Fukui, Japan

Shin-Etsu Chemical Co., Ltd. is the largest chemical company in Japan, ranked No. 9 in Forbes Global 2000 for chemical sector. Shin-Etsu has the largest global market share for polyvinyl chloride, semiconductor silicon, and photomask substrates.The company was named one of Thomson Reuters Top 100 Global Innovators in 2011, 2012, 2013 and 2014.“Shin-Etsu” in the company's name derives from Shin'etsu Region, where the company established the first chemical plant as Shin-Etsu Nitrogen Fertilizer in 1926, though the company today is headquartered in Tokyo and has its manufacturing locations in 14 countries worldwide. Wikipedia.


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Patent
Shin - Etsu Chemical Co. | Date: 2016-10-26

The present invention provides a silicone compound shown by the formula (1) and having a weight-average molecular weight in the range of 500 to 200,000, R^(1)_(a)R^(2)_(b)R^(3)_(c)R^(4)_(d)SiO_((4-a-b-c-d)/2 )(1), wherein R^(1 )represents the same or different organic group, R^(2 )represents a polyoxyalkylene group shown by C_(m)H_(2m)O(C_(2)H_(4)O)_(g)(C_(3)H_(6)O)_(h)R^(6), R^(3 )represents a branched type monovalent organosiloxane group shown by the following general formula (4), M_(o)M^(R)_(p)D_(q)D^(R)_(r)T_(s)T^(R)_(t)Q_(u )(4), and R^(4 )represents a monovalent organosiloxane group shown by the following general formula (5) or the general formula (6), MM^(R)D_(v-1 )(5), M_(w)D_(v-1)D^(R)_(v-2)T^(R)_(v-3 )(6). This provides a silicone compound which has excellent emulsification ability and emulsion stability to silicone oil, and can secure high temporal stability.


Patent
Shin - Etsu Chemical Co. | Date: 2017-01-26

A photo-curable composition having superior curability at room temperature and storage stability, and also offer a rubber-like cured product thereof having a good profile of properties including heat resistance, low-temperature performance, chemical resistance, solvent resistance and oil resistance. Specifically, A photo-curable composition which includes (A) 100 parts by mass of a linear polyfluoro compound having at least two alkenyl groups in a molecule and a linear perfluoropolyether structure in a backbone of the molecule, (B) a fluorine-containing organohydrogenpolysiloxane having at least two hydrogens bonded to a silicon atom in a molecule, and (C) 0.1 to 500 ppm of a photoactive hydrosililation catalyst relative to the mass of component (A) in terms of metal atom, wherein an amount of component (B) is 0.5 to 3.0 mol of SiH groups in component (B) relative to 1.0 mol of alkenyl groups in component (A).


Patent
Shin - Etsu Chemical Co. | Date: 2017-05-17

First, at least one of silanol and a siloxane compound is generated in a chlorosilane (S101). In the step, for example, an inert gas having a moisture concentration of 0.5 to 2.5 ppm is brought into contact with the chlorosilane to dissolve the moisture, and at least one of silanol and a siloxane compound is generated through a hydration reaction of a moiety of the chlorosilane. Next, a boron-containing compound contained in the chlorosilane is reacted with the silanol or the siloxane compound, thereby converting the boron-containing compound to a boron oxide (S102). Through the step (S102), the boron-containing compound being a low boiling point compound is converted to a boron oxide being a high boiling point compound, and therefore the difference in boiling point from the boiling point of chlorosilane becomes larger to make later separation easy.


Patent
Shin - Etsu Chemical Co. | Date: 2017-05-17

A monomer of formula (1a) or (1b) is provided wherein A is a polymerizable group, R^(1)-R^(6) are monovalent hydrocarbon groups, X^(1) is a divalent hydrocarbon group, Z^(1) is an aliphatic group, Z^(2) forms an alicyclic group, k = 0 or 1, m = 1 or 2, n = 1 to 4. A useful polymer is obtained by polymerizing the monomer. A resist composition comprising the polymer has improved development properties and is processed to form a negative pattern having high contrast, high resolution and etch resistance which is insoluble in alkaline developer.


