device having high breakdown strength can be manufactured using such a glass material containing no lead in the same manner as a conventional case where a glass material containing lead silicate as a main component is used.


Patent
Shindengen Electric Manufacturing | Date: 2016-10-12

A lead frame includes one metal plate 10 having a terminal 15, and the other metal plate 50 joined to the one metal plate 10, on which a mounted component 91 is placed. The one metal plate 10 includes a first connection portion 11 connected to the terminal 15, a first extension portion 12 disposed on one end of the first connection portion 11, and a second extension portion 13 disposed on the other end of the first connection portion 11. The other metal plate 50 includes a pair of first clamping portions 62 configured to clamp the first extension portion 12, and a pair of second clamping portions 63 configured to clamp the second extension portion 13. Each of the pair of first clamping portions 62 is pressed to be extended by a mold, which is used for sealing the mounted component with a resin, so that gaps G between the first extension portion 12 and the clamping portions 62 are filled. Each portion of the pair of second clamping portions 63 is pressed to be extended by the mold, so that gaps G between the second extension portion 13 and the second clamping portions 63 are filled.


Patent
Shindengen Electric Manufacturing and Honda Corporation | Date: 2016-03-23

An LED lamp lighting device is connected between a first power supply terminal on a low potential side of a lamp driving power supply and a second power supply terminal on a high potential side of the lamp driving power supply, receives a driving current from the lamp driving power supply, and causes the driving current to illuminate a plurality of LED lamps connected in series.

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