Patent
Shin - Etsu Chemical Co. | Date: 2017-05-17

The present invention provides a silicone compound shown by the formula (1) and having a weight-average molecular weight in the range of 500 to 200,000, R^(1)_(a)R^(2)_(b)R^(3)_(c)R^(4)_(d)SiO_((4-a-b-c-d)/2) (1), wherein R^(1) represents the same or different organic group, R^(2) represents a polyoxyalkylene group shown by -C_(m)H_(2m)-O-(C_(2)H_(4)O)_(g)(C_(3)H_(6)O)_(h)R^(6), R^(3) represents a branched type monovalent organosiloxane group shown by the following general formula (4), M_(o)M^(R)_(p)D_(q)D^(R)_(r)T_(s)T^(R)_(t)Q_(u) (4), and R^(4) represents a monovalent organosiloxane group shown by the following general formula (5) or the general formula (6), MM^(R)D_(v-i) (5), M_(w)D_(v-1)DR_(v-2)T^(R)_(v-3) (6). This provides a silicone compound which has excellent emulsification ability and emulsion stability to silicone oil, and can secure high temporal stability.


The present invention is a negative electrode material for a non-aqueous electrolyte secondary battery, including negative electrode active material particles containing a silicon compound expressed by SiO_(x) where 0.5x1.6, the silicon compound being coated with a carbon coating layer composed of a carbon component, wherein the negative electrode active material particles contain a SiO_(2) component having a tridymite structure and exhibit a diffraction peak around 21.825 with a half width (2) of 0.15 or less in X-ray diffraction. This negative electrode material for a non-aqueous electrolyte secondary battery can increase the battery capacity and improve the cycle performance and the initial charge and discharge performance.


Patent
Shin - Etsu Chemical Co. | Date: 2017-05-24

The present invention provides technology for realizing higher purification of a polycrystalline silicon. First, trichlorosilane is prepared as a sample (S101) and then the carbon-containing impurities content in the trichlorosilane is analyzed by GC/MS-SIM method (S102). The quality of the trichlorosilane is determined based on the analysis results (S103) and the trichlorosilane determined to be a good material (S103:Yes) is used as the raw material for producing a high-purity polycrystalline silicon by CVD method (104). In case, the trichlorosilane determined to be a bad material (S103: No) is not used as the raw material for producing a polycrystalline silicon. When the impurities analysis by GC/MS-SIM method is performed using, as a separation column, a column having a non-polar column and a medium-polar column connected in series with each other, it is possible to simultaneously perform both of the separation of chlorosilanes and hydrocarbons and the separation of chlorosilanes and methylsilanes.


Patent
Exatec LLC. and Shin - Etsu Chemical Co. | Date: 2017-04-19

An organic resin laminate comprising an organic resin substrate and a multilayer coating system on a surface of the substrate is provided. The multilayer coating system can include a plasma layer which is a dry hard coating obtained from plasma polymerization of an organosilicon compound, and an intermediate layer (II) on the substrate which is a cured coating of a wet coating composition comprising (A) a specific reactive UV absorber, (B) a multi-functional (meth)acrylate, and (C) a photopolymerization initiator. (B) a multifunctional (meth)acrylate, and (C) a photopolymerization initiator. The laminate has a high level of abrasion resistance and improved adhesion and weather resistance.


Patent
Shin - Etsu Chemical Co. | Date: 2017-05-31

The present invention is a wafer processing laminate comprising a support, a temporary adhesive material layer laminated on the support, and a wafer stacked on the temporary adhesive material layer, the wafer having a front surface on which a circuit is formed and a back surface to be processed, the temporary adhesive material layer comprising a first temporary adhesive layer composed of a thermoplastic resin layer (A) laminated on the front surface of the wafer and a second temporary adhesive layer composed of a thermosetting resin layer (B) laminated on the first temporary adhesive layer, the thermoplastic resin layer (A) being soluble in a cleaning liquid (D) after processing the wafer, the thermosetting resin layer (B) being insoluble in the cleaning liquid (D) after heat curing and capable of absorbing the cleaning liquid (D) such that the cleaning liquid (D) permeates into the layer (B). This wafer processing laminate allows a wide selection of materials, facilitates separation and collection of a processed wafer, meets requirements on various processes, and can increase productivity of thin wafers.


Patent
Shin - Etsu Chemical Co. | Date: 2017-05-31

A wafer laminate has an adhesive layer (3) sandwiched between a transparent substrate (1) and a wafer (2), with a circuit forming surface of the wafer facing the adhesive layer. The adhesive layer (3) includes a first cured resin layer (3a) disposed adjacent the substrate and having light-shielding properties and a second cured resin layer (3b) disposed adjacent the wafer and comprising a cured product of a thermosetting resin composition.

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